| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/29/2008 | US7405247 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
| 07/29/2008 | US7405155 Circuit package and method of plating the same |
| 07/29/2008 | US7405109 Method of fabricating the routing of electrical signals |
| 07/29/2008 | US7405035 Image-wise forming a region to initiate polymerization; graft polymerization by atom transfer radical polymerization; adhering a substance to hydrophilic or hydrophobic region of hydrophilic/hydrophobic pattern |
| 07/29/2008 | US7404981 Printing electronic and opto-electronic circuits |
| 07/29/2008 | US7404863 Methods of thinning a silicon wafer using HF and ozone |
| 07/29/2008 | US7404746 Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity |
| 07/29/2008 | US7404625 Ink jet nozzle arrangement having paddle forming a portion of a wall |
| 07/24/2008 | WO2008088725A2 High-current traces on plated molded interconnect device |
| 07/24/2008 | WO2008088720A1 Capacitively coupling layers of a multilayer device |
| 07/24/2008 | WO2008087995A1 Circuit substrate manufacturing method, and circuit substrate |
| 07/24/2008 | WO2008087972A1 Insulating resin sheet multilayer body, multilayer printed wiring board obtained by laminating the insulating resin sheet multilayer bodies |
| 07/24/2008 | WO2008087890A1 Thermosetting resin composition |
| 07/24/2008 | WO2008087849A1 Analyzing device for circuit device, analyzing method, analyzing program and elecronic medium |
| 07/24/2008 | WO2008087831A1 Laser soldering device |
| 07/24/2008 | WO2008087475A1 Method of manufacturing of electronics package |
| 07/24/2008 | WO2008087172A1 Method for the production of structured, electrically conductive surfaces |
| 07/24/2008 | WO2008086992A1 Processing line for plate-like elements, in particular solar cells, and method for processing plate-like elements |
| 07/24/2008 | WO2008086842A1 Device and method for selective soldering |
| 07/24/2008 | WO2008065311A3 Multi-sector antenna |
| 07/24/2008 | WO2008048928A3 Methods of patterning a material on polymeric substrates |
| 07/24/2008 | WO2008036574A3 Method of fabricating a security tag in an integrated surface processing system |
| 07/24/2008 | US20080177412 Device, method and program for soldering |
| 07/24/2008 | US20080176035 Circuit board structure and fabrication method of the same |
| 07/24/2008 | US20080174983 Circuit Module and process for producing the same |
| 07/24/2008 | US20080174978 Electronic component built-in substrate and method of manufacturing electronic component built-in substrate |
| 07/24/2008 | US20080174976 Electronic Circuit Component |
| 07/24/2008 | US20080174975 Flexible wiring substrate and method for producing the same |
| 07/24/2008 | US20080174969 Printed Board Assembly With Improved Heat Dissipation |
| 07/24/2008 | US20080174638 Nozzle Apparatus For An Inkjet Printhead With A Solenoid Piston |
| 07/24/2008 | US20080173477 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 07/24/2008 | US20080173476 Embedded waveguide and embedded electromagnetic shielding |
| 07/24/2008 | US20080173473 Multilayered printed circuit board and manufacturing method thereof |
| 07/24/2008 | US20080173472 Printed circuit board and electronic apparatus |
| 07/24/2008 | US20080173471 Element substrate and method of manufacturing the same |
| 07/24/2008 | US20080173468 Wiring substrate, method for manufacturing the same, and electronic apparatus |
| 07/24/2008 | US20080173388 Method for making an architectural laminate |
| 07/24/2008 | US20080173329 Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these |
| 07/24/2008 | US20080172872 High speed interconnect |
| 07/24/2008 | US20080172871 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module |
| 07/24/2008 | US20080172869 Methods and systems for processing semiconductor workpieces |
| 07/24/2008 | US20080172868 Method for manufacturing wiring board and method for manufacturing multilayer wiring board |
| 07/24/2008 | US20080172867 Method of manufacturing multi-layered flexible printed circuit board |
| 07/24/2008 | US20080172860 Radio frequency IC tag and method for manufacturing same |
| 07/24/2008 | US20080172852 Method of making high capacitance density embedded ceramic capacitors by casting metal and dielectric formulations onto fugitive substrates for form tapes |
| 07/24/2008 | DE202006020419U1 Leiterstruktur Conductor structure |
| 07/24/2008 | DE112006002475T5 Harzzusammensetzung, blattförmig ausgebildeter Körper, Prepreg, gehärteter Körper, Laminat und Mehrschichtlaminat Resin composition, leaf-shaped design body, prepreg, hardened body, laminate and multi-layer laminate |
