| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/08/2008 | US20080104833 Printed wiring board and method of manufacturing the same |
| 05/08/2008 | US20080104832 Method for manufacturing electronic substrate |
| 05/08/2008 | US20080104831 Electronic Component Mounting Apparatus And method Of Mounting Electronic Components |
| 05/08/2008 | US20080104813 Polymer bulk acoustic resonator |
| 05/08/2008 | DE202008002227U1 Korrosions- und verschleißgeschützte Lötvorrichtung Corrosion and wear-resistant soldering device |
| 05/08/2008 | DE202007017553U1 Vorrichtung zum Löten von elektrischen Leiterplatten An apparatus for soldering of electrical printed circuit boards |
| 05/08/2008 | DE19807580B4 Verfahren und Vorrichtung zur quantitativen Messung des Korrosionsvorgangs von auf der Oberfläche elektronischer Schaltungsbaugruppen vorhandenen Rückständen Method and device for the quantitative measurement of the corrosion process of present on the surface of electronic circuit modules residues |
| 05/08/2008 | DE112006001415T5 Mehrschichtleiterplatte Multi-layer printed circuit board |
| 05/08/2008 | DE10305364B4 Verfahren zur Herstellung eines elektronischen Geräts und elektronisches Gerät A method of manufacturing an electronic device, and electronic device |
| 05/08/2008 | DE102007052111A1 Elektronische Vorrichtung mit Stromschienenanordnung und darauf mittels Löten montiertes elektronisches Bauteil Electronic device with bus bar assembly and mounted thereon by soldering electronic component |
| 05/08/2008 | DE102006052462A1 Connecting contact arrangement i.e. pressing contact arrangement, has pad units mechanically connected by molding material, which is lead into slots and electrically insulated, such that unit is soldered altogether at pads of circuit board |
| 05/08/2008 | DE102006050785A1 Printed circuit board for processing control current and output current in drive controller, has conductor partially extending above paths, such that guidance of supply current to path from board terminal to another terminal is enabled |
| 05/08/2008 | DE102006041610B3 Metallisierte Kunststoffoberfläche und Verfahren zum Bearbeiten von metallisierten Kunststoffoberflächen Metallized plastic surface and method for processing of metallized plastic surfaces |
| 05/08/2008 | DE102006030135B4 Vorrichtung zur Montage von Stiften auf einer Leiterplatte Device for mounting of pins on a printed circuit board |
| 05/08/2008 | DE10157983C5 Positionier- und/oder Laserbearbeitungsverfahren und Vorrichtung Positioning and / or laser machining methods and apparatus |
| 05/08/2008 | DE10056665C5 Lenkstockschalter, insbesondere für Fahrzeuge Steering column switch, in particular for vehicles |
| 05/07/2008 | EP1919266A2 Electroless plating solution, electroless plating process, and printed circuit board |
| 05/07/2008 | EP1919265A2 Plasma display device |
| 05/07/2008 | EP1919031A1 Microminiature contact and method for manufacturing same, and electronic component |
| 05/07/2008 | EP1918992A1 Electrical conductor system of a semiconductor device and manufacturing method thereof |
| 05/07/2008 | EP1918991A2 Semiconductor device provided with low melting point metal bumps and process for producing same |
| 05/07/2008 | EP1918989A1 Circuit connection structure, method for manufacturing same, and semiconductor substrate for circuit connection structure |
| 05/07/2008 | EP1918101A1 Screen printing facility for solar cells comprising a positioning device |
| 05/07/2008 | EP1917844A2 Method for soldering smd components, printed circuit board and reflow soldering furnace therefor |
| 05/07/2008 | EP1917680A1 Metal-ceramic substrate |
| 05/07/2008 | EP1917340A1 Aqueous solution and method for removing ionic contaminants from the surface of a workpiece |
| 05/07/2008 | EP1761396B1 Printing of organometallic compounds to form conductive traces |
| 05/07/2008 | EP1738622B1 Circuit board panel with a plurality of circuit carriers and method for individually separating circuit carriers belonging to a circuit board panel |
| 05/07/2008 | EP1709852A4 Improved populated printed wiring board and method of manufacture |
| 05/07/2008 | EP1680534A4 Support layer for thin copper foil |
| 05/07/2008 | EP1665911B1 Thin-film assembly and method for producing said assembly |
| 05/07/2008 | EP1597332B1 Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
| 05/07/2008 | EP1568070A4 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards |
| 05/07/2008 | EP1441046B1 Surface-treated copper foil |
| 05/07/2008 | EP1353541B1 Circuit board and production method therefor |
| 05/07/2008 | EP1342292B1 Circuit module with universal connectivity |
| 05/07/2008 | EP1082765B1 Opto-electronic element |
| 05/07/2008 | CN101176394A Multilevel interconnection, its manufacturing method, flat panel display and its manufacturing method |
| 05/07/2008 | CN101176393A Wave soldering bath |
| 05/07/2008 | CN101175379A Production method for soft and hard combined printing circuit board |
| 05/07/2008 | CN101175378A Method of manufacturing circuit board |
| 05/07/2008 | CN101175377A System and method for removing electronic components |
| 05/07/2008 | CN101175376A System and method for dynamic regulation of solder pad |
| 05/07/2008 | CN101175375A Production method of flexible circuit board |
| 05/07/2008 | CN101175374A Fixing method of flexible circuit board |
| 05/07/2008 | CN101175373A Printed-wiring board, method for forming electrode of the board, and hard disk device |
| 05/07/2008 | CN101175371A 电路板及其制造方法 The circuit board and its manufacturing method |
| 05/07/2008 | CN101175369A Circuit underlay and its manufacturing method, underlay structure and information processing system |
| 05/07/2008 | CN101175367A Printed wiring board, bend processing method for printed wiring board and electronic equipment |
| 05/07/2008 | CN101175366A Multilayer soft printed wiring board and production method thereof |
| 05/07/2008 | CN101174723A Non-pin GPS dielectric antenna |
| 05/07/2008 | CN101174718A Grouped element transmission channel link with pedestal aspects |
| 05/07/2008 | CN101174611A Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding |
| 05/07/2008 | CN101174421A System and method for improving lead wire coupling of hard disk drive actuator |
| 05/07/2008 | CN101173917A Fast criterion for through hole ability of black hole agent used for flexible printed circuit board |
| 05/07/2008 | CN100387104C Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same |
| 05/07/2008 | CN100387103C Multilayer printed wiring board and semiconductor device |
| 05/07/2008 | CN100386920C Electric connector assembly |
| 05/07/2008 | CN100386892C Light emitting device assembly |
| 05/07/2008 | CN100386869C Ball grid array substrate having window and method of fabricating same |
| 05/07/2008 | CN100386857C Method for manufacturing conductive seat used for electric connection and formed conductive seat therefor |
| 05/07/2008 | CN100386854C Wiring forming system and wiring forning method for wiring on wiring board |
| 05/06/2008 | USRE40283 Mounting apparatus for electronic component |
| 05/06/2008 | US7369386 Overcurrent protection for solid state switching system |
| 05/06/2008 | US7369090 Ball Grid Array package having integrated antenna pad |
| 05/06/2008 | US7368998 Inductor element containing circuit board and power amplifier module |
| 05/06/2008 | US7368818 Methods of making microelectronic assemblies including compliant interfaces |
| 05/06/2008 | US7368665 Circuit board and a power module employing the same |
| 05/06/2008 | US7368391 Methods for designing carrier substrates with raised terminals |
| 05/06/2008 | US7368149 One color of the filter element materials is discharged from an ink jet head while ir is swept in the longitudinal direction of the mother substrate; the other colors are discharged while the head is swept in the width direction of the substrate; reduce unevenness from discharge variation |
| 05/06/2008 | US7368033 Security tag and system for fabricating a tag including an integrated surface processing system |
| 05/06/2008 | US7368032 RFID label technique |
| 05/06/2008 | US7367489 Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps |
| 05/06/2008 | US7367252 Integrated circuit package separators |
| 05/06/2008 | US7367119 Method for forming a reinforced tip for a probe storage device |
| 05/06/2008 | US7367118 Method for forming metal wires by microdispensing pattern |
| 05/06/2008 | US7367117 Electronic component mounting apparatus and electronic component mounting method |
| 05/06/2008 | US7367116 Multi-layer printed circuit board, and method for fabricating the same |
| 05/06/2008 | US7367115 Component mounting apparatus |
| 05/06/2008 | US7367114 Method for plasma etching to manufacture electrical devices having circuit protection |
| 05/06/2008 | CA2205439C Method and device for galvanising plate-shaped products in horizontal continuous plants |
| 05/02/2008 | WO2008051602A2 Method for mating flexure to flex-print circuit and flexure therefor |
| 05/02/2008 | WO2008051512A2 Patterned printing plates and processes for printing electrical elements |
| 05/02/2008 | WO2008050768A1 Photocurable/thermocurable solder resist composition, and printed circuit board using the same |
| 05/02/2008 | WO2008050757A1 Slurry composition for ceramic green sheet and method for producing the same, and multilayer ceramic electronic component and method for manufacturing the same |
| 05/02/2008 | WO2008050715A1 Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile polymer and method of synthesizing the same, composition containing nitrile polymer, and layered product |
| 05/02/2008 | WO2008050706A1 Printed wiring board, method for manufacturing printed wiring board, and electric device |
| 05/02/2008 | WO2008050653A1 Photosensitive resin composition and photosensitive element using the same |
| 05/02/2008 | WO2008050631A1 Process for producing metal-film-coated substrate, metal-film-coated substrate, process for producing metallic-pattern material, and metallic-pattern material |
| 05/02/2008 | WO2008050511A1 Electronic circuit board |
| 05/02/2008 | WO2008050399A1 Flex rigid wiring board and method for manufacturing the same |
| 05/02/2008 | WO2008050191A2 Methods of manufacturing printed circuit board assembly |
| 05/02/2008 | WO2008049504A2 Module |
| 05/01/2008 | US20080102692 Grouped element transmission channel link with pedestal aspects |
| 05/01/2008 | US20080102305 Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof |
| 05/01/2008 | US20080101048 Method of making assembly module and board module and electronic apparatus |
| 05/01/2008 | US20080101045 Circuit board and manufacturing method thereof |
| 05/01/2008 | US20080101043 Gauge Circuit Board Holding Device |
| 05/01/2008 | US20080100993 Support Platform for Electrical Components, and Module Comprising Said Support Platform |
| 05/01/2008 | US20080100291 Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry |