| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/26/2008 | EP1902807A1 Vapour brazing process and device with a system for controlled delivering of a material in a vapoured phase |
| 03/26/2008 | EP1902601A2 Apparatus and methods for continuously depositing a pattern of material onto a substrate |
| 03/26/2008 | EP1902493A1 Use of heat-activated adhesive for manufacture and a device so manufactured |
| 03/26/2008 | EP1421609B1 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 03/26/2008 | CN201042108Y Water knife component structure for printed circuit board humid device |
| 03/26/2008 | CN201042107Y Thin film coiling device |
| 03/26/2008 | CN101151949A Method for soldering electronic component and soldering structure of electronic component |
| 03/26/2008 | CN101151948A Production method of solder circuit board |
| 03/26/2008 | CN101151947A Ball capturing device, solder ball arrangement device, ball capturing method, and solder ball arranging method |
| 03/26/2008 | CN101151943A Rigid/flexible printed circuit board |
| 03/26/2008 | CN101151722A Treatment of items |
| 03/26/2008 | CN101151682A Conductive paste and wiring board using it |
| 03/26/2008 | CN101151680A Conductor paste and electronic component |
| 03/26/2008 | CN101151579A Photosensitive resin composition and circuit substrate employing the same |
| 03/26/2008 | CN101151307A Surface graft material and producing method thereof, conductive material and producing method thereof, and conductive pattern material |
| 03/26/2008 | CN101150949A Precise positioning platform for fully automatic non lead-tin oil imprinter based on flexible machine |
| 03/26/2008 | CN101150931A Circuit board and its making method |
| 03/26/2008 | CN101150930A A graphic plating method for dual-side and multi-layer flexible printed circuit board |
| 03/26/2008 | CN101150929A One-side dual open kettle mouth with tin overflow mouth length |
| 03/26/2008 | CN101150928A One-side single open kettle mouth with tin overflow mouth width |
| 03/26/2008 | CN101150927A An open kettle mouth at tin overflow corner |
| 03/26/2008 | CN101150926A One-side single open kettle mouth with tin overflow mouth length |
| 03/26/2008 | CN101150925A A tin furnace kettle mouth |
| 03/26/2008 | CN101150924A A kettle mouth with tin apron at tin overflow mouth |
| 03/26/2008 | CN101150923A A kettle mouth with middle tin apron |
| 03/26/2008 | CN101150922A A tin overflow internal open loop kettle mouth |
| 03/26/2008 | CN101150921A A tin overflow concave external open kettle mouth |
| 03/26/2008 | CN101150920A A tin overflow concave internal open kettle mouth |
| 03/26/2008 | CN101150919A A tin overflow internal open protrusion kettle mouth |
| 03/26/2008 | CN101150918A A tin overflow internal open L kettle mouth |
| 03/26/2008 | CN101150917A A tin overflow external open circle kettle mouth |
| 03/26/2008 | CN101150916A Wave crest welding production line for simultaneously processing different products and its production method |
| 03/26/2008 | CN101150915A Alloy circuit board and manufacturing method thereof |
| 03/26/2008 | CN101150219A Directional coupler and RF circuit module |
| 03/26/2008 | CN101150121A Flexible circuits having improved reliability and thermal dissipation |
| 03/26/2008 | CN101150077A SMT-free encapsulation method of imaging sensor |
| 03/26/2008 | CN101150009A Plated terminations and method of forming using electrolytic plating |
| 03/26/2008 | CN101147996A Tin wave generator impeller |
| 03/26/2008 | CN100377634C Substrate holder and method for producing the same |
| 03/26/2008 | CN100377630C Circuit board and production method therefor |
| 03/26/2008 | CN100377629C Adhesive system and method for printed circuit board surface |
| 03/26/2008 | CN100377628C Figure forming method figure forming device and manufacturing method of device |
| 03/26/2008 | CN100377626C Printed circuit board and its wiring method |
| 03/26/2008 | CN100377625C 布线电路衬底及其制造方法 The wiring circuit substrate and a manufacturing method |
| 03/26/2008 | CN100377325C Film carrier tape for mounting electronic component |
| 03/26/2008 | CN100376649C 各向异性导电薄膜 Anisotropic conductive film |
| 03/26/2008 | CN100376563C Novel purpose of 4-(4-methyl-3-pentenyl)-4-cyclohexene-1, 2-diacid anhydride |
| 03/26/2008 | CN100376539C Novel application of 4-(4-methyl-3-pentenyl)-4-cyclohexene-1, 2-dicarboxylic acid |
| 03/26/2008 | CN100376400C Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same |
| 03/26/2008 | CN100376386C Polyimide-metal layered products and polyamideimide-metal layered product |
| 03/25/2008 | US7349224 Semiconductor device and printed circuit board |
| 03/25/2008 | US7349223 Enhanced compliant probe card systems having improved planarity |
| 03/25/2008 | US7348677 Method of providing printed circuit board with conductive holes and board resulting therefrom |
| 03/25/2008 | US7348662 Composite multi-layer substrate and module using the substrate |
| 03/25/2008 | US7348498 Partially voided anti-pads |
| 03/25/2008 | US7348496 Circuit board with organic dielectric layer |
| 03/25/2008 | US7348495 Uniform force hydrostatic bolster plate |
| 03/25/2008 | US7348493 Metal-ceramic circuit board |
| 03/25/2008 | US7348285 Fabric and yarn structures for improving signal integrity in fabric-based electrical circuits |
| 03/25/2008 | US7348261 Wafer scale thin film package |
| 03/25/2008 | US7348215 Methods for assembly and packaging of flip chip configured dice with interposer |
| 03/25/2008 | US7348213 Method for forming component mounting hole in semiconductor substrate |
| 03/25/2008 | US7348057 Acrylic adhesive sheet |
| 03/25/2008 | US7348045 A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. |
| 03/25/2008 | US7347950 Rigid flexible printed circuit board and method of fabricating same |
| 03/25/2008 | US7347750 Solder-bearing contacts and method of manufacture thereof and use in connectors |
| 03/25/2008 | US7347702 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 03/25/2008 | US7347348 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece |
| 03/25/2008 | US7346982 Method of fabricating printed circuit board having thin core layer |
| 03/25/2008 | US7346981 Method for fabricating microelectromechanical system (MEMS) devices |
| 03/20/2008 | WO2008033428A2 Compliance partitioning in testing of integrated circuits |
| 03/20/2008 | WO2008032870A2 Electronic components mounting adhesive and electronic components mounting structure |
| 03/20/2008 | WO2008032867A1 Electric components connecting method |
| 03/20/2008 | WO2008032866A1 Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure |
| 03/20/2008 | WO2008032756A1 Electronic component mounting system and electronic component mounting method |
| 03/20/2008 | WO2008032755A1 Electronic component placing apparatus and electronic component mounting method |
| 03/20/2008 | WO2008032674A1 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
| 03/20/2008 | WO2008032386A1 Junction structure, method of joining, wiring board and process for producing the same |
| 03/20/2008 | WO2008032383A1 Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board |
| 03/20/2008 | WO2008031981A2 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other |
| 03/20/2008 | WO2008031492A1 Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
| 03/20/2008 | WO2008031366A1 Printed circuit board, particularly ceramic circuit board |
| 03/20/2008 | WO2008014157A3 Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same |
| 03/20/2008 | WO2008012512A3 The formation of conductive metal regions on substrates |
| 03/20/2008 | US20080070453 Solder-bearing contacts and method of manufacture thereof and use in connectors |
| 03/20/2008 | US20080067948 Re-entrant resonant cavities and method of manufacturing such cavities |
| 03/20/2008 | US20080067662 Modularized Die Stacking System and Method |
| 03/20/2008 | US20080066954 Printed circuit board for package and manufacturing method thereof |
| 03/20/2008 | US20080066953 Circuit board assembly and manufacturing method thereof, electronic part assembly and manufacturing method thereof, and electronic device |
| 03/20/2008 | US20080066951 Multi-Dielectric material circuit board supporting high-speed and low-speed signaling |
| 03/20/2008 | US20080066950 Wiring board and method of manufacturing wiring board |
| 03/20/2008 | US20080066635 Method and apparatus for performing operations within a stencil printer |
| 03/20/2008 | US20080066305 Analyte sensors and methods |
| 03/20/2008 | US20080066304 Technique for laminating multiple substrates |
| 03/20/2008 | US20080066303 Semiconductor package |
| 03/20/2008 | US20080066302 Manufacturing method of package substrate |
| 03/20/2008 | US20080066296 Method for manufacturing an electric heating mirror and the mirror thereof |
| 03/20/2008 | US20080066279 Surface acoustic wave device and method for fabricating the same |
| 03/20/2008 | DE102004022178B4 Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn A method of fabricating a wiring on a substrate and the component to a conductor track manufactured in such a way |
| 03/20/2008 | CA2662851A1 Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |