| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/27/2008 | EP1892285A2 Cleaning composition, cleaning method, and manufacturing method of semiconductor device |
| 02/27/2008 | EP1891845A2 Circuit board structure and method for manufacturing a circuit board structure |
| 02/27/2008 | EP1891844A1 Compact passive transponder |
| 02/27/2008 | EP1891843A1 Method for manufacturing a circuit board structure, and a circuit board structure |
| 02/27/2008 | EP1807654B1 Strip-type assembly comprising a printed conductor structure and electronic components that are connected to said structure, in particular an illumination strip comprising illumination elements |
| 02/27/2008 | EP1719208A4 Circuit board mounting bracket |
| 02/27/2008 | EP1716264A4 Lead-free solder composition for substrates |
| 02/27/2008 | EP1402990B1 Solder composition |
| 02/27/2008 | CN201029254Y Fake label machine |
| 02/27/2008 | CN101133689A Multi-layered printed circuit board comprising conductive test surfaces, and method for determining a misalignment of an inner layer |
| 02/27/2008 | CN101132668A Solder-paste coating method and instrument thereof |
| 02/27/2008 | CN101131937A Manufacturing technique for three-dimensional structure carrier of ceramic metal membrane |
| 02/27/2008 | CN101131896A Method of forming individual formed-on-foil thin capacitors |
| 02/27/2008 | CN101131485A Display device |
| 02/27/2008 | CN101131455A LSI package provided with interface module and method of mounting the same |
| 02/27/2008 | CN100372446C Back board for through hole plugging device and assembling method |
| 02/27/2008 | CN100372445C Printed circuit board and imaging device having the same |
| 02/27/2008 | CN100372110C Semiconductor device and manufacturing method for the same |
| 02/27/2008 | CN100372105C Semiconductor device and method of manufacturing same |
| 02/27/2008 | CN100372103C Flip ball grid array packaging base plate and making technique thereof |
| 02/27/2008 | CN100372084C Method for manufacturing. heat reinforced ball grid array IC packaging substrate and packaging substrate |
| 02/27/2008 | CN100371729C Weak magnetic field sensor using printed circuit board technology and its manufacturing method |
| 02/27/2008 | CN100371089C Improved coating for silver plated circuits |
| 02/26/2008 | US7337453 Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof |
| 02/26/2008 | US7336816 Method and apparatus for measuring shape of bumps |
| 02/26/2008 | US7336498 Memory card with push-push connector |
| 02/26/2008 | US7336446 Suspension board having a circuit and a flying lead portion |
| 02/26/2008 | US7336391 Multi-exposure drawing method and apparatus therefor |
| 02/26/2008 | US7335988 Use of palladium in IC manufacturing with conductive polymer bump |
| 02/26/2008 | US7335975 Integrated circuit stacking system and method |
| 02/26/2008 | US7335571 Method of making a semiconductor device having an opening in a solder mask |
| 02/26/2008 | US7335531 Semiconductor device package and method of production and semiconductor device of same |
| 02/26/2008 | US7335414 Printed circuit board and camera module |
| 02/26/2008 | US7335031 Actuator |
| 02/26/2008 | US7334922 Rearview mirror assembly construction |
| 02/26/2008 | US7334918 LED lighting array for a portable task light |
| 02/26/2008 | US7334721 Sheet-cutting apparatus |
| 02/26/2008 | US7334324 Method of manufacturing multilayer wiring board |
| 02/26/2008 | US7334323 Method of making mutilayered circuitized substrate assembly having sintered paste connections |
| 02/26/2008 | CA2336918C Improved method for forming conductive traces and printed circuits made thereby |
| 02/21/2008 | WO2008021780A1 An etching or plating process and resist ink |
| 02/21/2008 | WO2008021755A1 Printed wiring board having bent portion and method for producing same |
| 02/21/2008 | WO2008020577A1 Connecting method |
| 02/21/2008 | WO2008020534A1 Process for production of formed ceramic bodies |
| 02/21/2008 | WO2008020478A1 Mechanical part embedded board and its manufacturing method |
| 02/21/2008 | WO2007131648A3 Electrical sensor production and use thereof |
| 02/21/2008 | US20080046210 Method, device and program for setting a reference value for substrate inspection |
| 02/21/2008 | US20080044764 used for producing a permanent film, capable of forming a resin layer which is good in fluidity upon heat bonding after pattern, formation and also has good adhesion as well as bonding properties and/or sealing properties |
| 02/21/2008 | US20080044660 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 02/21/2008 | US20080044557 Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond |
| 02/21/2008 | US20080044129 Printed circuit board and manufacturing method thereof |
| 02/21/2008 | US20080043450 Chip carrier and fabrication method |
| 02/21/2008 | US20080043444 Wiring Board for Light-Emitting Element |
| 02/21/2008 | US20080043441 Electronic module |
| 02/21/2008 | US20080043066 Printhead with barrier at chamber inlet |
