Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2008
07/10/2008WO2008080712A1 Method of generating an electrical component of an electrical circuitry a substrate
07/10/2008WO2008080533A1 An electronic device and method of assembling an electronic device
07/10/2008WO2008061385A3 Conductive textile material
07/10/2008WO2008058673A3 Circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound and method for the production and use thereof
07/10/2008US20080168413 Method for Analyzing Component Mounting Board
07/10/2008US20080166919 Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
07/10/2008US20080166565 Multilayer; aluminum foil or polyethylene terephthalate film, and primer ( e.g.polyesterurethane copolymer) and lubricant resin such as polyoxyethylene glycol and polyglycerol monostearate, containing colorant ( fd and c blue 1); capable of preventing drill breakage when a small-diameter drill is used
07/10/2008US20080166497 Circuit board with identifiable information and method for fabricating the same
07/10/2008US20080165518 Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles
07/10/2008US20080165514 Printed circuit board
07/10/2008US20080165513 Electronic component built-in substrate and method for manufacturing the same
07/10/2008US20080165511 Control Device and Method of Manufacturing Thereof
07/10/2008US20080165226 Nozzle assembly having a sprung electromagnetically operated plunger
07/10/2008US20080164298 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
07/10/2008US20080164236 Method for manufacturing printed circuit board
07/10/2008US20080164057 Printed Wiring Board And Method Of Manufacturing Same
07/10/2008US20080164056 Compact display flex and driver sub-assemblies
07/10/2008US20080164053 Ceramic electronic component and method for manufacturing the same
07/10/2008US20080163487 Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
07/10/2008US20080163486 Component built-in wiring board and manufacturing method of component built-in wiring board
07/10/2008US20080163485 Manufacturing method for integrating passive component within substrate
07/10/2008US20080163484 Pcb product changeover apparatus system and method
07/10/2008US20080163481 Component mounting apparatus and component mounting method
07/10/2008US20080163476 Process For Producing A Contact Piece, And Contact Piece For A Vacuum Interrupter Chamber Itself
07/10/2008DE19921726B4 Verfahren zur Beschleunigung des Abtropfens überschüssigen Flüssiglack-Materials von der Beschichtungsseite einer Leiterplatte A method for accelerating the draining excess liquid coating material from the coating side of a printed circuit board
07/10/2008DE112006002451T5 Keramisches mehrlagiges Substrat und Verfahren zur Herstellung desselben A ceramic multilayer substrate and process for producing same
07/10/2008DE10222609B4 Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat A process for the production of structured layers on substrates and methods according coated substrate
07/10/2008DE102007058497A1 Laminierte mehrschichtige Leiterplatte Laminated multilayer printed wiring board
07/10/2008DE102007001285A1 Method for assembly and contacting of electrically conducting semiconductor components, involves bonding electrically conducting bearing surface of individual semiconductor components directly on electrically isolating supporting substrate
07/10/2008DE102005038392B4 Verfahren zum Herstellen von Muster bildenden Kupferstrukturen auf einem Trägersubstrat A method for manufacturing pattern-forming copper structures on a carrier substrate
07/10/2008CA2674702A1 Method for producing electrically conductive surfaces
07/09/2008EP1942711A1 Method of manufacturing a wiring board including electroplating
07/09/2008EP1942710A1 Method of generating an electrical component of an electrical circuitry on a substrate
07/09/2008EP1942559A1 Electric connector
07/09/2008EP1942365A2 Driving circuit for a liquid crystal display device, method of manufacturing the same, and display device having the same
07/09/2008EP1941789A1 Flexible printed circuit and method for manufacturing the same
07/09/2008EP1941788A1 A device for the high-speed drilling of boards for printed circuits and the like
07/09/2008EP1941787A1 A device for the high-speed drilling of boards for printed circuits and the like
07/09/2008EP1719394B1 Methods of forming tracks and track arrangements
07/09/2008EP1708258B1 Composite ceramic substrate
07/09/2008CN101218862A 电子元件安装方法 Electronic component mounting method
07/09/2008CN101218861A Electronic component mounting apparatus, height detection method for electronic component, and optical-axis adjustment method for component height detection unit
07/09/2008CN101218538A Photosensitive resin composition, and photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma di
07/09/2008CN101217853A A welding method of chip pin and metal terminals
07/09/2008CN101217851A Printed circuit board and liquid crystal display having the same
07/09/2008CN101217134A A base plate structure and the corresponding sphere placement method of spheres array sealing
07/09/2008CN101215368A Nanoporous laminates
07/09/2008CN101214478A Real time monitoring and diagnosing method for glue dropping machine
07/09/2008CN100401860C A pattern form object and a manufacturing method thereof
07/09/2008CN100401523C Wiring substrate and radiation detector using same
07/09/2008CN100401503C Semiconductor device and manufacturing method of the same
07/09/2008CN100401429C Electric conductors
07/09/2008CN100401341C Wiring substrate and electrooptic device and their manufacturing method
07/09/2008CN100401190C 印刷电路板 A printed circuit board
07/09/2008CN100401189C Photo-curable and thermosetting resin composition
07/09/2008CN100400614C Solidifiable resin composition for packing electronic equipment
07/09/2008CN100400529C Fluoro-aromatic organic tetracarboxylic dianhydride and its preparation method and use
07/09/2008CN100400271C Heat-resistant flexible laminated board manufacturing method
07/09/2008CN100400217C Welding method and method of preparing component mounting board
07/09/2008CN100400184C Ultrasonic printed circuit board transducer
07/08/2008US7397001 Multi-strand substrate for ball-grid array assemblies and method
07/08/2008US7397000 Wiring board and semiconductor package using the same
07/08/2008US7396885 A blends comprising an adduct of epoxidized phenolic resins with (meth)acrylic acid, a (meth)acrylates, a liquid epoxy resins and curing agents; noncracking, solder-resistance, corrosion resistance, durability
07/08/2008US7396753 Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same
07/08/2008US7396741 Method for connecting substrate and composite element
07/08/2008US7396596 Article with a coating of electrically conductive polymer
07/08/2008US7396588 Halogen-free flame retarders; mixture with polymer, curing agents and solvent; laminate of dielectric overcoating substrate; for use in the production of insulation films, flame retardancy, having excellent electrical insulation
07/08/2008US7396566 Fabrication of organic electronic circuits by contact printing techniques
07/08/2008US7396425 Adding binder lacquer solution to slurry of ceramic powder; high pressure dispersion through a wet jet mill; smoothed on its surface, reduced surface roughness of the electrode coating during stacking, suppress defects, reduced short circuit
07/08/2008CA2464589C Ultrasonic printed circuit board transducer
07/03/2008WO2008079617A1 Methods of patterning a deposit metal on a substrate
07/03/2008WO2008078739A1 Multilayer circuit board and motor drive circuit board
07/03/2008WO2008078680A1 Optical/electrical mixture mounting board and method for producing the same
07/03/2008WO2008078664A1 Method of producing conductive circuit board
07/03/2008WO2008078620A1 Novel polyimide precursor composition, use thereof and production method thereof
07/03/2008WO2008078567A1 Method for manufacturing material for forming capacitor layer having electrode circuit
07/03/2008WO2008078566A1 Capacitor layer forming member for multilayer printed wiring board and method for manufacturing capacitor layer forming member
07/03/2008WO2008078435A1 Printed wiring board and process for producing the same
07/03/2008WO2008077608A2 Method and device for spraying on particularly a conductor, electric component comprising a conductor, and metering device
07/03/2008WO2008059162A3 Printed substrate through which very strong currents can pass and corresponding production method
07/03/2008WO2008016437A3 Methods and apparatus for efficiently generating profiles for circuit board work/rework
07/03/2008US20080160929 Front End Module And Fabricating Method Thereof
07/03/2008US20080160293 Heat-Peelable Pressure-Sensitive Adhesive Sheet and Method for Processing Adherend Using the Heat-Peelable Pressure-Sensitive Adhesive Sheet
07/03/2008US20080160246 Circuit board unit and method for production thereof
07/03/2008US20080158843 Mounting board, height adjusting apparatus and mounting method
07/03/2008US20080158841 Printed circuit board and method for manufacturing printed circuit board
07/03/2008US20080158838 Printed circuit board and method for manufacturing printed circuit board
07/03/2008US20080158836 Circuit board and method for manufacturing the same
07/03/2008US20080158824 Electric circuit device and the manufacturing method
07/03/2008US20080158770 Method of manufacturing circuit board embedding thin film capacitor
07/03/2008US20080158746 Universal Energy Conditioning Interposer with Circuit Architecture
07/03/2008US20080158306 Nozzle Arrangement With Expandable Actuator
07/03/2008US20080158282 Method and Apparatus For Accurately Applying Structures to a Substrate
07/03/2008US20080157789 Rotating contact element and methods of fabrication
07/03/2008US20080157030 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
07/03/2008US20080156851 Flux spray atomization and splash control
07/03/2008US20080156445 Transfer assembly for manufacturing electronic devices
07/03/2008US20080155821 Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
07/03/2008US20080155820 Wiring substrate, manufacturing method thereof, and semiconductor device
07/03/2008US20080155819 Circuit board and method for manufacturing the same