| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/17/2008 | US20080089705 Xerographic micro-assembler |
| 04/17/2008 | US20080089046 Printed Wiring Board for Mounting Electronic Components and Semiconductor Device Using Same |
| 04/17/2008 | US20080089045 Printed circuit boards having pads for solder balls and methods for the implementation thereof |
| 04/17/2008 | US20080089043 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
| 04/17/2008 | US20080089041 Connection apparatus for circuit board, ink jet type recording apparatus using the same, ic chip and ink cartridge having ic chip |
| 04/17/2008 | US20080089039 Method for Micropacking of Electrical or Electrochemical Devices and Micropackage |
| 04/17/2008 | US20080088975 Method for forming an electrical interconnect to a spring layer in an integrated lead suspension |
| 04/17/2008 | US20080088601 Circuit layout on a touch panel |
| 04/17/2008 | US20080088332 High density cantilevered probe for electronic devices |
| 04/17/2008 | US20080087461 Combination Impedance/Back Drill Coupon |
| 04/17/2008 | US20080087459 Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate |
| 04/17/2008 | US20080087456 Circuit board assemblies with combined fluid-containing heatspreader-ground plane and methods therefor |
| 04/17/2008 | US20080087178 Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same |
| 04/17/2008 | US20080086876 Bondable conductive ink |
| 04/17/2008 | DE202007017552U1 Lötdüsenplatte Solder nozzle |
| 04/17/2008 | DE19962702B4 Prüfsockel einer BGA-Vorrichtung A test socket BGA device |
| 04/17/2008 | DE102007048651A1 Coating system for delivering flexible coating material on substrate, has control device actuated to supply chain of impulses to solenoid valve, needle valve closed for intervals between impulses, and coating material discharged from needle |
| 04/17/2008 | DE102006061388B3 Automotive instrument panel has plastic outer molded skin separated by polymer layer from internal electrical/electronic system |
| 04/16/2008 | EP1912485A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| 04/16/2008 | EP1912484A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| 04/16/2008 | EP1912264A1 Opto-electronic element |
| 04/16/2008 | EP1911860A1 Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer |
| 04/16/2008 | EP1911584A1 Screen printing machine and solar battery cell |
| 04/16/2008 | EP1911543A1 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH |
| 04/16/2008 | EP1624001B1 Photocuring/thermosetting inkjet composition and printed wiring board using same |
| 04/16/2008 | EP1278612A4 Flip chip interconnection structure |
| 04/16/2008 | CN101163769A Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board |
| 04/16/2008 | CN101163376A Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same |
| 04/16/2008 | CN101163375A Method of drilling pilot hole of PC panel boring machine |
| 04/16/2008 | CN101162716A Substrate with built-in electronic component and method for manufacturing the same |
| 04/16/2008 | CN101161392A Use method of PI membrane in stannum roller welding |
| 04/16/2008 | CN101161391A Welding flux film forming device and smoothing method for welding flux surface |
| 04/16/2008 | CN100382662C Production device |
| 04/16/2008 | CN100382661C Drawer type mould |
| 04/16/2008 | CN100382351C Method of producing piezoelectric ceramic device |
| 04/16/2008 | CN100382346C Optical semiconductor device and electronic equipment using same |
| 04/16/2008 | CN100382309C Molecule component |
| 04/16/2008 | CN100382299C Hybrid integrated circuit device and method of manufacturing the same |
| 04/16/2008 | CN100382285C Printing circuit board and production method and electronic parts |
| 04/16/2008 | CN100382268C Electronic component joint device |
| 04/16/2008 | CN100382267C Recovery processing method of an electrode |
| 04/16/2008 | CN100382264C Semiconductor device and electronic equipment using the same |
| 04/16/2008 | CN100382203C Method for manufacturing film resistance |
| 04/16/2008 | CN100381919C Coupling structure of electronic components |
| 04/16/2008 | CN100381891C Display device |
| 04/16/2008 | CN100381617C Conveyorized horizontal processing line and method of wet-processing a workpiece |
| 04/15/2008 | US7359217 Pivoting apparatus with a shielding function |
| 04/15/2008 | US7359024 Structure of liquid crystal display device for easy assembly and disassembly |
| 04/15/2008 | US7358751 Contact pin assembly and contactor card |
| 04/15/2008 | US7358750 Inspection apparatus for printed board |
| 04/15/2008 | US7358604 Multichip circuit module and method for the production thereof |
| 04/15/2008 | US7358602 Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
| 04/15/2008 | US7358599 Optical semiconductor device having a lead frame and electronic equipment using same |
| 04/15/2008 | US7358591 Capacitor device and semiconductor device having the same, and capacitor device manufacturing method |
| 04/15/2008 | US7358445 Circuit substrate and apparatus including the circuit substrate |
| 04/15/2008 | US7358189 Copper clad laminate |
| 04/15/2008 | US7358184 Method of forming a conductive via plug |
| 04/15/2008 | US7358183 Method for manufacturing wiring and method for manufacturing semiconductor device |
| 04/15/2008 | US7358176 Screen printing method of forming conductive bumps |
| 04/15/2008 | US7358116 Substrate conductive post formation |
| 04/15/2008 | US7358037 Binder diffusion transfer patterning of a thick film paste layer |
| 04/15/2008 | US7357886 Singular molded and co-molded electronic's packaging pre-forms |
| 04/15/2008 | US7357879 Cupric chloride solution and triazole compound; capable of forming an etching-inhibiting coating; nonuniform irregularities formed on the side wall of the circuit pattern by the etching improves the adhesion between the circuit pattern and an insulating resin layer covering the circuit pattern |
| 04/15/2008 | US7357853 Electroplating composite substrates |
| 04/15/2008 | US7357694 Jet singulation |
| 04/15/2008 | US7357295 Solder ball supplying method and supplying device |
| 04/15/2008 | US7357294 Method for mounting a semiconductor package onto PCB |
| 04/15/2008 | US7357293 Soldering an electronics package to a motherboard |
| 04/15/2008 | US7357291 Solder metal, soldering flux and solder paste |
| 04/15/2008 | US7357288 Component connecting apparatus |
| 04/15/2008 | US7356922 Method of fabricating a rate gyroscope and accelerometer multisensor |
| 04/15/2008 | US7356921 Method for forming a conductive layer pattern |
| 04/15/2008 | US7356920 Micro-machined structure production using encapsulation |
| 04/15/2008 | US7356919 Component mounting method |
| 04/15/2008 | US7356918 Component mounting method |
| 04/15/2008 | US7356917 Method for manufacturing multi-layer printed circuit board |
| 04/15/2008 | US7356916 Circuit-formed substrate and method of manufacturing circuit-formed substrate |
| 04/10/2008 | WO2008041780A1 Copper microparticle, method for production of copper microparticle, insulating material, wiring structure, method for production of wiring circuit board, and electronic/electric device |
| 04/10/2008 | WO2008041720A1 Process for producing metal clad laminate |
| 04/10/2008 | WO2008041027A1 Distortion-tolerant processing |
| 04/10/2008 | WO2008040700A1 A coating method and the coating formed thereby |
| 04/10/2008 | WO2008040626A1 Arrangement comprising a base element and at least one first flexible strip conductor carrier and a second flexible strip conductor carrier |
| 04/10/2008 | WO2008040472A1 Laminated glazing |
| 04/10/2008 | WO2008020984A3 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
| 04/10/2008 | WO2008017682A3 Method and device for laying thin wire |
| 04/10/2008 | WO2007149298A3 Improved process for pressureless constrained sintering of low temperature co-fired ceramic with surface circuit patterns |
| 04/10/2008 | WO2007140473A3 Process for printing features smaller dimensions |
| 04/10/2008 | US20080085601 Method of forming fine contact hole and method of fabricating semiconductor device using block copolymers |
| 04/10/2008 | US20080085374 electrically conductive sheet that is transparent for use in transmitted display devices while being protected from abrasion or harsh ambient conditions; layer of nonconductive polymeric material having integral conduit channels of a transparent conductive material; for electronics |
| 04/10/2008 | US20080084671 Electrical circuit assembly for high-power electronics |
| 04/10/2008 | US20080083561 Thin printed circuit board for manufacturing chip scale package |
| 04/10/2008 | US20080083558 Multilayer Wiring Board And Method For Manufacturing The Same |
| 04/10/2008 | US20080083481 Method and Apparatus to Create Electrical Junctions for Information Routing in Textile Structures |
| 04/10/2008 | US20080083116 Wired circuit board holding sheet and production method thereof |
| 04/10/2008 | DE102007046748A1 Coating medium for coating of electrical components, particularly printed circuit boards, comprises polymer which contains amorphous poly-alpha-olefin and silane functional moisture-linking polymer |
| 04/10/2008 | DE102006045895A1 Elektronikbaugruppe sowie Verfahren zur Herstellung einer Elektronikbaugruppe zur Verwendung in der Automobilelektronik Electronics assembly and method for producing an electronic assembly for use in automotive electronics |
| 04/10/2008 | DE102006032821B4 Verfahren und Vorrichtung zur Herstellung einer Vielzahl von Chipkarten mit einer klebstofffreien Fixierung der Chipmodule Method and apparatus for manufacturing a plurality of IC cards with an adhesive-free fixing of the chip modules |
| 04/10/2008 | DE102006023660B4 Elektrisches oder elektronisches Gerät Electrical or electronic device |
| 04/09/2008 | EP1909546A1 Printed wiring board |
| 04/09/2008 | EP1909545A2 Circuit board carrier for circuit board arrangement in a work machine |