| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/14/2008 | EP1921910A2 Circuit with a power module that is combined with a circuit board |
| 05/14/2008 | EP1921908A2 Circuit assembly with a power module that is combined with a circuit board |
| 05/14/2008 | EP1921904A1 Ceramic electronic component and method for manufacturing the same |
| 05/14/2008 | EP1921903A2 Electric power module |
| 05/14/2008 | EP1921902A2 Printed wiring board and method for manufacturing the same |
| 05/14/2008 | EP1921643A2 Pressure contact array |
| 05/14/2008 | EP1921176A2 Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity |
| 05/14/2008 | EP1714530B1 Method for increasing a routing density for a circuit board and such a circuit board |
| 05/14/2008 | EP1537601B1 Jet singulation of a substrate |
| 05/14/2008 | EP1344435B1 Parallel plane substrate |
| 05/14/2008 | EP1011139B1 Printed wiring board and method for manufacturing the same |
| 05/14/2008 | CN201060932Y Antenna module of global positioning system |
| 05/14/2008 | CN101180727A Printed wiring board |
| 05/14/2008 | CN101180578A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board |
| 05/14/2008 | CN101180247A Ceramic substrate and method of manufacturing same |
| 05/14/2008 | CN101179908A Inner opening L-shaped stannum port of spilled stannum port |
| 05/14/2008 | CN101179907A One face single open type stannum export of wide spilled stannum port |
| 05/14/2008 | CN101179906A Inner opening-shaped stannum port of spilled stannum port |
| 05/14/2008 | CN101179905A Stannum export of stannum furnace |
| 05/14/2008 | CN101179904A One face single open type stannum export of long spilled stannum port |
| 05/14/2008 | CN101179903A Spilled stannum port with external L-shaped stannum export |
| 05/14/2008 | CN101179902A Spilled stannum port with external stannum baffle type stannum export |
| 05/14/2008 | CN101179901A Circuit board output terminal bevelling machine |
| 05/14/2008 | CN101179899A Aluminum cooling substrates with electric insulation property and method for making the same |
| 05/14/2008 | CN101179049A Method of forming contact hole, method of manufacturing wiring board, method of manufacturing semiconductor device, and method of manufacturing electro-optical device |
| 05/14/2008 | CN101179039A Method of manufacturing semiconductor device |
| 05/14/2008 | CN101179035A Tin paste printed steel mesh opening method of pin-free flat pack type dense-feet-free type component |
| 05/14/2008 | CN101179034A Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component |
| 05/14/2008 | CN101178968A Current sensing transformer, method of manufacturing current sensing transformer, lamp power supply having the current sensing transformer, and liquid crystal display having the lamp power supply |
| 05/14/2008 | CN101178960A Electrical assembly comprising PTC-resistor elements |
| 05/14/2008 | CN101178417A High-precision rogowski current transformer |
| 05/14/2008 | CN101177657A Striping agent additive on printed circuit board and method for producing the same |
| 05/14/2008 | CN100388555C Microstrip line |
| 05/14/2008 | CN100388512C Surface-mountable miniature light-emitting diode and/or photodiode and method for the production thereof |
| 05/14/2008 | CN100388475C Lead carriage and packing structure using same |
| 05/14/2008 | CN100388469C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 05/14/2008 | CN100388468C Holder and mask structure, interconnected circuit structure and its manufacturing method |
| 05/14/2008 | CN100388467C Semiconductor package and producing method thereof and semiconductor device |
| 05/14/2008 | CN100388449C Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another |
| 05/14/2008 | CN100387749C Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 05/14/2008 | CN100387642C Impregnated glass fiber strands and products including same |
| 05/14/2008 | CN100387547C Method for producing laminated dielectric |
| 05/13/2008 | US7372555 Method of fabrication of semiconductor integrated circuit device |
| 05/13/2008 | US7372459 Method for storing layers' information of a layers-made object |
| 05/13/2008 | US7372261 Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same |
| 05/13/2008 | US7372149 High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus |
| 05/13/2008 | US7372147 Supporting a circuit package including a substrate having a solder column array |
| 05/13/2008 | US7372143 Printed circuit board including via contributing to superior characteristic impedance |
| 05/13/2008 | US7372139 Semiconductor chip package |
| 05/13/2008 | US7372138 Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods |
| 05/13/2008 | US7372132 Resin encapsulated semiconductor device and the production method |
| 05/13/2008 | US7372131 Routing element for use in semiconductor device assemblies |
| 05/13/2008 | US7372006 Low cost heating devices manufactured from conductive loaded resin-based materials |
| 05/13/2008 | US7371976 Printed wiring board and method for manufacturing the same |
| 05/13/2008 | US7371975 Electronic packages and components thereof formed by substrate-imprinting |
| 05/13/2008 | US7371974 Multilayer printed wiring board |
| 05/13/2008 | US7371973 Contact node |
| 05/13/2008 | US7371970 Rigid-flex circuit board system |
| 05/13/2008 | US7371682 Production method for electronic component and electronic component |
| 05/13/2008 | US7371609 Stacked module systems and methods |
| 05/13/2008 | US7371471 Electromagnetic noise suppressing thin film |
| 05/13/2008 | US7371452 use in transmitted display devices such as liquid crystal displays; polymer layer containing a plurality of integral polymer conduit channels that contain at least two layers with at least one comprising a conductive material and the other serving a function beyond protection, such as guide light waves |
| 05/13/2008 | US7371299 Set of resin sheets and method for producing ceramic structure using the same, and ceramic structure |
| 05/13/2008 | US7371074 Connection structure for printed wiring board |
| 05/13/2008 | US7371072 Spring interconnect structures |
| 05/13/2008 | US7371071 Connection structure of circuit substrate |
| 05/13/2008 | US7370943 Structure and method for connecting flexible printed circuit board to inkjet print head |
| 05/13/2008 | US7370928 Droplet discharge control method and liquid discharge apparatus |
| 05/13/2008 | US7370415 Manufacturing method of ink-jet head |
| 05/13/2008 | US7370414 Methods for manufacturing lead frame connectors for optical transceiver modules |
| 05/13/2008 | US7370412 Method for connecting electronic device |
| 05/13/2008 | US7370411 Wiring board manufacturing method |
| 05/13/2008 | US7370410 Method of manufacturing a device, device, non-contact type card medium, and electronic equipment |
| 05/13/2008 | CA2454289C High speed circuit board and method for fabrication |
| 05/13/2008 | CA2452178C Circuitized substrate assembly and method of making same |
| 05/08/2008 | WO2008053987A1 Through electrode circuit substrate, through electrode circuit substrate formation method, introduction hole formation method, and electronic part having introduction hole |
| 05/08/2008 | WO2008053956A1 Ceramic substrate, electronic device and method for producing ceramic substrate |
| 05/08/2008 | WO2008053833A1 Multilayer printed wiring board |
| 05/08/2008 | WO2008053520A1 Flex rigid wiring board and method for manufacturing the same |
| 05/08/2008 | WO2008031981A3 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other |
| 05/08/2008 | WO2008012165A9 Method and wave soldering system for soldering components onto the top and bottom surface of a circuit board |
| 05/08/2008 | US20080108255 Method Of Attaching A Solder Element To Contact And The Contact Assembly Formed Thereby |
| 05/08/2008 | US20080108218 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/08/2008 | US20080108180 Nanoparticle filled underfill |
| 05/08/2008 | US20080107881 Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly |
| 05/08/2008 | US20080107863 Multilayered printed wiring board |
| 05/08/2008 | US20080107802 Flex-rigid wiring board |
| 05/08/2008 | US20080107375 Optoelectric composite substrate and method of manufacturing the same |
| 05/08/2008 | US20080106880 Wiring board and method of manufacturing the same |
| 05/08/2008 | US20080106877 System and method for manufacturing C-shaped leads |
| 05/08/2008 | US20080106876 Semiconductor memory module with reverse mounted chip resistor |
| 05/08/2008 | US20080106875 Circuit Device And Method Of Manufacturing The Same |
| 05/08/2008 | US20080106861 Multi-configuration processor-memory substrate device |
| 05/08/2008 | US20080106860 Multi-configuration processor-memory substrate device |
| 05/08/2008 | US20080106475 Printed wiring board with enhanced structural integrity |
| 05/08/2008 | US20080105557 Methods of and Apparatus for Forming Three-Dimensional Structures Integral with Semiconductor Based Circuitry |
| 05/08/2008 | US20080105460 Printed circuit board having fuse housings and electric junction box for vehicle |
| 05/08/2008 | US20080105458 Substrate for mounting flip chip and the manufacturing method thereof |
| 05/08/2008 | US20080105456 Flex-rigid wiring board |
| 05/08/2008 | US20080105455 Circuit board with regional flexibility |