| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/28/2008 | CN201066959Y A mounting tool |
| 05/28/2008 | CN201066630Y An interface board circuit for capacitor encapsulation welding machine |
| 05/28/2008 | CN101189928A A method of supporting electronic components and an electronic device with elestic support for an electronic component |
| 05/28/2008 | CN101189926A Multi-layer wiring board |
| 05/28/2008 | CN101189925A 嵌入式电容结构 Embedded capacitor structure |
| 05/28/2008 | CN101189924A Mold for wiring substrate formation and process for producing the same, wiring substrate and process for producing the same, process for producing multilayered laminated wiring substrate and method fo |
| 05/28/2008 | CN101189923A Pattern forming method and method for forming multilayer wiring structure |
| 05/28/2008 | CN101189922A Printed wiring board with a pin for mounting a component and an electronic device using it |
| 05/28/2008 | CN101189921A Circuit base plate and its making method and electronic component using the same |
| 05/28/2008 | CN101189717A Printed wiring board with built-in semiconductor element and method for manufacturing same |
| 05/28/2008 | CN101189557A Permanent patterning method |
| 05/28/2008 | CN101189550A Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same |
| 05/28/2008 | CN101188930A Supplying and reclaiming device for viscous electric material in electronic components mounting device |
| 05/28/2008 | CN101188926A Heat conduction bus, particularly for a microprocessor-based computation unit |
| 05/28/2008 | CN101188916A Method for making flexible circuit board with differential break structure |
| 05/28/2008 | CN101188915A Method of manufacturing a component-embedded printed circuit board |
| 05/28/2008 | CN101188914A Method of manufacturing printed circuit board |
| 05/28/2008 | CN101188913A A making technology and device for PCB board |
| 05/28/2008 | CN101188912A A tin-soldering furnace pot mouth with pin protection block |
| 05/28/2008 | CN101188911A A single-point soldering pot mouth with overflow tin hole |
| 05/28/2008 | CN101188910A A PCB tin soldering technology |
| 05/28/2008 | CN101188909A A flexible circuit board and its copper plating method |
| 05/28/2008 | CN101188908A Film lamination structure for vacuum film laminator |
| 05/28/2008 | CN101188907A Printed wiring board manufacturing apparatus, printed wiring board, method for manufacturing printed wiring board, and electronic device |
| 05/28/2008 | CN101188906A Adhesive film cutting device and method and adhesive film attachment apparatus and method |
| 05/28/2008 | CN101188905A Method of producing printed circuit board incorporating resistance element |
| 05/28/2008 | CN101188904A Circuit board assembly |
| 05/28/2008 | CN101188903A Multilayer printing circuit board |
| 05/28/2008 | CN101188164A An instantaneous voltage restraint component and its making method |
| 05/28/2008 | CN101188113A Suspension board with circuit and producing method thereof |
| 05/28/2008 | CN101186826A Regeneration process of alkaline permanganate etching solution and unit therefor |
| 05/28/2008 | CN100391320C Method for producing multilayer printed circuit board |
| 05/28/2008 | CN100391319C Single board able to realize live-wire insertion and its realizing method |
| 05/28/2008 | CN100391317C Electric connecting part |
| 05/28/2008 | CN100390989C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 05/28/2008 | CN100390984C Manufacture method of lead frame |
| 05/28/2008 | CN100390982C Semiconductor device and method of manufacturing semiconductor device |
| 05/28/2008 | CN100390980C Signal line circuit device |
| 05/28/2008 | CN100390972C Method and device for producing multi-layer ceramic substrate |
| 05/28/2008 | CN100390969C Semiconductor device |
| 05/28/2008 | CN100390951C Method for manufacturing electronic component-mounted board |
| 05/28/2008 | CN100390909C Infrared shield of capacitor |
| 05/28/2008 | CN100390319C Method of plating nonconductor product |
| 05/28/2008 | CN100390318C Method for repairing fine pattern and apparatus for repairing fine pattern |
| 05/27/2008 | US7379306 Multilayer substrate including components therein |
| 05/27/2008 | US7378937 Chip resistor and method of making the same |
| 05/27/2008 | US7378794 Structures for coupling and grounding a circuit board in a plasma display device |
| 05/27/2008 | US7378685 Flat display device |
| 05/27/2008 | US7378599 Printed circuit board, radio wave receiving converter, and antenna device |
| 05/27/2008 | US7378598 Printed circuit board substrate and method for constructing same |
| 05/27/2008 | US7378596 Rigid-flex wiring board |
| 05/27/2008 | US7378326 Printed circuit board with embedded capacitors therein and manufacturing process thereof |
| 05/27/2008 | US7378228 using a multilayer insulating coating of an epoxy resin having two or more epoxy groups in one molecule, a modified phenolic resin having a triazine ring, a basic curing agent such as imidazole compound, a photosensitive acid generator, heat curing; fireproofing; dilution wtih MEK or other solvents |
