| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/20/2008 | CN101127330A Structure combining IC integration base board and carrier board and its manufacturing method for electronic device |
| 02/20/2008 | CN101127312A Apparatus and method for assembling camera module |
| 02/20/2008 | CN101127310A Making method for circuit board |
| 02/20/2008 | CN101126893A Forming method for protecting image |
| 02/20/2008 | CN101126883A Liquid crystal display device |
| 02/20/2008 | CN101125429A Punching device, metal die of punching, and method of positioning and fixing punching metal die |
| 02/20/2008 | CN101125386A Hot press device and hot press method using the same |
| 02/20/2008 | CN100370889C Positioning structure of welding-free light-emitting diode |
| 02/20/2008 | CN100370888C Engraving machine for wiring board |
| 02/20/2008 | CN100370887C Improved structure of stacked vias in multiple layer electronic device carriers |
| 02/20/2008 | CN100370886C A printed wiring board and production method thereof |
| 02/20/2008 | CN100370603C Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment |
| 02/20/2008 | CN100370602C Board for mounting semiconductor element, method for manufacturing same, and semiconductor device |
| 02/20/2008 | CN100370547C System and method for improving lead wire connection for hard disk driver actuator |
| 02/20/2008 | CN100370348C Flexible electronic device and its manufacturing method |
| 02/20/2008 | CN100370345C Anisotropic conductive material, display device, manufacturing method for the device, and conductive member |
| 02/20/2008 | CN100370225C Circuit board device for information apparatus, multilayered module board, and navigator |
| 02/20/2008 | CN100370058C Method and apparatus for manufacturing a thin film, thin-film laminate, and electronic parts |
| 02/19/2008 | US7333346 Circuit board having test coupon and method for evaluating the circuit board |
| 02/19/2008 | US7333344 Flexible printed circuit board |
| 02/19/2008 | US7333335 Using the wave soldering process to attach motherboard chipset heat sinks |
| 02/19/2008 | US7332922 Method for fabricating a structure for making contact with a device |
| 02/19/2008 | US7332914 Conductor inspection apparatus and conductor inspection method |
| 02/19/2008 | US7332816 Method of fabricating crossing wiring pattern on a printed circuit board |
| 02/19/2008 | US7332673 Bus bar substrate for vehicle interior light |
| 02/19/2008 | US7332376 Method of encapsulating packaged microelectronic devices with a barrier |
| 02/19/2008 | US7332371 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 02/19/2008 | US7332229 Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particles and varnish |
| 02/19/2008 | US7332212 Immersion of polytetrafluoroethylene dielectric layers in solutions comprising electroconductive polymers and intermetallic seeding materials, then rinsing, drying and coppering to form printed circuits or laminated chip carriers; electronics; printed circuit boards (PCBs), laminated chip carriers |
| 02/19/2008 | US7332068 Selective removal of dielectric materials and plating process using same |
| 02/19/2008 | US7331528 Smartcard and method for production of a smartcard |
| 02/19/2008 | US7331502 Method of manufacturing electronic part and electronic part obtained by the method |
| 02/19/2008 | US7331500 Solder bumps formation using solder paste with shape retaining attribute |
| 02/19/2008 | US7331265 Electromagnetic punch presses with feedback device |
| 02/19/2008 | US7331106 Underfill method |
| 02/19/2008 | US7331105 Method for placing components by means of at least one component placement unit |
| 02/19/2008 | CA2461037C Differential signal electrical connectors |
| 02/19/2008 | CA2375664C Closed loop solder wave height control system |
| 02/14/2008 | WO2008018591A1 Inspecting apparatus, and inspecting method |
| 02/14/2008 | WO2008018526A1 Soldering inspection method, soldering method, and soldering apparatus |
| 02/14/2008 | WO2008018408A1 Glass-ceramic composition, sintered galss-ceramic, and laminated ceramic electronic components |
| 02/14/2008 | WO2008018407A1 Glass-ceramic composition, sintered glass-ceramic, and laminated ceramic electronic components |
| 02/14/2008 | WO2008018352A1 Photosensitive polyimide composition, positive photosensitive resin composition, and fpc |
| 02/14/2008 | WO2008018227A1 Method of producing multilayer ceramic substrate |
| 02/14/2008 | WO2008018160A1 Method and apparatus for connecting printed wiring boards |
| 02/14/2008 | WO2008017682A2 Method and device for laying thin wire |
| 02/14/2008 | WO2008017619A1 Method for producing an electric functional layer on a surface of a substrate |
| 02/14/2008 | WO2008017232A1 Substrate and process for semiconductor flip chip package |
| 02/14/2008 | WO2007146546A3 Single or multi-layer printed circuit board with improved edge via design |
| 02/14/2008 | WO2007135955A9 Object having through-hole formed therein and laser processing method |
| 02/14/2008 | US20080040058 Method of setting reference data for inspection of fillets and inspection device using same |
