| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/05/2008 | US7326858 Printed circuit board with embedded capacitors and manufacturing method thereof |
| 02/05/2008 | US7326856 Multi-layer wiring board |
| 02/05/2008 | US7326649 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same |
| 02/05/2008 | US7326637 Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
| 02/05/2008 | US7326585 Forming process of thin film pattern and manufacturing process of device, electro-optical apparatus and electronic apparatus |
| 02/05/2008 | US7326463 Conductive circuits or cables manufactured from conductive loaded resin-based materials |
| 02/05/2008 | US7326460 Device, method of manufacturing the same, electro-optic device, and electronic equipment |
| 02/05/2008 | US7326446 Method for coating metal surfaces and substrate having a coated metal surface |
| 02/05/2008 | US7326316 anisotropic electroconductive connections using epoxy resins comprising particles having breakable dielectric coatings; semiconductor dies, chips or packages |
| 02/05/2008 | US7326310 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet |
| 02/05/2008 | US7326066 Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
| 02/05/2008 | US7326061 Via providing multiple electrically conductive paths |
| 02/05/2008 | US7325974 Pulley rotation support apparatus |
| 02/05/2008 | US7325714 Solder heating system |
| 02/05/2008 | US7325593 Radiating fin and radiating method using the radiating fin |
| 02/05/2008 | US7325301 Method of manufacturing a wiring board |
| 02/05/2008 | US7325300 Method of manufacturing printed wiring boards |
| 02/05/2008 | US7325299 Method of making a circuitized substrate |
| 02/05/2008 | US7325294 Method of making electromagnetic wave shielded write and read wires on a support for a magnetic media drive |
| 02/05/2008 | CA2346914C Apparatus and method for the visual inspection of concealed soldered joints |
| 02/05/2008 | CA2221961C Epoxy-based, voc-free soldering flux |
| 01/31/2008 | WO2008014392A2 Circuit module |
| 01/31/2008 | WO2008013188A1 Inspecting method, inspection treating system, treating device, inspecting device, manufacturing/inspecting device, and manufacturing/inspecting method |
| 01/31/2008 | WO2008013070A1 Flexible printed board, electronic device mounted with this, and flexible printed board folding method |
| 01/31/2008 | WO2008013054A1 Interposer and electronic device using the same |
| 01/31/2008 | WO2008013002A1 Dispersion conatining metal fine particles, process for production of the dispersion, and articles having metal films |
| 01/31/2008 | WO2008012973A1 Method of forming conductor pattern, process for producing resin substrate with use of the method, and resin substrate |
| 01/31/2008 | WO2008012940A1 Release film for manufacture of printed wiring plate |
| 01/31/2008 | WO2008012886A1 Structure for connecting circuit boards, method for connecting circuit boards and electronic apparatus |
| 01/31/2008 | WO2008012512A2 The formation of conductive metal regions on substrates |
| 01/31/2008 | WO2008012351A1 Method of producing a film-type sensor |
| 01/31/2008 | WO2008012165A2 Method and wave soldering system for soldering components onto the top and bottom surface of a circuit board |
| 01/31/2008 | WO2008011870A1 Method of, and apparatus for, the accelerated wet-chemical treatment of surfaces |
| 01/31/2008 | US20080027525 Electrode Structure |
| 01/31/2008 | US20080026602 Printed Circuit Board With Improved Via Design |
| 01/31/2008 | US20080026593 Method and Apparatus for the Manufacture of Electric Circuits |
| 01/31/2008 | US20080026592 Multilayer substrate |
| 01/31/2008 | US20080026559 Solder Ball Pad Structure |
| 01/31/2008 | US20080026557 Electronic system modules and method of fabrication |
| 01/31/2008 | US20080026240 Solder, and Mounted Components Using the Same |
| 01/31/2008 | US20080026187 Method of fabricating an electrical connecting element, and an electrical connecting element |
| 01/31/2008 | US20080025023 Light-emitting heat-dissipating device and manufacturing method thereof |
| 01/31/2008 | US20080024960 Electronic Component |
| 01/31/2008 | US20080024424 Liquid Crystal Display Device |
| 01/31/2008 | US20080024155 High density cantilevered probe for electronic devices |
| 01/31/2008 | US20080024154 High density cantilevered probe for electronic devices |
| 01/31/2008 | US20080023853 Flip chip adaptor package for bare die |
| 01/31/2008 | US20080023841 Mounting board, method for manufacturing mounting board, and semiconductor module |
| 01/31/2008 | US20080023834 Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate Electronic Circuit Board |
| 01/31/2008 | US20080023817 Component packaging apparatus, systems, and methods |
| 01/31/2008 | US20080023815 Interlayer dielectric layer for printed wiring board, printed wiring board, and method of producing the same |
| 01/31/2008 | US20080023528 Fabrication method and structure of pcb assembly, and tool for assembly thereof |
| 01/31/2008 | US20080023220 Plating buss and a method of use thereof |
| 01/31/2008 | US20080022523 Method of Forming a Printed Circuit Board With Improved Via Design |
| 01/31/2008 | US20080022522 Manufacturing method for electrical connector |
| 01/31/2008 | US20080022520 Method of making multilayered circuitized substrate assembly |
| 01/31/2008 | US20080022519 Electronic package with optimized lamination process |
| 01/31/2008 | US20080022518 Circuit board and method for manufacturing the same |
| 01/31/2008 | US20080022517 Rolled electroactive polymers |
| 01/31/2008 | DE19961842B4 Mehrschichtleiterplatte Multi-layer printed circuit board |
| 01/31/2008 | DE102006059046A1 Wet treatment of substrates, e.g. circuit boards, uses spray of treating agent in direction of transport of substrate, perforated interrupter plate being used so that spray only contacts substrate intermittently |
| 01/31/2008 | DE102006035528A1 Verfahren und Wellenlötanlage zum Löten von Bauteilen auf Ober- und Unterseite einer Leiterplatte And wave soldering method for soldering components on the top and underside of a printed circuit board |
| 01/31/2008 | DE102006034480A1 Printed circuit board material for use as raw material for printed circuit board production, has carrier of plastic composite material, conductor surface of electrically conducting material and thermoplastic dielectric layer |
| 01/31/2008 | DE102006033478A1 Leiterträgervorrichtung und Anordnung der Leiterträgervorrichtung Ladder support device and arrangement of the conductor support device |
| 01/30/2008 | EP1883282A2 Electronic apparatus |
| 01/30/2008 | EP1754399B1 Method for producing transverse connections in printed circuit board sets |
| 01/30/2008 | CN201015242Y Circuit board-thin board magnetic clip mechanism |
| 01/30/2008 | CN101116383A Method for connecting printed circuit board |
| 01/30/2008 | CN101116382A Ceramic multilayer board and method for manufacturing same |
| 01/30/2008 | CN101116381A Surface mount electric part |
| 01/30/2008 | CN101116035A Photosensitive composition, method for forming pattern, and permanent pattern |
| 01/30/2008 | CN101115865A Method for depositing palladium layers and palladium bath therefor |
| 01/30/2008 | CN101115358A Flexible circuit board pattern plating method and pattern plating negative plate |
| 01/30/2008 | CN101115357A Counter-current welding equipment and welding flux reclaiming device |
| 01/30/2008 | CN101115356A Flexible circuit plate and welding method therefor |
| 01/30/2008 | CN101115355A Method for tool machine to drill slotted hole of circuit board |
| 01/30/2008 | CN101115354A Moulding circuit board and manufacturing method therefor |
| 01/30/2008 | CN101115353A Multilayered printed wiring board and method for manufacturing the same |
| 01/30/2008 | CN101115352A Multilayered printed wiring board and method for manufacturing the same |
| 01/30/2008 | CN101115347A Printing distributing board and method for manufacturing same |
| 01/30/2008 | CN101114732A Electronic device and manufacturing method thereof |
| 01/30/2008 | CN101114121A Method for forming pattern, and method for manufacturing liquid crystal display |
| 01/30/2008 | CN101113522A Spraying device for printed circuit board etching |
| 01/30/2008 | CN101113388A Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| 01/30/2008 | CN101112700A Viscous material noncontact jetting system |
| 01/30/2008 | CN100366136C Radiating fin and radiating method using the radiating fin |
| 01/30/2008 | CN100366133C Method and device for conducting PCB ink plugging using scraper |
| 01/30/2008 | CN100366132C A method of forming an opening or cavity in a substrate for receiving an electronic component |
| 01/30/2008 | CN100366131C Method for applying gluewater on circuit board carrier and circuit board manufactured according to this method |
| 01/30/2008 | CN100366130C Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 01/30/2008 | CN100365805C Soldered heat sink anchor and method of use |
| 01/30/2008 | CN100365784C Electronic circuit device and its manufacturing method and device |
| 01/30/2008 | CN100365751C Control unit with thermal protection and an electrical heating device comprising the control unit |
| 01/30/2008 | CN100365653C Method for the production of electrically-conducting connections on chipcards |
| 01/30/2008 | CN100365508C Photosensitive resin composltion, photo sensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon |
| 01/29/2008 | US7323770 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 01/29/2008 | US7323642 Thin printed circuit board for manufacturing chip scale package |
| 01/29/2008 | US7323641 Wired circuit board holding sheet and production method thereof |
| 01/29/2008 | US7323365 Semiconductor device manufacturing method and manufacturing apparatus |
| 01/29/2008 | US7323245 Electric connecting part |