| 05/27/2008 | US7378227 Reduces the tendency of the copper etch step from under-cutting the nickel/gold to cause slivers that cause short circuiting by providing a conforming nickel/gold layer that extends down the side of the traces |
| 05/27/2008 | US7378225 Method of forming a metal pattern on a substrate |
| 05/27/2008 | US7378184 Battery holder |
| 05/27/2008 | US7378049 Method for producing ceramic substrate and electronic component module using ceramic substrate |
| 05/27/2008 | US7377990 Process for securing a microwave module to a support |
| 05/27/2008 | US7377610 Droplet discharge control method and liquid discharge apparatus |
| 05/27/2008 | US7377032 Process for producing a printed wiring board for mounting electronic components |
| 05/27/2008 | US7377031 Fabrication method of semiconductor integrated circuit device |
| 05/27/2008 | US7377030 Wiring board manufacturing method |
| 05/22/2008 | WO2008060256A2 Three-dimensional printed circuit board and manufacturing method thereof |
| 05/22/2008 | WO2008059654A1 Composition for preventing solder flux scrambling, electronic member for soldering coated with the composition, method of soldering the member, and electrical product |
| 05/22/2008 | WO2008059571A1 Circuit board connection structure and circuit board |
| 05/22/2008 | WO2008059162A2 Printed substrate through which very strong currents can pass and corresponding production method |
| 05/22/2008 | WO2008058828A1 Standardized electronics housing having modular contact partners |
| 05/22/2008 | WO2008058782A1 Electronic circuit arrangement having at least one flexible printed circuit, and method for connecting it to a second circuit |
| 05/22/2008 | WO2008058674A1 Installation for producing a circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound |
| 05/22/2008 | WO2008058673A2 Circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound and method for the production and use thereof |
| 05/22/2008 | WO2008035819A3 Electronic component mounting structure |
| 05/22/2008 | WO2008008177A3 Method and apparatus for clamping a substrate |
| 05/22/2008 | WO2007043884A3 Method and device for laser cutting at an acute angle of carriers for electronic components |
| 05/22/2008 | US20080119064 Joint member and joint connector for wire harness |
| 05/22/2008 | US20080119041 Method for fabricating closed vias in a printed circuit board |
| 05/22/2008 | US20080119038 Use of palladium in ic manufacturing with conductive polymer bump |
| 05/22/2008 | US20080119029 Wafer scale thin film package |
| 05/22/2008 | US20080118867 Comprising support and photosensitive layer wherein photosensitive layer comprises a polymerization inhibitor, a binder, a polymerizable compound, and a photopolymerization initiator, the photosensitive layer being exposed by means of laser beam and developed by means of developer to form pattern; wiring |
| 05/22/2008 | US20080118199 Substrate for mounting ic chip, substrate for motherboard, device for optical communication , manufacturing method of substrate for mounting ic chip, and manufacturing method of substrate for motherboard |
| 05/22/2008 | US20080117609 Multi-layer electronic part built-in board |
| 05/22/2008 | US20080117608 Printed circuit board and fabricating method thereof |
| 05/22/2008 | US20080117607 Electronic component and method for manufacturing the same |
| 05/22/2008 | US20080116611 Method of Manufacturing Multilayer Wiring Board |
| 05/22/2008 | US20080116608 Molded waveguides |
| 05/22/2008 | US20080116588 Assembly and Method of Placing the Assembly on an External Board |
| 05/22/2008 | US20080116166 Method for manufacturing multilayer flexible printed circuit board |
| 05/22/2008 | US20080116075 Method of Assessing the Risk of Whiskers Appearing on the Surface of a Metallic Deposit |
| 05/22/2008 | US20080115965 Method and System for Placing Multiple Loads in a High-Speed System |
| 05/22/2008 | US20080115962 Suspension board with circuit and producing method thereof |
| 05/22/2008 | US20080115961 Printed circuit board and manufacturing method thereof |
| 05/22/2008 | US20080115886 Method of producing printed circuit board incorporating resistance element |
| 05/22/2008 | US20080115355 Method of manufacturing printed circuit board |
| 05/22/2008 | US20080115354 Probe unit and its manufacturing method |
| 05/22/2008 | US20080115353 Lithographic contact elements |
| 05/22/2008 | US20080115352 Electronic device and method of manufacturing the same |
| 05/22/2008 | US20080115351 Wiring board, method of manufacturing wiring board, and electronic device |
| 05/22/2008 | US20080115350 Metal substrate having electronic devices formed thereon |
| 05/22/2008 | US20080115349 Method of manufacturing a component-embedded printed circuit board |
| 05/22/2008 | CA2668048A1 Printed substrate through which very strong currents can pass and corresponding production method |
| 05/21/2008 | EP1924130A2 Conductive connecting pin and package substrate |