| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/21/2008 | EP1923489A2 A multilayer printed circuit board and a process for manufacturing the same |
| 05/21/2008 | EP1923488A2 A process for manufacturing a multilayer printed circuit board |
| 05/21/2008 | EP1756336B1 Device and method for electrolytically treating flat work-pieces |
| 05/21/2008 | EP1621058B1 Gluing method and device |
| 05/21/2008 | EP1618571B1 Terminated conductive patterned sheet utilizing conductive conduits |
| 05/21/2008 | EP1590601B1 Direct mount led lamp |
| 05/21/2008 | EP1385363B1 Printed circuit board and production method therefor, and laminated printed circuit board |
| 05/21/2008 | EP1358041A4 Circuit board router apparatus and method thereof |
| 05/21/2008 | EP1262297B1 Method of preparing a prepreg |
| 05/21/2008 | DE19903957B4 Verfahren und Vorrichtung zum Entfernen von Lot Method and device for removing solder |
| 05/21/2008 | DE112006001825T5 Elektronikbauteilmontagevorrichtung, Höhenerfassungsverfahren für elektronische Bauteile, und Optikachsenanpassungsverfahren für eine Bauteilhöhenerfassungseinheit The electronic component mounting apparatus, the height detection method for electronic devices, and optical axis adjustment method of a component height detection unit |
| 05/21/2008 | DE102006053801A1 Soldering nozzle for wave soldering of printed circuit boards, comprises discharge openings arranged diagonally to conveying direction of the board as row, and triangle openings having a nib in the conveying direction |
| 05/21/2008 | DE102004040945B4 Verfahren und Vorrichtung zum selektiven Beschichten von Leiterplatten Method and apparatus for selective plating of printed circuit boards |
| 05/21/2008 | DE10122276B4 Verfahren zum Beschichten von Lochwänden in Leiterplatten mit einem elektrisch leitenden Material Process for coating walls hole in printed circuit boards with an electrically conductive material |
| 05/21/2008 | CN201063978Y Multi-head buried welding machine |
| 05/21/2008 | CN201063977Y Holding device structure improvement of tin soldering machine |
| 05/21/2008 | CN201063976Y Connector crimping connector |
| 05/21/2008 | CN201063975Y Demolding device for printed circuit board shaping apparatus |
| 05/21/2008 | CN201063974Y Embedded type passive element molding device |
| 05/21/2008 | CN201063973Y Clamping sheet disassembling device |
| 05/21/2008 | CN201063972Y Automatic punching machine of flexible circuit board |
| 05/21/2008 | CN201063967Y Transplant structure of printed circuit board |
| 05/21/2008 | CN101185381A Probe pad structure in a ceramic space transformer |
| 05/21/2008 | CN101185380A Method for forming via hole in substrate for flexible printed circuit board |
| 05/21/2008 | CN101185379A Generic patterned conductor for customizable electronic devices |
| 05/21/2008 | CN101185032A Image processor |
| 05/21/2008 | CN101185028A Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board |
| 05/21/2008 | CN101185027A Method of forming graft pattern and method of forming conductive pattern |
| 05/21/2008 | CN101184380A Manufacturing method of electronic board and multilayer wiring board |
| 05/21/2008 | CN101184379A Stannum-feeding method of stannum wave generator |
| 05/21/2008 | CN101184378A Soldering fluid spraying case of soldering tin stove |
| 05/21/2008 | CN101184377A PCB board preheating device of soldering stove |
| 05/21/2008 | CN101184376A Heater of soldering stove |
| 05/21/2008 | CN101184375A Clamping apparatus for PCB |
| 05/21/2008 | CN101184374A Soldering tin technique of printed circuit board |
| 05/21/2008 | CN101184373A Soldering stove with upper block sheet tin type kettle port |
| 05/21/2008 | CN101184372A Soldering stove with pin protection block type kettle port |
| 05/21/2008 | CN101184371A Soldering stove with separation sheet type kettle port |
| 05/21/2008 | CN101184370A Soldering stove with stannum-spilled port thin wall type kettle port |
| 05/21/2008 | CN101184369A Soldering stove with stannum-spilled port single welding type kettle port |
| 05/21/2008 | CN101184368A Segmentation control stannum-gushing technique for automatic selectivity soldering stove |
| 05/21/2008 | CN101184367A Fast disassembly type kettle port for soldering stove |
| 05/21/2008 | CN101184366A Single spot welding interface |
| 05/21/2008 | CN101184365A Upper stannum intake automatic selectivity soldering stove |
| 05/21/2008 | CN101184364A Checking target for printed circuit board |
| 05/21/2008 | CN101184363A Printed circuit board having embedded resistors and method of manufacturing the same |
| 05/21/2008 | CN101184360A Pattern film, method of manufacturing the pattern film, and printed circuit board and semiconductor package having the pattern film |
| 05/21/2008 | CN101183706A Embedded electronic component structure and method of producing the same |
| 05/21/2008 | CN101183608A Belt electronic parts and manufacturing method thereof |
| 05/21/2008 | CN101183217A Photosensitive composition |
| 05/21/2008 | CN101183216A Photosensitive composition |
| 05/21/2008 | CN101183212A Optical tool and method for forming soldering-resistant pattern |
