| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/24/2008 | US20080093422 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 04/24/2008 | US20080093117 Multilayer circuit board and manufacturing method thereof |
| 04/24/2008 | US20080093115 Interposer, electrical package, and contact structure and fabricating method thereof |
| 04/24/2008 | US20080093111 Multilayer wiring board and method of manufacturing the same |
| 04/24/2008 | US20080093019 Electrical Interconnect Using Locally Conductive Adhesive |
| 04/24/2008 | US20080092991 Solder bumps formation using solder paste with shape retaining attribute |
| 04/24/2008 | US20080092379 Method for fabricating circuit board structure |
| 04/24/2008 | US20080092378 Method For Manufacturing Electroconductive Material-Filled Throughhole Substrate |
| 04/24/2008 | US20080092377 Patterned printing plates and processes for printing electrical elements |
| 04/24/2008 | DE10217698B4 Elektrische Schaltanordnung mit einem spritzgegossenen Schaltungsträger Electrical switching device with an injection molded circuit carrier |
| 04/24/2008 | DE102007007618B3 Method for joining coated components or wires using a laser used in the production of e.g. micro-systems comprises directing a laser pulse onto the joining site during the joining step and varying the pulse shape |
| 04/24/2008 | DE10047897B4 Elektronische Baueinheit mit einer als Leadframe ausgebildeten Montageplatte und darauf befestigten SMD-Bauteilen Electronic unit with a designed as a lead frame mounting plate and secured thereto SMD components |
| 04/23/2008 | EP1915043A1 Apparatus for fastening a component on a circuit board |
| 04/23/2008 | EP1915041A1 Printed wiring board and printed wiring board manufacturing method |
| 04/23/2008 | EP1915040A2 Printed wiring board and printed wiring board manufacturing method |
| 04/23/2008 | EP1915039A2 Method of manufacturing circuit board |
| 04/23/2008 | EP1915037A1 Bending-type rigid printed wiring board and process for producing the same |
| 04/23/2008 | EP1914286A1 Polishing composition and polishing method |
| 04/23/2008 | EP1914035A1 Lead free solder paste and application thereof |
| 04/23/2008 | EP1913801A1 Method of manufacturing pattern-forming metal structures on a carrier substrate |
| 04/23/2008 | EP1913641A1 A package and manufacturing method for a microelectronic component |
| 04/23/2008 | EP1814764B1 Electronic device |
| 04/23/2008 | EP1135794B1 A method and apparatus for the transport and tracking of an electronic component |
| 04/23/2008 | CN101167416A Process for producing double-sided flexible printed board and double-sided flexible printed board |
| 04/23/2008 | CN101167415A Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method |
| 04/23/2008 | CN101167132A Suspended rack assembly method and making process |
| 04/23/2008 | CN101166847A Material for plating and use thereof |
| 04/23/2008 | CN101166778A Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof |
| 04/23/2008 | CN101166402A Mounting method for mounting microphone on flexible printed circuit board |
| 04/23/2008 | CN101166401A Method and system for placing multiple loads in high-speed system |
| 04/23/2008 | CN101166400A Method of manufacturing circuit board |
| 04/23/2008 | CN101166399A Circuit board cleaner |
| 04/23/2008 | CN101166398A 干膜压膜机 Dry film lamination machine |
| 04/23/2008 | CN101166397A A method for removing sensitization film in flexible printed circuit board |
| 04/23/2008 | CN101166396A Joint tool and method for flexible printed circuit board |
| 04/23/2008 | CN101166395A Semiconductor mounting substrate and method for manufacturing the same |
| 04/23/2008 | CN101166394A Multilayer wiring substrate mounted with electronic component and method for manufacturing the same |
| 04/23/2008 | CN101166393A Laminated body used to produce printed wiring board, and method of producing printed wiring board using the same |
| 04/23/2008 | CN101166392A A laminated multi-layer flexible printed circuit board and its making method |
| 04/23/2008 | CN101165967A Antenna continuous manufacture method |
| 04/23/2008 | CN101165886A Semiconductor packaging member for semiconductor device stacking and its manufacture method |
| 04/23/2008 | CN101165820A Carbon black conductive fluid |
| 04/23/2008 | CN101165570A Method of manufacturing light source unit, backlight unit including the light source unit, and liquid crystal display including the backlight unit |
| 04/23/2008 | CN101164784A Heat unit, liquid droplet discharging apparatus, and method for discharging liquid |
| 04/23/2008 | CN101164780A Electrically conductive material printing apparatus and printing mask cleaning method |
| 04/23/2008 | CN100384314C Electronic part installing method and device |
| 04/23/2008 | CN100384309C Welding method, component connection welded by such welding method and connection structure |
