| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/02/2008 | EP1906324A2 Method and apparatus for creating layout model, computer product, and method of manufacturing device |
| 04/02/2008 | EP1905133A2 Multi-layered product for printed circuit boards, and a process for continuous manufacture of same |
| 04/02/2008 | EP1905065A2 Systems and methods for roll-to-roll patterning |
| 04/02/2008 | EP1904669A1 Tin electrodeposits having properties or characteristics that minimize tin whisker growth |
| 04/02/2008 | EP1721369B1 Soldering nest for a bus bar |
| 04/02/2008 | EP1314169A4 Circuit board protection system and method |
| 04/02/2008 | EP1111975B1 Clad board for printed-circuit board, multilayered printed-circuit board, and method of manufacture thereof |
| 04/02/2008 | CN201044539Y Composite level bar structure of cutting tools for printed circuit board |
| 04/02/2008 | CN101156286A Surge arrester |
| 04/02/2008 | CN101156236A 倒装片安装方法及凸块形成方法 Flip-chip mounting method and a bump forming method |
| 04/02/2008 | CN101156218A Conductive paste composition and printed wiring board |
| 04/02/2008 | CN101156214A Conductive paste composition, and printed wiring board |
| 04/02/2008 | CN101156061A Substrate inspecting apparatus |
| 04/02/2008 | CN101155942A Treatment of flexible web material |
| 04/02/2008 | CN101155482A Clamp transmission mechanism of pre-attaching machine |
| 04/02/2008 | CN101155481A Method for manufacturing flexible substrate |
| 04/02/2008 | CN101155480A Pattern forming apparatus and pattern forming method |
| 04/02/2008 | CN101155479A Liquid medicine processing device |
| 04/02/2008 | CN101155478A Method for multi-layer flexible printed circuit board vacuum laminating photosensory membrane and its fake attaching tools |
| 04/02/2008 | CN101155477A Liquid medicine processing device |
| 04/02/2008 | CN101155476A Preparation method for flexible circuit board |
| 04/02/2008 | CN101155475A Substrate manufacturing method, control substrate and projection apparatus |
| 04/02/2008 | CN101155474A High-precision contra-position overlapping film method in FPC field and its special partition board |
| 04/02/2008 | CN101155471A Circuit substrate, method for inspecting electric circuit, and method for manufacturing circuit substrate |
| 04/02/2008 | CN101155469A Circuit board and method for manufacturing semiconductor modules and circuit boards |
| 04/02/2008 | CN101155467A Wired circuit board and producing method thereof |
| 04/02/2008 | CN101155466A Printed circuit board |
| 04/02/2008 | CN101155465A Printed circuit board |
| 04/02/2008 | CN101154655A Circuit board arrangement and method for producing a circuit board arrangement |
| 04/02/2008 | CN101154645A Circuit substrate for preventing warpage and package using the same |
| 04/02/2008 | CN101154644A Electrically optimized and structurally protected via structure for high speed signals |
| 04/02/2008 | CN101154643A Substrate structure and its manufacturing method |
| 04/02/2008 | CN101154607A Unmolded package for a semiconductor device |
| 04/02/2008 | CN101152674A Figuration processing method |
| 04/02/2008 | CN100379325C Transplanted repair method for bad region of printed circuit board |
| 04/02/2008 | CN100379324C Wet filming method of flexible printed circuit |
| 04/02/2008 | CN100379323C Circuit board and process for producing the same |
| 04/02/2008 | CN100379322C Circuit assembly and method of manufacturing the circuit assembly |
| 04/02/2008 | CN100379320C Electronic ballast for discharging lamp |
| 04/02/2008 | CN100379148C Surface-mount base for electronic element |
| 04/02/2008 | CN100379087C Anisotropic conductive sheet and its manufacturing method, adaptor device and its manufacturing method, and circuit device electric test instrument |
| 04/02/2008 | CN100378969C Intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate |
| 04/02/2008 | CN100378968C 电子装置 Electronic devices |
| 04/02/2008 | CN100378967C Ceramic package and fabrication method thereof |
| 04/02/2008 | CN100378879C Method of manufacturing ceramic laminate, laminated electronic element and method for producing same |
| 04/02/2008 | CN100378878C Method for termination of a plurality of surface mount elements and method for manufacturing the plurality of surface mount elements |
| 04/02/2008 | CN100378132C Photocuring/thermosetting inkjet composition and printed circuit board using same |
| 04/02/2008 | CN100377891C Organic silver compound and it's preparation method, organic silver ink and it's direct wiring method |
| 04/01/2008 | US7352427 Display device |
| 04/01/2008 | US7352353 Electrostatically addressable electrophoretic display |
| 04/01/2008 | US7352196 Probe card assembly and kit |
| 04/01/2008 | US7352116 Multilayer ceramic substrate, method for manufacturing the same, and piezoelectric resonator component |
| 04/01/2008 | US7352060 Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate |
| 04/01/2008 | US7351918 Surface-mount base for electronic element |
| 04/01/2008 | US7351911 Connection box |
| 04/01/2008 | US7351649 Recording head unit and method of producing the same |
| 04/01/2008 | US7351523 Photographic materials having improved keeping properties |
| 04/01/2008 | US7351361 Metal or alloy having a melting point of 230 degrees C. or higher, alloy having a melting point lower than 230 degrees C.; epoxy-based, phenolic-based or acrylic-based thermosetting or thermoset resin or polyethylene type, polyester type, polypropylene type or acrylic type thermoplastic resin |
| 04/01/2008 | US7351357 Printing of organic conductive polymers containing additives |
| 04/01/2008 | US7351353 Method for roughening copper surfaces for bonding to substrates |
| 04/01/2008 | US7351321 Electroplating metal onto substrate in pattern corresponding to complement of conformable mask; forming multilayer, three-dimensional structure |
| 04/01/2008 | US7351085 Joint member and joint connector for wire harness |
| 04/01/2008 | US7351070 Microconnector for FPC connection and method of producing the same |
| 04/01/2008 | US7350903 Inkjet printhead with common chamber and actuator material |
| 04/01/2008 | US7350686 Method for supplying solder |
| 04/01/2008 | US7350684 Apparatus and method for forming bump |
| 04/01/2008 | US7350298 Method for fabricating circuit board with conductive structure |
| 04/01/2008 | US7350295 Method of fabricating multi-layered printed circuit board for optical waveguides |
| 04/01/2008 | US7350294 Method of electroplating a plurality of conductive fingers |
| 04/01/2008 | US7350293 Low profile ball-grid array package for high power |
| 04/01/2008 | US7350292 Method for affecting impedance of an electrical apparatus |
| 04/01/2008 | CA2459942C Clip for replaceable surface mounted devices |
| 03/27/2008 | WO2008035961A2 Device for electrochemically depositing a material on a plateshaped substrate |
| 03/27/2008 | WO2008035819A2 Electronic component mounting structure |
| 03/27/2008 | WO2008035765A1 Inspecting apparatus |
| 03/27/2008 | WO2008035758A1 Lead-free solder paste |
| 03/27/2008 | WO2008034312A1 Fabrication method of a printed circuit board |
| 03/27/2008 | WO2008012165A3 Method and wave soldering system for soldering components onto the top and bottom surface of a circuit board |
| 03/27/2008 | WO2008004531A3 Cream solder and method of soldering electronic part |
| 03/27/2008 | WO2007128015A3 Method for producing at least one conductive element of a printed-circuit board, printed-circuit board and use of this method |
| 03/27/2008 | WO2007126748A3 An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards |
| 03/27/2008 | WO2007098935A3 Platforms, apparatuses, systems and methods for processing and analyzing substrates |
| 03/27/2008 | US20080075070 Circuit board through-hole impedance tuning using clearance size variations |
| 03/27/2008 | US20080073784 Circuit substrate for preventing warpage and package using the same |
| 03/27/2008 | US20080073414 Flux composition for solder, solder paste, and method of soldering |
| 03/27/2008 | US20080073110 Interposer and method for manufacturing the same |
| 03/27/2008 | US20080073024 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
| 03/27/2008 | US20080072423 Secure high frequency / ultra high frequency inlay, and method and apparatus for making the inlay |
| 03/27/2008 | US20080072421 Molded Substrate for Topography Based Lithography |
| 03/27/2008 | US20080072408 Piezoelectric thin film device and method for manufacturing the same |
| 03/27/2008 | DE19940695B4 Elektronisches Mediagerät Electronic media device |
| 03/27/2008 | DE19845901B4 Auf Kapillarwirkung basierender, verbesserter oberflächenmontierter Stiftsockel Capillary-based, improved surface mount pin header |
| 03/27/2008 | DE102007043409A1 Verfahren zur Herstellung einer Gehäusestruktur mit Antenne A method of manufacturing a housing structure having antenna |
| 03/27/2008 | DE102007037248A1 Verfahren zur Herstellung eines eine Metallfilm-Leiterbahn bildenden Körpers A process for producing a metal film-conductor body forming |
| 03/27/2008 | DE102006044045A1 Lötverfahren und Vorrichtung zum Dampfphasenlöten Soldering and apparatus for vapor phase soldering |
| 03/27/2008 | DE102006043811A1 Coated article for printed circuit board used for assembly of electrical components, has electrically non-conducting base layer, copper and/or copper alloy layer, and layer containing electrically conductive polymer |
| 03/27/2008 | DE102006042380A1 Verfahren zur Herstellung von Steckerleisten mit präzise ausgerichteten Anschlusspins und Steckerleiste A process for producing power strips with precisely aligned connection pins and power strip |
| 03/26/2008 | EP1903842A2 Multilayer printed wiring board |
| 03/26/2008 | EP1903840A1 Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method |
| 03/26/2008 | EP1903129A1 A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus |