| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/13/2008 | CN101123846A Blind hole structure of printed circuit board and its manufacturing method |
| 02/13/2008 | CN101123168A Thin film peel-off device |
| 02/13/2008 | CN101122750A Exposure device |
| 02/13/2008 | CN101122569A Method of setting reference data for inspection of solder fillets and substrate outer appearance inspection device |
| 02/13/2008 | CN100369536C Method and apparatus for fabricating circuit board, with three dimensional surface mounted array of semiconductor chips |
| 02/13/2008 | CN100369533C Wire soldering method for circuit board package |
| 02/13/2008 | CN100369532C Module and method of manufacturing module |
| 02/13/2008 | CN100369530C Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 02/13/2008 | CN100369329C Anisotropic electrically conductive film and method of producing the same |
| 02/13/2008 | CN100369211C Semiconductor polishing compound, process for its production and polishing method |
| 02/13/2008 | CN100368881C Base plate location platform |
| 02/13/2008 | CN100368869C Electrooptical device,flexible wiring substrate,manufacturing method of electrooptical device and electronic device |
| 02/13/2008 | CN100368766C Amplifying camera equipment and metering checkout equipment |
| 02/13/2008 | CN100368762C Conductor inspecting device and conductor inspecting method |
| 02/13/2008 | CN100368340C Non-lead glass for forming dielectric, glass ceramic composition for forming dielectric, dielectric, and process for producing laminated dielectric |
| 02/12/2008 | US7330773 Multiple insertion head |
| 02/12/2008 | US7330612 Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly |
| 02/12/2008 | US7330357 Integrated circuit die/package interconnect |
| 02/12/2008 | US7330347 Capacitor |
| 02/12/2008 | US7330099 Chip resistor and manufacturing method therefor |
| 02/12/2008 | US7330036 Engagement Probes |
| 02/12/2008 | US7329957 Circuit device and manufacturing method thereof |
| 02/12/2008 | US7329945 Flip-chip adaptor package for bare die |
| 02/12/2008 | US7329943 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 02/12/2008 | US7329831 Laser trimming of resistors |
| 02/12/2008 | US7329816 Electronic package with optimized lamination process |
| 02/12/2008 | US7329458 Wiring member and method of manufacturing the same |
| 02/12/2008 | US7329446 Drill stack formation |
| 02/12/2008 | US7328506 Method for forming a plated microvia interconnect |
| 02/12/2008 | US7328505 Method for manufacturing multilayer circuit board |
| 02/12/2008 | US7328504 Method for manufacturing circuit board with built-in electronic components |
| 02/07/2008 | WO2008016437A2 Methods and apparatus for efficiently generating profiles for circuit board work/rework |
| 02/07/2008 | WO2008016140A1 Bonding material, bonded portion and circuit board |
| 02/07/2008 | WO2008016128A1 Production method of soldier circuit board |
| 02/07/2008 | WO2008015989A1 Printed wiring board |
| 02/07/2008 | WO2008015983A1 Photosensitive resin composition and laminate |
| 02/07/2008 | WO2008015853A1 Semiconductor device, and process and apparatus for manufacturing of electronic circuit |
| 02/07/2008 | WO2008015852A1 Adhesive composition, and connection structure for circuit member |
| 02/07/2008 | WO2008015731A1 Soldering method and apparatus for mounting component on printed wiring board |
| 02/07/2008 | WO2008015201A1 Method for producing structured electrically conductive surfaces |
| 02/07/2008 | WO2007143527A3 Rfid tags and antennas and methods of their manufacture |
| 02/07/2008 | WO2007074567A8 Optical and electrical composite wiring board and method for fabricating same |
| 02/07/2008 | US20080032524 High Density Connector and Method of Manufacture |
| 02/07/2008 | US20080032495 Ball transferring method and apparatus |
| 02/07/2008 | US20080032155 Drill stack formation |
| 02/07/2008 | US20080032109 Method for Coating Blanks for the Production of Printed Circuit Boards (Pcb) |
| 02/07/2008 | US20080032103 Multilayer Printed Circuit Board |
| 02/07/2008 | US20080030973 Method for the production of a sensor and sensor |
| 02/07/2008 | US20080030970 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics |
| 02/07/2008 | US20080030215 High density cantilevered probe for electronic devices |
| 02/07/2008 | US20080030130 Hermetic encapsulation of organic, electro-optical elements |
| 02/07/2008 | US20080029945 Universal Insert Support For Holding And Positioning Parts Of Complex Shapes |
| 02/07/2008 | US20080029888 Solder Interconnect Joints For A Semiconductor Package |
| 02/07/2008 | US20080029476 Circuit Board And Manufacturing Method Thereof |