| 05/21/2008 | CN101183183A Liquid crystal display device |
| 05/21/2008 | CN100389162C Adhesive agent and method for production thereof |
| 05/20/2008 | US7376318 Circuit board and its manufacturing method |
| 05/20/2008 | US7375978 Method and apparatus for trace shielding and routing on a substrate |
| 05/20/2008 | US7375974 Electronic device |
| 05/20/2008 | US7375787 Liquid crystal display devices |
| 05/20/2008 | US7375609 Multilayer laminated circuit board |
| 05/20/2008 | US7375432 Via attached to a bond pad utilizing a tapered interconnect |
| 05/20/2008 | US7375429 Integrated circuit component and mounting method thereof |
| 05/20/2008 | US7375289 Multi-layer printed wiring board including an alignment mark as an index for a position of via holes |
| 05/20/2008 | US7375288 Apparatuses and methods for improving ball-grid-array solder joint reliability |
| 05/20/2008 | US7374977 Droplet discharge device, and method for forming pattern, and method for manufacturing display device |
| 05/20/2008 | US7374794 Metallized film, method for the production thereof, and use thereof |
| 05/20/2008 | US7374273 Droplet ejecting device, droplet ejecting method, and electronic optical device |
| 05/20/2008 | US7373879 Screen printing apparatus |
| 05/15/2008 | WO2008058258A2 Use of breakouts in printed circuit board designs |
| 05/15/2008 | WO2008057717A2 Method for fabricating closed vias in a printed circuit board |
| 05/15/2008 | WO2008056773A1 Adhesive film, and connection structure and connecting method for circuit member |
| 05/15/2008 | WO2008056676A1 Lead-free solder paste, electronic circuit board using lead-free solder paste, and method for manufacturing electronic circuit board |
| 05/15/2008 | WO2008056500A1 Multilayer-wired substrate |
| 05/15/2008 | WO2008055867A1 Method for the production of structured, electrically conductive surfaces |
| 05/15/2008 | WO2008055766A1 Electronic housing comprising a standard interface |
| 05/15/2008 | WO2008055751A2 Electronic housing using novel flexible printed circuit board technology |
| 05/15/2008 | WO2008055746A2 Electrical connector element |
| 05/15/2008 | WO2008055672A1 Wire-inscribed printed circuit board |
| 05/15/2008 | WO2007135604A3 Interconnection arrangement and method for interconnecting a high-cuurent carrying cable with a metal thin-film |
| 05/15/2008 | US20080113302 Pattern Forming Process |
| 05/15/2008 | US20080113176 Curable polyvinyl benzyl compound and process for producing the same |
| 05/15/2008 | US20080113168 Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly |
| 05/15/2008 | US20080112139 Power converter package and thermal management |
| 05/15/2008 | US20080111567 Probe Card and Method of Producing the Same |
| 05/15/2008 | US20080111254 Pattern film, method of manufacturing the pattern film, and printed circuit board and semiconductor package having the pattern film |
| 05/15/2008 | US20080110857 Method of Electrochemical Fabrication |
| 05/15/2008 | US20080110856 Manufacture of devices having complex structures by selective electroplating of layers that include both structural materials (metals) and support (sacrificial) materials; removal(etching, melting, or electrolytically dissolving) of the support defines a microscopicelement for an electrical device |
| 05/15/2008 | US20080110669 Printed circuit board having embedded resistors and method of manufacturing the same |
| 05/15/2008 | US20080110668 Telecommunication connector PCB layout |
| 05/15/2008 | US20080110021 Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board |
| 05/15/2008 | US20080110020 Stripline flex circuit |
| 05/15/2008 | US20080110018 Method For Manufacturing Multilayer Wiring Board |
| 05/15/2008 | US20080110017 Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus |
| 05/15/2008 | US20080110016 Method of making circuitized substrate with solder paste connections |
| 05/15/2008 | DE4498477B4 Verfahren zum Herstellen von plattenförmigen Kontaktelementen A process for producing plate-shaped contact elements |
| 05/15/2008 | DE102007033718A1 Platine und Verfahren zu ihrer Herstellung Board and process for its preparation |
| 05/15/2008 | DE102006053853A1 Cooling body arrangement for e.g. integrated switching circuit, has frame with integrated spring unit, which pre-stresses cooling body on printed circuit board in contact surface-normal, where spring unit is designed as leaf spring |
| 05/15/2008 | DE102006053461A1 Mikroelektronische Baugruppe und Verfahren zum Herstellen einer mikroelektronischen Baugruppe A microelectronic assembly and method of making a microelectronic assembly |
| 05/15/2008 | DE102006052706A1 Drahtbeschriebene Leiterplatte Described wire circuit board |
| 05/15/2008 | DE102006028816B4 Verfahren zum getakteten, kontinuierlichen Herstellen von beidseitig umspritzten flexiblen Leiterplatten A method for clocked continuously producing both sides molded flexible printed circuit boards |
| 05/15/2008 | DE10129760B4 Schaltungsträger mit Fiducial sowie Verfahren zu dessen Herstellung und Verfahren zur Qualitätsprüfung Circuit carrier with fiducial and to processes for its preparation and procedures for auditing |