| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/26/2008 | US20080149373 Printed circuit board, light emitting apparatus having the same and manufacturing method thereof |
| 06/26/2008 | US20080149371 Flexible circuit |
| 06/26/2008 | US20080149369 Printed wiring board |
| 06/26/2008 | US20080149366 Interleaved printed circuit board |
| 06/26/2008 | US20080149265 Applicator for electrical or electronic components |
| 06/26/2008 | US20080148850 Coplanar mounting member for a MEM sensor |
| 06/26/2008 | US20080148563 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 06/26/2008 | US20080148562 Method for manufacturing multilayer flexible printed circuit board |
| 06/26/2008 | US20080148560 System and methods to laminate passives onto substrate |
| 06/26/2008 | US20080148559 Folded substrate with interposer package for integrated circuit devices |
| 06/26/2008 | DE112006001849T5 Verfahren zum Montieren von elektronischen Bauelementen A method of mounting electronic components |
| 06/26/2008 | DE10211926B4 Wärmeableitungsanordnung eines integrierten Schaltkreises (ICs) Heat dissipation arrangement of an integrated circuit (IC) |
| 06/26/2008 | DE102006061435A1 Verfahren und Vorrichtung zum Aufspritzen insbesondere einer Leiterbahn, elektrisches Bauteil mit einer Leiterbahn sowie Dosiervorrichtung Method and apparatus for spraying, in particular a conductor track, electrical component to a conductor track as well as metering |
| 06/26/2008 | DE102006060432A1 Elektrisches Bauelement sowie Außenkontakt eines elektrischen Bauelements Electrical component as well as external contact of an electrical component |
| 06/26/2008 | DE102006023325B4 Verfahren zum Bestimmen der Benetzungsfähigkeit eines Lotmaterials und Träger mit einem benetzbaren Oberflächenabschnitt zur Durchführung dieses Verfahrens Method for determining the wettability of a solder material and carrier with a wettable surface portion for carrying out this method |
| 06/25/2008 | EP1937045A1 Method of printing smooth micro-scale features |
| 06/25/2008 | EP1937044A1 Method for manufacturing a conductor |
| 06/25/2008 | EP1937043A1 Method for producing high dielectric sheet |
| 06/25/2008 | EP1936734A1 Radio frequency circuit module on multi-layer substrate |
| 06/25/2008 | EP1936682A1 Printed wiring board |
| 06/25/2008 | EP1935654A1 Method of printing with high spot placement accuracy |
| 06/25/2008 | EP1935634A1 Method for the production of a randomly patterned electrically condutive element |
| 06/25/2008 | EP1935633A1 Translucent Panel for connecting components |
| 06/25/2008 | EP1933995A1 Forming tool |
| 06/25/2008 | EP1814764B8 Electronic device |
| 06/25/2008 | EP1552729A4 Method for the manufacture of printed circuit boards with integral plated resistors |
| 06/25/2008 | EP1027721B1 Articles or compositions comprising nanoscale particles; methods of utilizing or producing such particles |
| 06/25/2008 | CN201078874Y Mounting structure of connector surface label soldering |
| 06/25/2008 | CN101209005A Method for mutually connecting circuit boards |
| 06/25/2008 | CN101209004A Printed wiring board |
| 06/25/2008 | CN101208207A Process for contact printing of pattern of electroless deposition catalyst |
| 06/25/2008 | CN101208195A Fiber-resin composite material, multilayer body, printed wiring board, and method for manufacturing printed wiring board |
| 06/25/2008 | CN101208174A Lead-free solder alloy |
| 06/25/2008 | CN101207977A Method for making flexible circuit board with break difference structure |
| 06/25/2008 | CN101207976A Paste printer and method of printing with paste |
| 06/25/2008 | CN101207975A Welding fixture of circuit board |
| 06/25/2008 | CN101207974A Electronic component mounting method and sensor device made by the method |
| 06/25/2008 | CN101207973A Roll label apparatus and method |
| 06/25/2008 | CN101207971A Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board |
| 06/25/2008 | CN101207970A Electronic component built-in substrate and method of manufacturing electronic component built-in substrate |
| 06/25/2008 | CN101207969A Electronic component built-in substrate and method for manufacturing the same |
| 06/25/2008 | CN101207106A 电路板及其制造方法 The circuit board and its manufacturing method |
| 06/25/2008 | CN101207052A Screen printing apparatus and heave forming method |
| 06/25/2008 | CN101204872A Method of printing with high spot placement accuracy |
| 06/25/2008 | CN100397964C Positioning device for use in process for manufacturing multi-layer printed circuit board and its using method |
| 06/25/2008 | CN100397963C Electronic circuit device and its manufacturing method |
| 06/25/2008 | CN100397961C Ball grid array jumper |
| 06/25/2008 | CN100397960C Printed circuit board structure and method for manufacturing same |
| 06/25/2008 | CN100397959C Metal plated laminate |
| 06/25/2008 | CN100397788C Signal reception device, signal reception circuit, and reception device |
| 06/25/2008 | CN100397718C 压配合端子 Press-fit terminal |
| 06/25/2008 | CN100397641C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/25/2008 | CN100397640C Circuit component built-in module and method for manufacturing the same |
| 06/25/2008 | CN100397627C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/25/2008 | CN100397626C Resin encapsulated electronic component unit and method of manufacturing the same |
| 06/25/2008 | CN100397625C 半导体装置 Semiconductor device |
| 06/25/2008 | CN100397624C Wiring circuit board |
| 06/25/2008 | CN100397603C Method for mounting electronic element, method for producing electronic device, circuit board, and electronic instrument |
| 06/25/2008 | CN100397593C Method for the production of structured layers on substrates |
| 06/25/2008 | CN100397581C Method for forming thin film pattern, thin film manufacturing device, conductive thin film wiring |
| 06/25/2008 | CN100397580C Method for forming thin film pattern, thin film manufacturing device, conductive thin film wiring |
| 06/25/2008 | CN100397543C Electrode base plate used for plasma display screen and its manufacturing method |
| 06/25/2008 | CN100397525C Wired circuit board |
| 06/25/2008 | CN100397294C Electronic apparatus including printed wiring board provided with heat generating component |
| 06/25/2008 | CN100397151C Flat displaying modular |
| 06/25/2008 | CN100397035C Three-dimensional measuring apparatus, filter lattice moire plate and illuminating means |
| 06/25/2008 | CN100396822C Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| 06/25/2008 | CN100396817C Surface-treated copper foil |
| 06/25/2008 | CN100396747C Acrylic adhesive sheet |
| 06/25/2008 | CN100396424C Laser processing device, processing method, and method of producing circuit substrate using the method |
| 06/24/2008 | US7391117 Method for fabricating semiconductor components with conductive spring contacts |
| 06/24/2008 | US7391116 Fretting and whisker resistant coating system and method |
| 06/24/2008 | US7390974 Multilayer printed wiring board with filled viahole structure |
| 06/24/2008 | US7390777 Stabilized with C3-C12 alkylene oxide, e.g., butylene oxide, aliphatic and cycloaliphatic alcohols having 2-8 carbon atoms, e.g., isopropanol, C1-C5 alkoxyphenol, e.g., 4-methoxyphenol, free radical stabilizer having 2,2,6,6-tetra(lower alkyl)-)-1-piperidinyloxy-yl group; vapor degreasing of metal parts |
| 06/24/2008 | US7390692 Semiconductor device and method for manufacturing the same |
| 06/24/2008 | US7390442 comprises a metal powder having the form of a lot of fine metal particles being linked in a chain shape as a conductive component formed of a metal having paramagnetism |
| 06/24/2008 | US7389929 Long range optical reader |
| 06/24/2008 | US7389903 Device and method for soldering contacts on semiconductor chips |
| 06/19/2008 | WO2008073713A1 Method and apparatus for printing conductive inks |
| 06/19/2008 | WO2008072930A2 Sheets for drilling |
| 06/19/2008 | WO2008072654A1 Flux for lead-free solder and method of soldering |
| 06/19/2008 | WO2008072630A1 Polyamide resin, epoxy resin composition using the same, and use of the composition |
| 06/19/2008 | WO2008072530A1 Printed circuit board analyzing system, printed circuit board designing assisting system, their methods, and program |
| 06/19/2008 | WO2008071576A2 Circuit arrangement and method for producing a circuit arrangement |
| 06/19/2008 | WO2008071069A1 Manufacturing method of printing plate |
| 06/19/2008 | WO2008050191A3 Methods of manufacturing printed circuit board assembly |
| 06/19/2008 | US20080147232 Maintenance Method and Component Mounter |
| 06/19/2008 | US20080146016 Method for Forming a Structure |
| 06/19/2008 | US20080145968 Manufacturing Method For Micro-SD Flash Memory Card |
| 06/19/2008 | US20080145689 comprising epoxy resin, acrylonitrile butadiene rubber, and a phenol novolak resin on a copper foil; using on a semiconductor chip mounted board and a semiconductor packaged board; good peeling strength |
| 06/19/2008 | US20080144316 Led lighting array for a portable task lamp |
| 06/19/2008 | US20080144298 Printed circuit board and method of manufacturing printed circuit board |
| 06/19/2008 | US20080144290 Electronic Unit and Method For Manufacturing an Electronic Unit |
| 06/19/2008 | US20080143906 Nanowire-based transparent conductors and applications thereof |
| 06/19/2008 | US20080142576 Method for the production of a soldered joint |
| 06/19/2008 | US20080142256 Wiring board manufacturing method |
| 06/19/2008 | US20080142255 Printed circuit board and method of manufacturing printed circuit board |
| 06/19/2008 | US20080142254 Carrier and manufacturing process thereof |
| 06/19/2008 | US20080142253 Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
| 06/19/2008 | US20080142249 Selective surface roughness for high speed signaling |