Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2008
06/11/2008CN101199021A A method in the fabrication of a ferroelectric memory device
06/11/2008CN101198908A Image processing device, image drawing device, and system
06/11/2008CN101198902A Soft lithographic stamp with a chemically patterned surface
06/11/2008CN101198671A Adhesive and adhesive sheet
06/11/2008CN101198477A Screen printing plate and screen printer
06/11/2008CN101198247A PCB plate pasting method and pasted device
06/11/2008CN101198227A Split type soldering tin stove pot port of stannum overflowing hole
06/11/2008CN101198226A Automatically selective soldering tin stove impeller transmission device
06/11/2008CN101198225A Primary heater unit for soldering tin stove pc board
06/11/2008CN101198224A Soldering tin stove pot port with separating slice
06/11/2008CN101198223A Quick-dismantling type soldering tin stove pot port
06/11/2008CN101198222A Split type soldering tin stove pot port of stannum overflowing hole
06/11/2008CN101198221A Segmenting stannum gushing technique of soldering tin stove
06/11/2008CN101198220A Method of welding varnished wire and plated circuit soft plate in electronic component
06/11/2008CN101198219A Method for producing printed circuit board and machine for processing the same
06/11/2008CN101198218A Laser machining method for printed circuit board
06/11/2008CN101198217A Parts wiring system and method
06/11/2008CN101198213A Wiring substrate and method for manufacturing the same
06/11/2008CN101198212A Multilayer soft printed wiring board and production method thereof
06/11/2008CN101198211A Laminated substrate and manufacturing method thereof
06/11/2008CN101198210A Multilayer substrate and method of manufacturing the same
06/11/2008CN101198209A Circuit board welding pad structure and manufacturing method thereof
06/11/2008CN101198208A Substrate with multi-layer plating through hole and multi-layer plating through hole forming method thereof
06/11/2008CN101197462A Production method for RFID etching aluminum antenna
06/11/2008CN101197461A Electronic device and RF module
06/11/2008CN101197361A Power module and method of manufacturing the same
06/11/2008CN101196686A Photosensitive resin composition and use of the same
06/11/2008CN101195295A Printing and manufacturing apparatus, and manufacturing method for electronic parts
06/11/2008CN100394601C Semiconductor chip, semiconductor wafer and semiconductor device and its manufacturing method
06/11/2008CN100394600C Surface mounted electrical components and method for mounting and retaining same
06/11/2008CN100394597C Integrated circuit package with a capacitor
06/11/2008CN100394564C Wiring substrate and manufacturing method thereof
06/11/2008CN100394335C Method for determining positioning hole location in printed circuit board producing controller
06/11/2008CN100393836C Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
06/11/2008CN100393802C Resin composition, and use and method for preparing the same
06/11/2008CN100393471C Non-eutectic solder composition and method for forming leadless solder melting system
06/11/2008CN100393470C Laser beam machine
06/10/2008US7385792 Electronic control apparatus
06/10/2008US7385288 Electronic packaging using conductive interproser connector
06/10/2008US7385286 Semiconductor module
06/10/2008US7385146 Printed wiring board and method for manufacturing the same
06/10/2008US7385144 Method and apparatus for electrically connecting printed circuit boards or other panels
06/10/2008US7384698 Metal article intended for at least partially coating with a substance and a method for producing the same
06/10/2008US7384566 Fabrication method for printed circuit board
06/10/2008US7384530 Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials
06/10/2008US7384496 Security tag system for fabricating a tag including an integrated surface processing system
06/10/2008US7384270 Electrical connector
06/10/2008US7383977 Method for attaching a shield can to a PCB and a shield can therefor
06/10/2008US7383866 Manufacturing apparatus for manufacturing electronic monolithic ceramic components
06/10/2008US7383770 Printing device for electronic parts having a roller and a squeegee arrangement
06/10/2008US7383630 Method for making a circuit plate
06/10/2008US7383629 Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
06/05/2008WO2008066133A1 Method for manufacturing metallized ceramic substrate chip
