| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/31/2008 | US20080180118 Substrate for probe card assembly, method of manufacturing substrate for probe card assembly and method of inspecting semiconductor wafer |
| 07/31/2008 | US20080179740 Package substrate, method of fabricating the same and chip package |
| 07/31/2008 | US20080179379 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
| 07/31/2008 | US20080179279 Method for Electrochemical Fabrication |
| 07/31/2008 | US20080179083 Electrical terminal footprints for a printed circuit board |
| 07/31/2008 | US20080179081 Direct Applied Monolithic Printed Circuit Technology |
| 07/31/2008 | US20080179079 Printed-Wiring Board, Bending Processing Method for Printed-Wiring Board, and Electronic Equipment |
| 07/31/2008 | US20080178999 Forming plated through hole; surface roughness facilitates deposition of conductive metal; shrinkage inhibition |
| 07/31/2008 | US20080178723 Semiconductor device manufacturing method and manufacturing apparatus |
| 07/31/2008 | US20080178464 Method for fabricating circuit board |
| 07/31/2008 | US20080178463 Modular board device, high frequency module, and method of manufacturing the same |
| 07/31/2008 | DE19702505B4 Vorrichtung zum Führen zweier ineinander angeordneter Objektivtuben Device for guiding two interlocked arranged lens tubes |
| 07/31/2008 | DE19646369B4 Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung Ceramic multi-layer circuit, and process for their preparation |
| 07/31/2008 | DE102007062547A1 Method for manufacturing of housing of electronic unit, particularly antenna amplifier in vehicle, involves integrating electronic unit in vehicle and subjecting housing to processing step after its manufacturing |
| 07/31/2008 | DE102007049939A1 Verfahren zum Herstellen einer Leiterplatte A method of manufacturing a printed circuit board |
| 07/31/2008 | CA2619144A1 Electronic board incorporating a heater wire |
| 07/30/2008 | EP1951016A1 Flex rigid wiring board and method for manufacturing the same |
| 07/30/2008 | EP1951015A1 Printed wiring board and method for manufacturing printed wiring board |
| 07/30/2008 | EP1951014A2 Junction structure of flexible substrate |
| 07/30/2008 | EP1951013A2 Connector applied underfill |
| 07/30/2008 | EP1951012A1 Method of manufacturing a wiring board including electroplating |
| 07/30/2008 | EP1951011A2 Electronic device installed in an engine room |
| 07/30/2008 | EP1951010A1 Connecting structure for circuit board |
| 07/30/2008 | EP1951008A1 Method for manufacturing flexible electric devices and flexible electric device |
| 07/30/2008 | EP1950851A1 Spiral contact and process for producing the same |
| 07/30/2008 | EP1950806A1 Interposer with built-in passive part |
| 07/30/2008 | EP1950775A1 Monolithic ceramic capacitor |
| 07/30/2008 | EP1950767A1 Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board |
| 07/30/2008 | EP1950326A1 Method for removal of bulk metal contamination from III-V semiconductor substrates |
| 07/30/2008 | EP1949774A1 Method for connecting printed circuit boards |
| 07/30/2008 | EP1949773A2 Three-dimensional printed circuit board |
| 07/30/2008 | EP1949772A1 Method for preparing a conductive feature on a substrate |
| 07/30/2008 | EP1949771A1 Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
| 07/30/2008 | EP1949770A2 Method of manufacturing a package carrier for enclosing at least one microelectronic element and method of manufacturing a diagnostic device |
| 07/30/2008 | EP1949493A2 Method for an element using two resist layers |
| 07/30/2008 | EP1949461A2 Assembling lighting elements onto a substrate |
| 07/30/2008 | EP1726197B1 An element for carrying electronic components |
| 07/30/2008 | EP1585614A4 Mixed alloy lead-free solder paste |
| 07/30/2008 | EP1500043B1 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 07/30/2008 | EP1374297B1 Flip chip interconnection using no-clean flux |
| 07/30/2008 | EP1121008B1 Multilayer printed wiring board and method for manufacturing the same |
| 07/30/2008 | CN201093050Y Stannum wave generator belt roller |
| 07/30/2008 | CN201091950Y Tin wave producer |
| 07/30/2008 | CN201091949Y Tin wave generating apparatus |
| 07/30/2008 | CN101233795A Multilayered circuit board and electronic equipment |
| 07/30/2008 | CN101233794A Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| 07/30/2008 | CN101233793A Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| 07/30/2008 | CN101233619A A package and manufacturing method for a microelectronic component |
| 07/30/2008 | CN101233608A Process for producing junction structure |
| 07/30/2008 | CN101233264A Composite metal layer formed using metal nanocrystalline particles in an electroplating bath |
| 07/30/2008 | CN101232967A Lead free solder paste and application thereof |
| 07/30/2008 | CN101232783A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232782A Printed circuit board mask hole electroplating molding process |
| 07/30/2008 | CN101232781A Technique improvement of drawing electronic component circuit diagram on ceramic base plate |
| 07/30/2008 | CN101232780A Method for manufacturing printed circuit board with built-in capacitor |
| 07/30/2008 | CN101232779A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232778A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232777A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232776A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232775A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232774A High heat conductivity ceramic base printed circuit board and method for making the same |
| 07/30/2008 | CN101232773A Flexible printed circuit board |
| 07/30/2008 | CN101232128A Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 07/30/2008 | CN101232009A Mounting structures for integrated circuit modules |
| 07/30/2008 | CN101231908A Methods of making high capacitance density embedded ceramic capacitors |
| 07/30/2008 | CN101231394A 显示装置 The display device |
| 07/30/2008 | CN101230241A Adhesive for electrode connection and connecting method using it |
| 07/30/2008 | CN101229711A Test method and mechanism of single optic axis in visual imprinter |
| 07/30/2008 | CN101229601A Device, method and program for soldering |
| 07/30/2008 | CN100407882C 用于基板和印刷电路板的贯通接触的方法和设备 A method and apparatus for penetrating contact with the substrate and the printed circuit board |
| 07/30/2008 | CN100407881C 压合装置 Compression fittings |
| 07/30/2008 | CN100407880C 回流焊炉 Reflow |
| 07/30/2008 | CN100407879C 电容器内置型印刷电路板制造方法 Capacitor built-in printed circuit board manufacturing method |
| 07/30/2008 | CN100407878C 一种检查一致性的方法与装置 Method and apparatus for checking the consistency of |
| 07/30/2008 | CN100407877C 用于减少多层电路板的层数的技术 Reduce the number of layers of the multilayer circuit board technology for |
| 07/30/2008 | CN100407517C 汇流条的焊接槽 Busbar welding groove |
| 07/30/2008 | CN100407514C 用于高压放电灯的灯座和高压放电灯 Lamps and high-pressure discharge lamp for a high pressure discharge lamp |
| 07/30/2008 | CN100407505C 压接触类型的配接器 Press-contact type of adapter |
| 07/30/2008 | CN100407417C 小轨迹半导体装置包装 Small track semiconductor device packaging |
| 07/30/2008 | CN100407413C 电路基板、焊球网格阵列的安装结构和电光装置 A circuit board, the ball grid array mounting structure and the electro-optical device |
| 07/30/2008 | CN100407389C 半导体装置及使用此半导体装置的放射线检测器 The semiconductor device and the radiation detector using the semiconductor device |
| 07/30/2008 | CN100407388C 半导体装置及使用此半导体装置的放射线检测器 The semiconductor device and the radiation detector using the semiconductor device |
| 07/30/2008 | CN100407340C 导电浆料 Conductive paste |
| 07/30/2008 | CN100406873C 固化性粘合剂组合物的固化物固化水平的非破坏测试方法和电子装置的制造方法 The method of manufacturing a curable adhesive composition cured cured level of non-destructive testing method and electronic device |
| 07/30/2008 | CN100406613C Laser induced selective chemical plating process |
| 07/30/2008 | CN100406523C Curable composition, varnish, and layered product |
| 07/30/2008 | CN100406253C Stencil printer for printing adhesive material and printing head |
| 07/30/2008 | CN100406166C Metal powder and preparing method thereof |
| 07/29/2008 | US7406191 Inspection data producing method and board inspection apparatus using the method |
| 07/29/2008 | US7406003 Multifunctional timepiece module with application specific printed circuit boards |
| 07/29/2008 | US7405948 Circuit board device and method of interconnecting wiring boards |
| 07/29/2008 | US7405664 Radio frequency IC tag and method for manufacturing the same |
| 07/29/2008 | US7405638 Coaxial waveguide microstructures having an active device and methods of formation thereof |
| 07/29/2008 | US7405484 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 07/29/2008 | US7405475 Method and system of tape automated bonding |
| 07/29/2008 | US7405471 Carrier-based electronic module |
| 07/29/2008 | US7405387 System and method for attenuating the effect of ambient light on an optical sensor |
| 07/29/2008 | US7405364 Decoupled signal-power substrate architecture |
| 07/29/2008 | US7405363 Connecting sheet |
| 07/29/2008 | US7405362 Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same |