| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/19/2008 | EP1901594A1 Method and device for removing micro component |
| 03/19/2008 | EP1900263A1 Fabrication of electronic components in plastic |
| 03/19/2008 | EP1697195B1 Railway beacon and related production method |
| 03/19/2008 | EP1021792B1 Method for making smart cards capable of operating with and without contacts |
| 03/19/2008 | CN201039667Y Surface chip separator |
| 03/19/2008 | CN201039597Y Combined jumper supporting base and its electronic device |
| 03/19/2008 | CN201039596Y Migration location device for printed circuit board |
| 03/19/2008 | CN201039595Y Ball planting device for circuit board |
| 03/19/2008 | CN201039594Y Aluminum coverage plate coated by multiple lubrication location pin effect for drilling |
| 03/19/2008 | CN201039593Y Tools for heat radiator assembly |
| 03/19/2008 | CN201039592Y Clamp for circuit board processing |
| 03/19/2008 | CN201039589Y An anti-shock electronic device |
| 03/19/2008 | CN201039587Y Welding structure and printed circuit board with this welding structure |
| 03/19/2008 | CN201039580Y A PCB board and corresponding circuit board printing device and steel mesh |
| 03/19/2008 | CN201038294Y Radio frequency identification label antenna |
| 03/19/2008 | CN201038293Y Solder paste printing apparatus for antenna substrate and feeding needle splicing |
| 03/19/2008 | CN201036824Y Automatic welding equipment |
| 03/19/2008 | CN101147435A Printed board with a pin for mounting a component |
| 03/19/2008 | CN101147432A 电路板设计 Circuit board design |
| 03/19/2008 | CN101147217A Electronic component module |
| 03/19/2008 | CN101146839A Carboxyl group-containing polyurethane and heat-curable polyurethane resin compositi0n prepared therefrom |
| 03/19/2008 | CN101146413A Positioning combined device and method of circuit board |
| 03/19/2008 | CN101146412A Mounting structure |
| 03/19/2008 | CN101146411A Side-contact electronic module making method |
| 03/19/2008 | CN101146410A Base plate cleaning device |
| 03/19/2008 | CN101146409A Device and method for making conductive antenna based on concave printing technology |
| 03/19/2008 | CN101146408A Wiring forming system and wiring forming method for forming wiring on wiring board |
| 03/19/2008 | CN101146407A Graph transfer shaping technology for carrier board circuit of printed circuit board |
| 03/19/2008 | CN101146406A Shaping method for flexible printing line circuit |
| 03/19/2008 | CN101146405A Welding structure between circuit board |
| 03/19/2008 | CN101146400A Printed circuit board assembly and its assembling method |
| 03/19/2008 | CN101145633A A built-in mobile phone antenna and its making method |
| 03/19/2008 | CN101145630A Method of manufacturing metal film pattern forming body |
| 03/19/2008 | CN101145552A Integrated circuit package substrate and making method |
| 03/19/2008 | CN101145542A Method of manufacturing a composite of copper and resin |
| 03/19/2008 | CN101145416A Surface mounted electronic element |
| 03/19/2008 | CN101143500A Laminate and use thereof |
| 03/19/2008 | CN101143398A Electric iron rack |
| 03/19/2008 | CN100376126C Flexible substrate, multilayer flexible substrate and process for producing the same |
| 03/19/2008 | CN100376125C Surface-treated copper foil and its preparing method |
| 03/19/2008 | CN100376022C Method for packing semiconductor device on printing circuit board and the printing circuit board |
| 03/18/2008 | US7346420 Component feeder exchange diagnostic tool |
| 03/18/2008 | US7346419 Component feeder exchange diagnostic tool |
| 03/18/2008 | US7345891 Circuit board assembly |
| 03/18/2008 | US7345888 Component built-in wiring board and manufacturing method of component built-in wiring board |
| 03/18/2008 | US7345887 Flexible printed board mounting structure and optical pick up having the same |
| 03/18/2008 | US7345645 Method of manufacturing substrate for circuit board and smart label having the substrate |
| 03/18/2008 | US7345563 Embedded inductor for semiconductor device circuit |
| 03/18/2008 | US7345552 Constant temperature type crystal oscillator |
| 03/18/2008 | US7345247 Circuit board threadplate |
| 03/18/2008 | US7345244 Flexible substrate and a connection method thereof that can achieve reliable connection |
| 03/18/2008 | US7345105 Conductive adhesive composition |
| 03/18/2008 | US7344971 Manufacturing method of semiconductor device |
| 03/18/2008 | US7344918 Electronic assembly with integrated IO and power contacts |
| 03/18/2008 | US7344432 Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
| 03/18/2008 | US7344085 Multilayer expansion card for electronic apparatus and relative production method |
| 03/18/2008 | US7344061 Multi-functional solder and articles made therewith, such as microelectronic components |
