| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/03/2008 | US20080155818 Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board |
| 07/03/2008 | DE202007003046U1 Elektrischer Leiter Electrical conductor |
| 07/03/2008 | DE19702504B4 Varioobjektiv Zoom lens |
| 07/03/2008 | DE112006002303T5 Elektronisches Modul und Verfahren zum Versiegeln eines elektronischen Moduls An electronic module and method for sealing an electronic module |
| 07/03/2008 | DE102008003112A1 Semiconductor packing comprises packing substrate, contact positioning structure of one type, arranged in area of packing substrate, where contact positioning structure of another type is arranged in another area of packing substrate |
| 07/03/2008 | DE102006062494A1 Elektrische Vorrichtung mit einem Trägerelement mit zumindest einer speziellen Anschlussfläche und einem oberflächenmontierten Bauelement Electrical device comprising a carrier element with at least one specific connection surface and a surface mount component |
| 07/03/2008 | DE102006062485A1 Electrical contacting device for electrical/electronic circuit, has electrically conductive contact unit arranged on electrically non-conducting substrate, which is formed of elastic flexible material |
| 07/03/2008 | DE102005038004B4 Geschirrteil Kitchenware item |
| 07/03/2008 | DE102004021927B4 Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul A process for the inner electrical insulation of a substrate for a power semiconductor module |
| 07/03/2008 | DE10052960C9 Bleifreie Nickellegierung Lead-free nickel alloy |
| 07/02/2008 | EP1940215A2 Device for transferring/holding sheetlike member and its method |
| 07/02/2008 | EP1940210A2 Multilayer ceramics substrate |
| 07/02/2008 | EP1940209A2 Printed wiring board and method of producing the same |
| 07/02/2008 | EP1940208A2 Multi-piece substrate and method of manufacturing the substrate |
| 07/02/2008 | EP1940207A2 Electric device with a carrier element with a minimum of one special connecting surface and a component mounted on the surface |
| 07/02/2008 | EP1940206A2 Electric device with conductive elements bound together |
| 07/02/2008 | EP1939976A1 Three-dimensional microstructures and methods of formation thereof |
| 07/02/2008 | EP1939935A2 Indium Compositions |
| 07/02/2008 | EP1938863A1 Method for mechanical assembly and electrical interconnection of the functional elements of an active implantable medical device |
| 07/02/2008 | EP1938675A2 Method and device for laser cutting at an acute angle of carriers for electronic components |
| 07/02/2008 | EP1937785A1 Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| 07/02/2008 | EP1937737A1 Carboxyl group-containing polyurethane and heat-curable polyurethane resin composition prepared therefrom |
| 07/02/2008 | EP1937474A1 Laminated glazing |
| 07/02/2008 | EP1738622B8 Circuit board panel with a plurality of circuit carriers and method for individually separating circuit carriers belonging to a circuit board panel |
| 07/02/2008 | EP1295518B1 Process for thick film circuit patterning |
| 07/02/2008 | CN201080496Y Fixture for holding flexible circuit board |
| 07/02/2008 | CN101213891A Ceramic electronic component and method for manufacturing the same |
| 07/02/2008 | CN101213890A Multilayer circuit board and manufacturing method thereof |
| 07/02/2008 | CN101213889A Method and device for removing micro component |
| 07/02/2008 | CN101213464A Connector-to-pad PCB translator for a tester and method of fabrication |
| 07/02/2008 | CN101212893A Anti-EMI method |
| 07/02/2008 | CN101212870A Laminated multi-layer circuit board |
| 07/02/2008 | CN101212869A Circuit base board and method for producing passive circuit on the circuit base board |
| 07/02/2008 | CN101212868A Printed circuit board rebuilding method |
| 07/02/2008 | CN101212867A Flexible circuit board press bonding method |
| 07/02/2008 | CN101212866A Module |
| 07/02/2008 | CN101212864A Inter-connecting structure between multi-layer base board and producing method |
| 07/02/2008 | CN101212861A Anti-theft circuit and producing method |
| 07/02/2008 | CN101212166A Motor module |
| 07/02/2008 | CN101212165A Motor module |
| 07/02/2008 | CN101212080A Organic dielectric antenna and method for producing the antenna |
| 07/02/2008 | CN101211882A Printed circuit board and element module packaging structure and encapsulation method |
| 07/02/2008 | CN101211693A Capacitor and multi-layer board embedding the capacitor |
| 07/02/2008 | CN100399867C Method of auto actuating circuit distribution by software |
| 07/02/2008 | CN100399866C Circuit base board |
| 07/02/2008 | CN100399782C Electroacustic transducer |
| 07/02/2008 | CN100399631C Method for interconnecting multiple printed circuit boards |
| 07/02/2008 | CN100399551C Device mounting board |
| 07/02/2008 | CN100399126C Panel display plate and its assembling method |
| 07/02/2008 | CN100399039C 印刷电路板检查装置 A printed circuit board inspection apparatus |
| 07/02/2008 | CN100398986C Characteristic value calculation for welding detection |
| 07/02/2008 | CN100398620C Adhesion agent for electrode conection and connection method using same |
| 07/02/2008 | CN100398291C Cushioning material for hot pressing and process for producing layered board |
| 07/02/2008 | CN100398238C Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| 07/01/2008 | US7394665 LSI package provided with interface module and method of mounting the same |
| 07/01/2008 | US7394663 Electronic component built-in module and method of manufacturing the same |
| 07/01/2008 | US7394514 Display device and manufacturing method therefor |
| 07/01/2008 | US7394476 Methods and systems for thermal-based laser processing a multi-material device |
| 07/01/2008 | US7394341 Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same |
| 07/01/2008 | US7394267 Compliant contact pin assembly and card system |
| 07/01/2008 | US7394163 Method of mounting semiconductor chip |
| 07/01/2008 | US7394026 Multilayer wiring board |
| 07/01/2008 | US7393781 Capping of metal interconnects in integrated circuit electronic devices |
| 07/01/2008 | US7393718 Unmolded package for a semiconductor device |
| 07/01/2008 | US7393711 Method of producing a digital fingerprint sensor and the corresponding sensor |
| 07/01/2008 | US7393596 Aluminum/ceramic bonding substrate and method for producing same |
| 07/01/2008 | US7393567 Adhering a compound that has both a free radical initiating moiety and a bonding moiety to a substrate; contacting the substrate with reaction product of a hydrophilic polymer and an unsaturated monomer; and patternwise exposing the substrate to light to form a region where a graft polymer is generated |
| 07/01/2008 | US7393555 Formed by reacting Cu2O with oxalic acid and a Lewis base in an inert solvent; e.g., di[(3-hexyne)copper(I)]oxalate and di[(norbornene)copper(I)]oxalate; heating to form high purity thin copper films with copper-free, non-toxic and gaseous by-products |
| 07/01/2008 | US7393419 Conductive adhesive rework method |
| 07/01/2008 | US7393395 Containing an optionally substituted bis(1H-tetrazole), e.g., 5,5'-bi(1H-tetrazole); 5,5'-azobis(mercaptotetrazole); and 5,5'-dithiobis(1-chlorotetrazole); improved heat resistance, adhesion to resin and solder wettability |
| 07/01/2008 | US7393217 Surface mount connector and circuit board assembly with same |
| 07/01/2008 | US7393083 Inkjet printer with low nozzle to chamber cross-section ratio |
| 07/01/2008 | US7393081 Droplet jetting device and method of manufacturing pattern |
| 07/01/2008 | US7392924 Automated ball mounting process and system with solder ball testing |
| 07/01/2008 | US7392584 Methods and apparatus for a flexible circuit interposer |
| 07/01/2008 | US7392583 Securing solid-matrix panels for cutting using a tooling fixture |
| 06/26/2008 | WO2008076659A1 Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
| 06/26/2008 | WO2008075686A1 Wiring board and method for manufacturing the same |
| 06/26/2008 | WO2008075629A1 Electronic parts built-in distributing board, and radiating method for the electronic parts built-in distributing board |
| 06/26/2008 | WO2008075575A1 Photosensitive element |
| 06/26/2008 | WO2008075537A1 Electrode structure and method for forming bump |
| 06/26/2008 | WO2008075521A1 Multilayer wiring board |
| 06/26/2008 | WO2008075504A1 Method for manufacturing thin-layer capacitor, thin-layer capacitor, and method for manufacturing wiring board with built-in capacitor |
| 06/26/2008 | WO2008075401A1 Board structure, process for manufacturing circuit board, method of inspecting circuit board and electronic equipment |
| 06/26/2008 | WO2008074447A2 Method for the production of a randomly patterned electrically conductive element |
| 06/26/2008 | WO2008074291A1 Method for the production of vias and conductor tracks |
| 06/26/2008 | US20080153319 Connection structure for printed wiring board |
| 06/26/2008 | US20080153041 Exposure Method and Apparatus |
| 06/26/2008 | US20080151522 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 06/26/2008 | US20080151516 Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment |
| 06/26/2008 | US20080151515 Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate |
| 06/26/2008 | US20080151514 Method and apparatus for interfacing components |
| 06/26/2008 | US20080150561 Device and method for testing semiconductor element, and manufacturing method thereof |
| 06/26/2008 | US20080150169 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
| 06/26/2008 | US20080150159 Semiconductor Package with Perforated Substrate |
| 06/26/2008 | US20080149383 Wiring substrate and method for manufacturing the same |
| 06/26/2008 | US20080149381 Method for manufacturing component incorporating module and component incorporating module |
| 06/26/2008 | US20080149380 Material Board for Producing Hybrid Circuit Board with Metallic Terminal Plate and Method for Producing Hybrid Circuit Board |
| 06/26/2008 | US20080149379 Wiring structure of printed wiring board and method for manufacturing the same |
| 06/26/2008 | US20080149374 Laminated multi-layer circuit board |