| 04/23/2008 | CN100384308C Method for making single-face hollowed-out board |
| 04/23/2008 | CN100384307C Displacement and repairing method for electronic circuit board |
| 04/23/2008 | CN100384306C Device and method for electrically connecting conductive layer to conductive element |
| 04/23/2008 | CN100384070C Power converting module device and power unit using it |
| 04/23/2008 | CN100383942C Semiconductor device and radiation detector employing it |
| 04/23/2008 | CN100383915C Apparatus and method for forming bump |
| 04/23/2008 | CN100383278C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board |
| 04/23/2008 | CN100383211C Thermoset binding material |
| 04/23/2008 | CN100382961C Table, machine and method for applying one or more kinds of articles to a printing unit |
| 04/23/2008 | CN100382949C Method for producing prepreg base plate |
| 04/22/2008 | US7362586 Electronic component with shielding case and method of manufacturing the same |
| 04/22/2008 | US7362562 Electronic unit of radio system and method of producing the same |
| 04/22/2008 | US7362560 Multilayer electronic component and method for producing the same |
| 04/22/2008 | US7362113 Universal wafer carrier for wafer level die burn-in |
| 04/22/2008 | US7361997 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
| 04/22/2008 | US7361988 Apparatuses and methods to route line to line |
| 04/22/2008 | US7361983 Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
| 04/22/2008 | US7361849 Printed wiring board and method for manufacturing the same |
| 04/22/2008 | US7361848 Wiring board, magnetic disc apparatus, and manufacturing method of wiring board |
| 04/22/2008 | US7361845 Wiring line for high frequency |
| 04/22/2008 | US7361844 Power converter package and thermal management |
| 04/22/2008 | US7361842 Apparatus and method for an embedded air dielectric for a package and a printed circuit board |
| 04/22/2008 | US7361593 Methods of forming vias in multilayer substrates |
| 04/22/2008 | US7361412 Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources; rapid cooling results in a very fine microstructure |
| 04/22/2008 | US7361251 RFID label technique |
| 04/22/2008 | US7361027 Contact structure, display device and electronic device |
| 04/22/2008 | US7360716 Method of determining at least one marking element on a substrate |
| 04/22/2008 | US7360679 Method for the production of a soldered connection |
| 04/22/2008 | US7360308 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers |
| 04/22/2008 | US7360307 Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors |
| 04/22/2008 | US7360306 Process for producing a cover with a glass pane and electrical function elements |
| 04/22/2008 | US7360305 Method for manufacturing multi-layered ceramic electronic component |
| 04/22/2008 | CA2412030C Perimeter anchored thick film pad |
| 04/17/2008 | WO2008044766A1 Resin composition |
| 04/17/2008 | WO2008044711A1 Support board for perforation processing and method of perforation processing |
| 04/17/2008 | WO2008044710A1 Support board for perforation processing and method of perforation processing |
| 04/17/2008 | WO2008044675A1 Solid-state imaging device |
| 04/17/2008 | WO2008044573A1 Capacitor layer-forming material, method for producing capacitor layer-forming material, and printed wiring board comprising built-in capacitor obtained by using the capacitor layer-forming material |
| 04/17/2008 | WO2008044514A1 Component crimping apparatus control method, component crimping apparatus, and measuring tool |
| 04/17/2008 | WO2008044382A1 Circuit board and process for producing the same |
| 04/17/2008 | WO2008044330A1 Adhesive tape |
| 04/17/2008 | WO2008044308A1 Circuit board and process for producing the same |
| 04/17/2008 | WO2008044254A1 Automatic machine for optical alignment and inductive bonding of the layers of a semi-finished multilayer printed circuit |
| 04/17/2008 | WO2008043662A1 Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks |
| 04/17/2008 | WO2008027856A3 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same |
| 04/17/2008 | WO2007148836A3 Electrode bonding method and part mounting apparatus |
| 04/17/2008 | WO2007147602A3 Method for producing a circuit part on a substrate |
| 04/17/2008 | US20080090406 Via attached to a bond pad utilizing a tapered interconnect |
| 04/17/2008 | US20080090382 Substrate dividing method |
| 04/17/2008 | US20080090335 Circuit module and manufacturing method thereof |
| 04/17/2008 | US20080090331 Semiconductor device manufacturing method and manufacturing apparatus |
| 04/17/2008 | US20080090095 Base metal layer on one plane of an insulating film, a copper film layer on the base metal layer made of a chrome-molybdenum-nickel alloy |
| 04/17/2008 | US20080090091 Polyimide Based Compositions Comprising Doped Polyaniline and Methods and Compositions Relating Thereto |