| 03/18/2008 | US7343674 Method of making circuitized substrate assembly |
| 03/18/2008 | US7343671 Process for manufacturing a composite polymeric circuit protection device |
| 03/18/2008 | US7343654 Method of manufacturing a piezoelectric element and a liquid ink jet head |
| 03/18/2008 | CA2460520C Metal-containing web processed with a continuous etch process |
| 03/18/2008 | CA2432296C Organic carboxylate composition, method for producing the same, and additive for epoxy resin |
| 03/18/2008 | CA2311819C Apparatus and method for inerting a wave soldering installation |
| 03/13/2008 | WO2008030176A1 Substrate-penetrating electrical connections |
| 03/13/2008 | WO2008029847A1 Ceramic substrate manufacturing method and ceramic substrate |
| 03/13/2008 | WO2008029813A1 Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor device |
| 03/13/2008 | WO2008029580A1 Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
| 03/13/2008 | WO2008029376A2 Deposition of conductive polymer and metallization of non-conductive substrates |
| 03/13/2008 | WO2008009492A3 Conductor carrier and arrangement comprising a conductor carrier |
| 03/13/2008 | WO2007140477A3 Polyimide insulative layers in multi-layered printed electronic features |
| 03/13/2008 | WO2007140463A3 Solderable pads utilizing nickel and silver nanoparticle ink jet inks |
| 03/13/2008 | WO2007103011A3 Methods of forming a flexible circuit board |
| 03/13/2008 | US20080064849 Adhesive film for circuit connection, and circuit connection structure |
| 03/13/2008 | US20080064233 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 03/13/2008 | US20080064207 Semiconductor Device Power Interconnect Striping |
| 03/13/2008 | US20080064138 Perimeter matrix ball grid array circuit package with a populated center |
| 03/13/2008 | US20080063955 Flame retardancy; halogen free; curing shrinkage and solder resistance; resin comprised of linear polymer containing ethylenic unsaturated compound with carboxyl groups, multifunctional ethylenic unsaturated monomers, photopolymerization initiator and phosphorated epoxy resin |
| 03/13/2008 | US20080063792 Board for printed wiring, printed wiring board, and method for manufacturing them |
| 03/13/2008 | US20080063576 stably generates jet at atmospheric pressure with low electric power; surface treatment, cutting, etching, film deposition; High-resolution microanalysis; High-resolution microanalysis with a "micro total analysis" using a VHF-driven inductively-coupled microplasma source |
| 03/13/2008 | US20080062699 Mounting arrangement for light emitting diodes |
| 03/13/2008 | US20080062638 Monolithic Structures Including Alignment and/or Retention Fixtures for Accepting Components |
| 03/13/2008 | US20080062348 Structure Of Liquid Crystal Display Device For Easy Assembly And Disassembly |
| 03/13/2008 | US20080062109 Liquid crystal display panel with signal transmission patterns |
| 03/13/2008 | US20080061908 Coaxial connector and method for manufacturing the same, and superconductor device and method for manufacturing the same |
| 03/13/2008 | US20080061808 Compliance partitioning in testing of integrated circuits |
| 03/13/2008 | US20080061117 A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb or other metals |
| 03/13/2008 | US20080061116 Method And Device For Reflow Soldering With Volume Flow Control |
| 03/13/2008 | US20080060840 Multi-layer printed wiring board and manufacturing method thereof |
| 03/13/2008 | US20080060837 Circuit board and manufacturing method of the circuit board |
| 03/13/2008 | US20080060194 Method for fabricating passive circuit in circuit substrate |
| 03/13/2008 | US20080060193 Methods of fabricating substrates including at least one conductive via |
| 03/13/2008 | US20080060188 Micro-electromechanical Relay and Related Methods |
| 03/13/2008 | DE112006000682T5 Heizvorrichtung, Reflow-Vorrichtung, Heizverfahren und Verfahren zur Herstellung von Bumps Heater reflow device, heating method and process for producing bumps |
| 03/13/2008 | DE102006039817A1 Bauelement zum Verbinden mit einem zweiten Bauelement Component for connecting to a second device |
| 03/12/2008 | EP1898683A1 Multilayer printed wiring board |
| 03/12/2008 | EP1898682A2 Metallised plastic surface and method for processing and metallising plastic surfaces |
| 03/12/2008 | EP1897975A1 Deposition of conductive polymer and metallization of non-conductive substrates |
| 03/12/2008 | EP1897974A1 Deposition of conductive polymer and metallization of non-conductive substrates |
| 03/12/2008 | EP1897973A1 Deposition of conductive polymer and metallization of non-conductive substrates |
| 03/12/2008 | EP1897971A1 Method for electrically conductive circuit formation |