Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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06/11/2008 | CN101199021A A method in the fabrication of a ferroelectric memory device |
06/11/2008 | CN101198908A Image processing device, image drawing device, and system |
06/11/2008 | CN101198902A Soft lithographic stamp with a chemically patterned surface |
06/11/2008 | CN101198671A Adhesive and adhesive sheet |
06/11/2008 | CN101198477A Screen printing plate and screen printer |
06/11/2008 | CN101198247A PCB plate pasting method and pasted device |
06/11/2008 | CN101198227A Split type soldering tin stove pot port of stannum overflowing hole |
06/11/2008 | CN101198226A Automatically selective soldering tin stove impeller transmission device |
06/11/2008 | CN101198225A Primary heater unit for soldering tin stove pc board |
06/11/2008 | CN101198224A Soldering tin stove pot port with separating slice |
06/11/2008 | CN101198223A Quick-dismantling type soldering tin stove pot port |
06/11/2008 | CN101198222A Split type soldering tin stove pot port of stannum overflowing hole |
06/11/2008 | CN101198221A Segmenting stannum gushing technique of soldering tin stove |
06/11/2008 | CN101198220A Method of welding varnished wire and plated circuit soft plate in electronic component |
06/11/2008 | CN101198219A Method for producing printed circuit board and machine for processing the same |
06/11/2008 | CN101198218A Laser machining method for printed circuit board |
06/11/2008 | CN101198217A Parts wiring system and method |
06/11/2008 | CN101198213A Wiring substrate and method for manufacturing the same |
06/11/2008 | CN101198212A Multilayer soft printed wiring board and production method thereof |
06/11/2008 | CN101198211A Laminated substrate and manufacturing method thereof |
06/11/2008 | CN101198210A Multilayer substrate and method of manufacturing the same |
06/11/2008 | CN101198209A Circuit board welding pad structure and manufacturing method thereof |
06/11/2008 | CN101198208A Substrate with multi-layer plating through hole and multi-layer plating through hole forming method thereof |
06/11/2008 | CN101197462A Production method for RFID etching aluminum antenna |
06/11/2008 | CN101197461A Electronic device and RF module |
06/11/2008 | CN101197361A Power module and method of manufacturing the same |
06/11/2008 | CN101196686A Photosensitive resin composition and use of the same |
06/11/2008 | CN101195295A Printing and manufacturing apparatus, and manufacturing method for electronic parts |
06/11/2008 | CN100394601C Semiconductor chip, semiconductor wafer and semiconductor device and its manufacturing method |
06/11/2008 | CN100394600C Surface mounted electrical components and method for mounting and retaining same |
06/11/2008 | CN100394597C Integrated circuit package with a capacitor |
06/11/2008 | CN100394564C Wiring substrate and manufacturing method thereof |
06/11/2008 | CN100394335C Method for determining positioning hole location in printed circuit board producing controller |
06/11/2008 | CN100393836C Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
06/11/2008 | CN100393802C Resin composition, and use and method for preparing the same |
06/11/2008 | CN100393471C Non-eutectic solder composition and method for forming leadless solder melting system |
06/11/2008 | CN100393470C Laser beam machine |
06/10/2008 | US7385792 Electronic control apparatus |
06/10/2008 | US7385288 Electronic packaging using conductive interproser connector |
06/10/2008 | US7385286 Semiconductor module |
06/10/2008 | US7385146 Printed wiring board and method for manufacturing the same |
06/10/2008 | US7385144 Method and apparatus for electrically connecting printed circuit boards or other panels |
06/10/2008 | US7384698 Metal article intended for at least partially coating with a substance and a method for producing the same |
06/10/2008 | US7384566 Fabrication method for printed circuit board |
06/10/2008 | US7384530 Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials |
06/10/2008 | US7384496 Security tag system for fabricating a tag including an integrated surface processing system |
06/10/2008 | US7384270 Electrical connector |
06/10/2008 | US7383977 Method for attaching a shield can to a PCB and a shield can therefor |
06/10/2008 | US7383866 Manufacturing apparatus for manufacturing electronic monolithic ceramic components |
06/10/2008 | US7383770 Printing device for electronic parts having a roller and a squeegee arrangement |
06/10/2008 | US7383630 Method for making a circuit plate |
06/10/2008 | US7383629 Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof |
06/05/2008 | WO2008066133A1 Method for manufacturing metallized ceramic substrate chip |
06/05/2008 | WO2008066028A1 Interposer with built-in passive part |
06/05/2008 | WO2008065997A1 Adhesive and connection structure using the same |
06/05/2008 | WO2008065976A1 Method for forming conductive pattern |
06/05/2008 | WO2008065926A1 Electronic component mounting structure and method for manufacturing the same |
06/05/2008 | WO2008065905A1 Photosensitive resin composition, and flexible print circuit board using the same |
06/05/2008 | WO2008065774A1 Wiring board and display unit |
06/05/2008 | WO2008065076A1 Electrical printed circuit board comprising a terminal connection |
06/05/2008 | WO2008065069A1 Device and method for electroplating |
06/05/2008 | WO2008007237A3 Submount for electronic components |
06/05/2008 | US20080132156 Polishing composition and polishing method |
06/05/2008 | US20080132096 Board Mounted Electrical Connector |
06/05/2008 | US20080131722 Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices |
06/05/2008 | US20080131673 Method for Producing Metallized Ceramic Substrate |
06/05/2008 | US20080131658 Electronic packages and components thereof formed by co-deposited carbon nanotubes |
06/05/2008 | US20080131639 Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same |
06/05/2008 | US20080130254 Electronic device with reworkable electronic component, method of fabricating the electronic device and method of reworking the electronic component |
06/05/2008 | US20080130242 Using the wave soldering process to attach motherboard chipset heat sinks |
06/05/2008 | US20080130241 Method and apparatus for supporting a computer chip on a printed circuit board assembly |
06/05/2008 | US20080128894 Support body for semiconductor element, method for manufacturing the same and semiconductor device |
06/05/2008 | US20080128873 Semiconductor device and printed circuit board |
06/05/2008 | US20080128636 Gas analyzing system, lithographic apparatus and method of improving a sensitivity of a gas analyzing system |
06/05/2008 | US20080128160 Soldering an electronics package to a motherboard |
06/05/2008 | US20080128159 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board |
06/05/2008 | US20080128158 Wire-Printed Circuit Board or Card Comprising Conductors with a Rectangular or Square Cross Section |
06/05/2008 | US20080127489 Wiring substrate, manufacturing method thereof, and semiconductor device |
06/05/2008 | US20080127488 Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom |
06/05/2008 | US20080127486 Component Mounting Apparatus And Component Mounting Method |
06/05/2008 | US20080127485 Vents with signal image for signal return path |
06/05/2008 | US20080127484 Selective filling of through holes |
06/05/2008 | US20080127482 High Isolation Tunable MEMS Capacitive Switch |
06/05/2008 | DE19528411B4 Verfahren zur Herstellung einer Folie aus aromatischem Polyamid A process for producing a film made of aromatic polyamide |
06/05/2008 | DE10227342B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
06/05/2008 | DE102006057096A1 Electronic-compound structure manufacturing method for e.g. transmission controller, involves joining printed circuit board, adhesive layer and base plate to compound structure, where adhesive layer projects in area of punching edges |
06/05/2008 | DE102006055871A1 Arrangement made of electrical printed board, has hole, whose lateral surface is connected in metalized and electrically conducted manner with conductor available on printed board and made of electrical function part |
06/05/2008 | DE10044429B4 Elektrische Keramikkomponente Electric ceramic component |
06/04/2008 | EP1928222A1 Packaging method of electronic component module, method for manufacturing electronic apparatus using it, and electronic component module |
06/04/2008 | EP1928220A2 Wiring board and method of manufacturing the same |
06/04/2008 | EP1928219A2 Imaging apparatus for fully automatic screen printer |
06/04/2008 | EP1928218A1 Flexible printed wiring board and method for manufacturing same |
06/04/2008 | EP1928217A2 Element mounting structure and element mounting method |
06/04/2008 | EP1928022A1 Interposer and electronic device using the same |
06/04/2008 | EP1928008A1 Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement |
06/04/2008 | EP1927941A1 Chipcard with antenna and method of making the same |
06/04/2008 | EP1927275A1 Printing template of an smt process and method of coating it |
06/04/2008 | EP1927274A2 Led lighting with integrated heat sink and process for manufacturing same |
06/04/2008 | EP1927132A2 Power semiconductor module and a method for the production thereof |
06/04/2008 | EP1926637A2 Combined fastening and contacting system for electrical components on superimposed circuit boards |