| 07/24/2008 | CA2675033A1 Method for producing structured electrically conductive surfaces |
| 07/23/2008 | EP1947918A2 Electronic device and method of manufacturing same |
| 07/23/2008 | EP1947917A2 Manufacturing method of electronic device |
| 07/23/2008 | EP1947671A2 Plasma Display Device |
| 07/23/2008 | EP1946882A1 Solder composition |
| 07/23/2008 | EP1946875A1 Method and device for selective soldering |
| 07/23/2008 | EP1946626A1 Method for soldering electronic component and soldering structure of electronic component |
| 07/23/2008 | EP1945547A1 Handling of flexible planar material |
| 07/23/2008 | EP1678340A4 Surface reactive preservative for use with solder preforms |
| 07/23/2008 | EP1665333A4 Coupler resource module |
| 07/23/2008 | EP1620442B1 Dicopper (i) oxalate complexes as precursor for metallic copper deposition |
| 07/23/2008 | EP1448725A4 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 07/23/2008 | EP1185152B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/23/2008 | EP1185150B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/23/2008 | CN101228000A Water-soluble preflux and use thereof |
| 07/23/2008 | CN101227803A Circuit board with conductive structures and manufacturing method thereof |
| 07/23/2008 | CN101227802A Pattern electrode jointing structure using ultraviolet as well as method for jointing pattern electrode |
| 07/23/2008 | CN101227801A Printed circuit board and electronic apparatus |
| 07/23/2008 | CN101227800A Apparatus and method for implementing high-precision buried resistance |
| 07/23/2008 | CN101227799A Electronic device and method of manufacturing same |
| 07/23/2008 | CN101227798A Electronic device and method of manufacturing the same |
| 07/23/2008 | CN101227797A Manufacturing method of electronic device |
| 07/23/2008 | CN101227796A Method for manufacturing conduction curcuit |
| 07/23/2008 | CN101227794A Flexible substrate integrated waveguides |
| 07/23/2008 | CN101227022A Antenna device of expendability electronic product and manufacturing method thereof |
| 07/23/2008 | CN101226914A Chip carrier substrate capacitor and method for fabrication thereof |
| 07/23/2008 | CN101226908A Projection structure with ring-shaped support and manufacturing method thereof |
| 07/23/2008 | CN101226886A Method and apparatus for manufacturing electronic device |
| 07/23/2008 | CN101226798A Transient voltage protection circuit boards and manufacturing method |
| 07/23/2008 | CN101225276A Method for preparing copper clad laminate with high glass transition temperature |
| 07/23/2008 | CN101225264A Protection ink, printed wiring board and method for manufacturing the protection ink |
| 07/23/2008 | CN101224650A Auxiliary material for laminating flexible circuit board and laminating process thereof |
| 07/23/2008 | CN100405887C Main board assembling method and equipment therefor |
| 07/23/2008 | CN100405884C Throughplating of flexible printed boards |
| 07/23/2008 | CN100405883C Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 07/23/2008 | CN100405881C Wiring board |
| 07/23/2008 | CN100405880C Pin connection structure, and method for modifying definition of pin position |
| 07/23/2008 | CN100405583C High-frequency wiring structure and method for producing the same |
| 07/23/2008 | CN100405565C Electronic component mounting apparatus and electronic component mounting method |
| 07/23/2008 | CN100405562C Method for producing wiring base board |
| 07/23/2008 | CN100405532C Method of soldering semiconductor part and mounting structure of semiconductor part |
| 07/23/2008 | CN100405505C Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same |
| 07/23/2008 | CN100405152C Regeneration apparatus of thin film type wire assembly substrate |
| 07/23/2008 | CN100405149C Device and method of making a device having a flexible layer structure |
| 07/23/2008 | CN100405139C Liquid crystal device and improvement for tensile strength of liquid crystal screen with circuit board |
| 07/23/2008 | CN100404597C Thermally conductive adhesive composition and process for device attachment |
| 07/23/2008 | CN100404249C Screen printing apparatus and screen printing method |
| 07/23/2008 | CN100404240C Process for producing polyester film |
| 07/23/2008 | CN100404193C Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
| 07/23/2008 | CN100404192C Method and system for laser trimming of resistors |
| 07/22/2008 | US7404199 Method, system, and apparatus for high volume assembly of compact discs and digital video discs incorporating radio frequency identification tag technology |
| 07/22/2008 | US7403397 Switching power-supply module |
| 07/22/2008 | US7402896 Integrated circuit (IC) carrier assembly incorporating serpentine suspension |