06/05/2008WO2008066028A1 Interposer with built-in passive part
06/05/2008WO2008065997A1 Adhesive and connection structure using the same
06/05/2008WO2008065976A1 Method for forming conductive pattern
06/05/2008WO2008065926A1 Electronic component mounting structure and method for manufacturing the same
06/05/2008WO2008065905A1 Photosensitive resin composition, and flexible print circuit board using the same
06/05/2008WO2008065774A1 Wiring board and display unit
06/05/2008WO2008065076A1 Electrical printed circuit board comprising a terminal connection
06/05/2008WO2008065069A1 Device and method for electroplating
06/05/2008WO2008007237A3 Submount for electronic components
06/05/2008US20080132156 Polishing composition and polishing method
06/05/2008US20080132096 Board Mounted Electrical Connector
06/05/2008US20080131722 Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
06/05/2008US20080131673 Method for Producing Metallized Ceramic Substrate
06/05/2008US20080131658 Electronic packages and components thereof formed by co-deposited carbon nanotubes
06/05/2008US20080131639 Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same
06/05/2008US20080130254 Electronic device with reworkable electronic component, method of fabricating the electronic device and method of reworking the electronic component
06/05/2008US20080130242 Using the wave soldering process to attach motherboard chipset heat sinks
06/05/2008US20080130241 Method and apparatus for supporting a computer chip on a printed circuit board assembly
06/05/2008US20080128894 Support body for semiconductor element, method for manufacturing the same and semiconductor device
06/05/2008US20080128873 Semiconductor device and printed circuit board
06/05/2008US20080128636 Gas analyzing system, lithographic apparatus and method of improving a sensitivity of a gas analyzing system
06/05/2008US20080128160 Soldering an electronics package to a motherboard
06/05/2008US20080128159 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board
06/05/2008US20080128158 Wire-Printed Circuit Board or Card Comprising Conductors with a Rectangular or Square Cross Section
06/05/2008US20080127489 Wiring substrate, manufacturing method thereof, and semiconductor device
06/05/2008US20080127488 Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom
06/05/2008US20080127486 Component Mounting Apparatus And Component Mounting Method
06/05/2008US20080127485 Vents with signal image for signal return path
06/05/2008US20080127484 Selective filling of through holes
06/05/2008US20080127482 High Isolation Tunable MEMS Capacitive Switch
06/05/2008DE19528411B4 Verfahren zur Herstellung einer Folie aus aromatischem Polyamid A process for producing a film made of aromatic polyamide
06/05/2008DE10227342B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement
06/05/2008DE102006057096A1 Electronic-compound structure manufacturing method for e.g. transmission controller, involves joining printed circuit board, adhesive layer and base plate to compound structure, where adhesive layer projects in area of punching edges
06/05/2008DE102006055871A1 Arrangement made of electrical printed board, has hole, whose lateral surface is connected in metalized and electrically conducted manner with conductor available on printed board and made of electrical function part
06/05/2008DE10044429B4 Elektrische Keramikkomponente Electric ceramic component
06/04/2008EP1928222A1 Packaging method of electronic component module, method for manufacturing electronic apparatus using it, and electronic component module
06/04/2008EP1928220A2 Wiring board and method of manufacturing the same
06/04/2008EP1928219A2 Imaging apparatus for fully automatic screen printer
06/04/2008EP1928218A1 Flexible printed wiring board and method for manufacturing same
06/04/2008EP1928217A2 Element mounting structure and element mounting method
06/04/2008EP1928022A1 Interposer and electronic device using the same
06/04/2008EP1928008A1 Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
06/04/2008EP1927941A1 Chipcard with antenna and method of making the same
06/04/2008EP1927275A1 Printing template of an smt process and method of coating it
06/04/2008EP1927274A2 Led lighting with integrated heat sink and process for manufacturing same
06/04/2008EP1927132A2 Power semiconductor module and a method for the production thereof
06/04/2008EP1926637A2 Combined fastening and contacting system for electrical components on superimposed circuit boards