| 02/14/2008 | US20080038568 Method for Producting Synthetic Resin Film and Synthetic Resin Film |
| 02/14/2008 | US20080038523 Printed circuit board and fabricating method of the same |
| 02/14/2008 | US20080038452 Electroless copper compositions |
| 02/14/2008 | US20080038451 Environmentally friendly; electroless baths are stable and deposit a bright copper or copper alloy on substrates; printed wiring boards |
| 02/14/2008 | US20080038450 Environmentally friendly electroless copper compositions |
| 02/14/2008 | US20080037308 Fixed Write-Protect Seamless Memory Card |
| 02/14/2008 | US20080037233 Printed wiring board and process for manufacturing the same |
| 02/14/2008 | US20080037229 Electronic Module And Method For The Production Thereof |
| 02/14/2008 | US20080037199 Multilayer capacitor, circuit board, circuit module, and method for manufacturing multilayer capacitor |
| 02/14/2008 | US20080036085 Circuit board including solder ball land having hole and semiconductor package having the circuit board |
| 02/14/2008 | US20080036068 Stacked Module Systems and Methods |
| 02/14/2008 | US20080035475 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating |
| 02/14/2008 | US20080035266 Adhesive Bond and Method for the Production Thereof |
| 02/14/2008 | US20080035016 Alkyd resin binder from tris(2-hydroxyethyl)isocyanurate, dimethyl 2,6-naphthalene-dicarboxylate, tall oil fatty acid, and, as a modifier, toluene-2,4- or 2,6-diisocyanate; hydrocarbon solvent; desiccant and antiskinning agent; coating or impregnating electrical wires and coils |
| 02/14/2008 | US20080034582 Methods for sensor having capacitor on chip |
| 02/14/2008 | US20080034581 Method for manufacturing printed circuit board |
| 02/14/2008 | DE102006048337B3 Metallic pin for electronic components, to fit into circuit board holes, has a pressed-in zone giving structured legs with a center link between them |
| 02/14/2008 | DE102006038356A1 Insertion element for circuit boards comprises a housing having an opening for inserting a plug connector, a metallic element for clamping the plug connector and attachments protruding from the housing |
| 02/14/2008 | DE102006038354A1 Connection element e.g. for mounting of supply conductors on circuit board, uses contact element having number of contact feet |
| 02/14/2008 | DE102006037691A1 Moldgehäuse in Einpresstechnik In press-fit molded housing |
| 02/14/2008 | DE102006037532A1 Verfahren zur Erzeugung einer elektrischen Funktionsschicht auf einer Oberfläche eines Substrats A method for generating an electrical functional layer on a surface of a substrate |
| 02/13/2008 | EP1887846A1 Printed wiring board |
| 02/13/2008 | EP1887845A1 Printed wiring board |
| 02/13/2008 | EP1887844A2 Wired electro-mechanical components and method for their manufacture |
| 02/13/2008 | EP1887843A1 Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method |
| 02/13/2008 | EP1887620A1 Mounting structure for ic tag and ic chip for mounting purpose |
| 02/13/2008 | EP1887583A1 Conductive paste and multilayer printed wiring board using same |
| 02/13/2008 | EP1887518A2 Method of setting reference data for inspection of solder fillets and inspection device using same |
| 02/13/2008 | EP1887425A1 Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same |
| 02/13/2008 | EP1886759A1 Water-soluble preflux and use thereof |
| 02/13/2008 | EP1886544A1 Method and arrangement for protecting sensitive components by textile and product including said arrangement |
| 02/13/2008 | EP1886543A1 Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board |
| 02/13/2008 | EP1721498B1 Electronic module and method for the production thereof |
| 02/13/2008 | EP1212759B1 Electrical devices and process for making such devices |
| 02/13/2008 | CN201022242Y A tool for flexible printed circuit board welding sensor |
| 02/13/2008 | CN201020913Y Full-automatic tin plaster vision printer |
| 02/13/2008 | CN101124861A Multilayer printed wiring board for semiconductor device and process for producing the same |
| 02/13/2008 | CN101124860A Reflow device and reflow method |
| 02/13/2008 | CN101124859A Clamping apparatus and image forming apparatus |
| 02/13/2008 | CN101124675A Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 02/13/2008 | CN101124516A Pattern formation material, pattern formation device, and pattern formation method |
| 02/13/2008 | CN101123855A 电路板和底盘 Board and chassis |
| 02/13/2008 | CN101123854A Capacitor built-in substrate and method of manufacturing the same and electronic component device |
| 02/13/2008 | CN101123853A Capacitor built-in interposer, method of manufacturing the same, and electronic component device |
| 02/13/2008 | CN101123852A Circuit substrate and manufacturing method thereof |
| 02/13/2008 | CN101123851A Silk-screen printing method for flexible printing wiring plate |
| 02/13/2008 | CN101123850A Method for manufacturing printed circuit board |
| 02/13/2008 | CN101123849A Making method and structure for high power thin line carrier board |
| 02/13/2008 | CN101123848A Circuit module and its making method |