| 02/21/2008 | US20080042274 Components, methods and assemblies for stacked packages |
| 02/21/2008 | US20080042259 Semiconductor device and method of manufacturing the same, circult board, and electronic instrument |
| 02/21/2008 | US20080042258 Package for semiconductor devices |
| 02/21/2008 | US20080042163 Thermal Transfer Device and System and Method Incorporating Same |
| 02/21/2008 | US20080042111 Copper-Containing Tin Powder, Method for Producing the Copper-Containing Tin Powder and Electro-Conductive Paste Using the Copper-Containing Tin Powder |
| 02/21/2008 | US20080041923 Apparatus and method for forming solder wicking prevention zone and electronic part |
| 02/21/2008 | US20080041726 uniform thickness via aligning lines of electric force uniformly and parallel by disposing pair of conductive perforated plates, which are electrically connected to each other, between plating metals immersed in plating solution |
| 02/21/2008 | US20080041620 Surface mount attachment of components |
| 02/21/2008 | US20080041619 Component-embedded multilayer printed wiring board and manufacturing method thereof |
| 02/21/2008 | US20080041615 Multilayered printed circuit board, solder resist composition, multilayered printed circuit board manufacturing method, and semiconductor device |
| 02/21/2008 | US20080040921 Multilayer circuit board with embedded components and method of manufacture |
| 02/21/2008 | DE102007038183A1 Resist pattern formation on semiconductor chip or circuit board, uses first and second photohardenable resist films sensitive to light in different wavelength regions to reduce illumination time |
| 02/21/2008 | DE102006039727A1 Printed circuit board, is manufactured of press paper or press board base, and silver oxide or platinum oxide or cobalt or palladium or bismuth oxide or vanadium oxide that is used in printed circuit board track or printed circuit board bus |
| 02/21/2008 | DE102006038505A1 Vorrichtung zum Versetzen von Gegenständen Device for moving objects |
| 02/21/2008 | DE102006037857A1 Innenverkleidungsteil mit Elektronik-Baustein zur Steuerung elektrischer Geräte Interior trim panel with electronic module for controlling electrical devices |
| 02/21/2008 | DE102006030581B3 Verfahren zum Herstellen eines Bauelements A method of manufacturing a device |
| 02/21/2008 | DE102004016205B4 Multilayer-Leiterplatte sowie Verfahren zum Herstellen einer solchen Multi layer printed circuit board as well as methods for producing such |
| 02/20/2008 | EP1890524A1 Multilayer printed wiring board and method for manufacturing same |
| 02/20/2008 | EP1890343A1 Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device |
| 02/20/2008 | EP1890324A2 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 02/20/2008 | EP1890323A2 Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure |
| 02/20/2008 | EP1889684A1 Lead-free solder alloy |
| 02/20/2008 | EP1889683A1 Lead-free solder paste |
| 02/20/2008 | EP1889525A2 Printing conductive patterns using lep |
| 02/20/2008 | EP1889524A1 Conductive patterning |
| 02/20/2008 | EP1888820A1 Method, clip and device for transporting an article to be treated in an electrolytic system |
| 02/20/2008 | EP1888338A1 Printing machine and a method for producing a printed product |
| 02/20/2008 | EP1634127A4 Multi functional timepiece module with application specific printed circuit boards |
| 02/20/2008 | EP1098558B1 Multilayer printed wiring board and production method thereof |
| 02/20/2008 | EP1073068B1 Ptc thermistor chip |
| 02/20/2008 | EP0749633B1 Method of manufacturing a semiconductor die carrier |
| 02/20/2008 | CN201025741Y Repair clamp for circuit board |
| 02/20/2008 | CN201023977Y Steering apparatus |
| 02/20/2008 | CN201023926Y Substrate temporary storage rack device |
| 02/20/2008 | CN101129103A Multi-layer ceramic substrate manufacture method |
| 02/20/2008 | CN101129102A Ceramic substrate, electronic apparatus, and method for producing ceramic substrate |
| 02/20/2008 | CN101128927A Electronic component soldering structure and electronic component soldering method |
| 02/20/2008 | CN101128776A Image-drawing method, image-drawing apparatus, image-drawing system, and correction method |
| 02/20/2008 | CN101128326A Printing screens, machine and method for screen printing |
| 02/20/2008 | CN101128091A Component-embedded multilayer printed wiring board and manufacturing method thereof |
| 02/20/2008 | CN101128090A Printed wiring board and its manufacture |
| 02/20/2008 | CN101128089A Manufacturing method for terminal for connecting connector of wiring substrate |
| 02/20/2008 | CN101128088A 嵌入式波导印刷电路板结构 Embedded waveguide structure of the printed circuit board |
| 02/20/2008 | CN101128087A 电路衬底和半导体器件 Circuit substrate and the semiconductor device |
| 02/20/2008 | CN101127343A Structure for integrating IC integration base board and carrier board, its manufacturing method and manufacturing method of electronic device |