| 02/07/2008 | US20080029296 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
| 02/07/2008 | US20080029295 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
| 02/07/2008 | US20080029294 Multi-Layer Circuit Board And Production Method Thereof |
| 02/07/2008 | US20080028601 Structure for fixing printed circuit board and method of fixing thereof |
| 02/07/2008 | DE102006044241B3 Soldering device for producing selective soldering sites on electronic components comprises a solder guiding tube which slide between a soldering position and a resting position |
| 02/07/2008 | DE102006036728A1 Semiconductor chips contacting method for e.g. printed circuit board layer, involves applying conductive bumps on contact areas, where bumps penetrate one layer formed during connection of metal layer with surface of board layer |
| 02/07/2008 | DE102006036049A1 Electronic module for radiation sensor-component, has electronic components arranged in recess of printed circuit board as installation components such that electronic component do not project over board surface surrounding recess |
| 02/07/2008 | DE102006034600A1 Verfahren zur Herstellung einer Lötverbindung A process for producing a solder joint |
| 02/06/2008 | EP1885168A1 Circuit substrate connection structure and circuit substrate connection method |
| 02/06/2008 | EP1884992A1 Printed wiring board |
| 02/06/2008 | EP1884960A1 Conductive paste and wiring board using it |
| 02/06/2008 | EP1884305A1 Soldering flux application apparatus with an airbrush device ; Method of applying soldering flux to a surface of an object using an airbrush device |
| 02/06/2008 | EP1884150A2 Improved printed circuit board assembly |
| 02/06/2008 | EP1884147A1 Method for forming via hole in substrate for flexible printed circuit board |
| 02/06/2008 | EP1884146A1 A patterned metal layer using thermal transfer |
| 02/06/2008 | EP1883718A2 Method and composition for improving adhesion of organic polymer coatings with copper surface |
| 02/06/2008 | CN201018661Y PCB thickening solder pad of solder reflow resistant digitization electret microphone |
| 02/06/2008 | CN201015913Y Rubber-resisted film for FPC soft board quick-pressing |
| 02/06/2008 | CN201015912Y Rubber-resisted film for FPC soft board conventional pressing |
| 02/06/2008 | CN201015878Y Circuit board cutting mold |
| 02/06/2008 | CN101120623A Manufacturing method of multi-layer circuit board and multi-layer circuit board |
| 02/06/2008 | CN101120622A Member for interconnecting wiring films and method for producing the same |
| 02/06/2008 | CN101120621A Method of forming metallic pattern, metallic pattern and printed wiring board using it and tft wiring circuit |
| 02/06/2008 | CN101120620A Drawing device and calibrating method for drawing device |
| 02/06/2008 | CN101120445A Substrate with built-in chip and method for manufacturing substrate with built-in chip |
| 02/06/2008 | CN101120346A Method for analyzing component mounting board |
| 02/06/2008 | CN101120049A Resin for filling into electronic substrate |
| 02/06/2008 | CN101119614A Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| 02/06/2008 | CN101119613A Method of manufacturing circuit board with heat radiating function |
| 02/06/2008 | CN101117275A Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
| 02/06/2008 | CN101117187A Apparatus and system for roll-to-roll processing |
| 02/06/2008 | CN101117043A Silk screen printing device and image recognition contrapositioning method |
| 02/06/2008 | CN100367834C Process for producing resonant tag and resonant tag |
| 02/06/2008 | CN100367833C Printed circuit board assembly |
| 02/06/2008 | CN100367832C Wiring base board, method of producing thereof, and electronic device |
| 02/06/2008 | CN100367831C Distributing base board, displaying device and method for producing distributing base board |
| 02/06/2008 | CN100367645C Switching power supply |
| 02/06/2008 | CN100367618C Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balan |
| 02/06/2008 | CN100367496C Microelectronic package having a bumpless laminated interconnection layer |
| 02/06/2008 | CN100367491C Intermediate substrate |
| 02/06/2008 | CN100367490C Diaphragm bearing belt for mounting electronic device and its mfg. method |
| 02/06/2008 | CN100366563C Impregnated glass fibre strands and products including same |
| 02/06/2008 | CN100366440C Screen printing method |
| 02/05/2008 | US7327042 Interconnection structure of electric conductive wirings |
| 02/05/2008 | US7327039 Curable thermosetting adhesive |
| 02/05/2008 | US7326907 Wiring substrate and radiation detector using same |