Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2008
03/12/2008EP1897652A1 Soldering flux and solder paste composition
03/12/2008EP1897649A1 Lead-free solder alloy
03/12/2008EP1897427A1 Electrically conductive, mechanically flexible connection between electrical or electronic components
03/12/2008EP1897426A2 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
03/12/2008EP1897424A1 Warpage preventing substrates and method of making same
03/12/2008EP1897037A1 Security document or valuable document comprising a contactless interface and a bi-stable display
03/12/2008EP1896861A2 Connector-to-pad printed circuit board translator and method of fabrication
03/12/2008EP1896634A2 Enhanced transparent conductive coatings and methods for making them
03/12/2008EP1278404B1 Circuit board and production method thereof
03/12/2008EP1185156B1 Device for transferring/holding sheetlike member and its method
03/12/2008CN201036110Y Circuit board type winding element
03/12/2008CN101142864A Method of manufacturing printed wiring board
03/12/2008CN101142863A Method for manufacturing circuit forming board
03/12/2008CN101142862A 电子部件安装方法和电子部件安装装置 Electronic component mounting method and an electronic component mounting apparatus
03/12/2008CN101142860A Printed circuit board
03/12/2008CN101142676A Electronic device and carrier substrate
03/12/2008CN101142674A 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers
03/12/2008CN101142666A Heating device, reflow device, heating method, and bump forming method
03/12/2008CN101142665A Flip chip mounting method and bump forming method
03/12/2008CN101142343A Selective catalytic activation of non-conductive substrates
03/12/2008CN101142252A (meth)acryloyl group-containing aromatic isocyanate compound and production process thereof
03/12/2008CN101142083A Apparatus for and method of manufacturing photosensitive laminated body
03/12/2008CN101142052A Laser machining apparatus, program generating device and laser processing method
03/12/2008CN101141855A Halftone
03/12/2008CN101141854A Method for setting assembly on the baseplate
03/12/2008CN101141853A Mounting circuit and method for producing semiconductor-chip-mounting circuit
03/12/2008CN101141852A Flexible printed circuit board surface sticked fixation method
03/12/2008CN101141851A Method for manufacturing double-faced flexible printing wiring board
03/12/2008CN101141850A Manufacturing method of imbedded pcb
03/12/2008CN101141848A Printed wiring board
03/12/2008CN101141846A Welding pad disposed on the circuitry
03/12/2008CN101141024A Method for producing layered tablet type packaging material
03/12/2008CN101141023A Microcomputer electric stacking type millimeter wave antenna
03/12/2008CN101140919A Film carrier tape for mounting electronic components and method of manufacturing the film carrier tape
03/12/2008CN100375586C Coating film structure for printed circuit board
03/12/2008CN100375585C Coupon registration mechanism and method
03/12/2008CN100375281C Ball grid array x-ray oreintation mark
03/12/2008CN100375274C Circuit device and its manufacturing method
03/12/2008CN100375239C Method for forming corrosion-resisting pattern and distribution pattern, and method for making semiconductor device
03/12/2008CN100375117C Method for producing a contactless ticket containing chip
03/12/2008CN100375112C Methods of optical filament scribing of circuit patterns with planar and non-planar portions
03/12/2008CN100374912C Manufacture of electronic device installing bodies
03/12/2008CN100374298C Printing apparatus and method for bonding material
03/11/2008USRE40145 Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
03/11/2008US7342805 Capacitor plate for substrate components
03/11/2008US7342803 Printed circuit board and method of manufacturing printed circuit board
03/11/2008US7342802 Multilayer wiring board for an electronic device
03/11/2008US7342801 Printed wiring board with enhanced structural integrity
03/11/2008US7342750 Method for providing electrical crossover in a laminated structure
03/11/2008US7342181 Maximizing capacitance per unit area while minimizing signal transmission delay in PCB
03/11/2008US7342179 Electronic device and method for producing the same
03/11/2008US7342178 Flexible printed circuit film
03/11/2008US7342177 Wiring board, electro-optical device and electronic instrument
03/11/2008US7342053 Resin composition, adhesive film using the same and multilayer printed circuit board
03/11/2008US7341890 Circuit board with built-in electronic component and method for manufacturing the same
03/11/2008US7341796 Superior shielding of electromagnetic waves, near infrared rays, stray light, outside light and the like, has sufficient contrast, has a deep blackened color, is able to limit reflected light of incoming light from the outside and reflected light of outgoing light; plasma display panel
03/11/2008US7341490 Design and method for plating PCI Express (PCIE) edge connector
03/11/2008US7340830 Method of manufacturing LED light string
03/11/2008US7340829 Method for fabricating electrical connection structure of circuit board
03/11/2008US7340828 Method for producing metal/ceramic bonding circuit board
03/11/2008US7340826 Method for producing an electronic device connected to a printed circuit board
03/11/2008CA2407224C Method of making reactive multilayer foil and resulting product
03/06/2008WO2008027856A2 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same
03/06/2008WO2008027396A1 Rigid flex printed circuit board
03/06/2008WO2008027215A2 Apparatus and method for integrated surface treatment and deposition for copper interconnect
03/06/2008WO2008027214A2 Methods and apparatus for barrier interface preparation of copper interconnect
03/06/2008WO2008027205A2 Self assembled monolayer for improving adhesion between copper and barrier layer
03/06/2008WO2008026588A1 Thermosetting resin composition, method for producing the same and circuit board
03/06/2008WO2008026562A1 Board appearance inspection method and device
03/06/2008WO2008026559A1 Substrate inspecting apparatus
03/06/2008WO2008026520A1 Semiconductor device and multilayer wiring board
03/06/2008WO2008026517A1 Conductive bonding material and electronic device
03/06/2008WO2008026504A1 Electronic component mounting device and electronic component mounting method
03/06/2008WO2008026247A1 Electromagnetic wave shield structure and formation method thereof
03/06/2008WO2008025764A1 Device for wetting bumps of a semiconductor chip with a liquid substance
03/06/2008WO2008005989B1 Ball grid array (bga) connection system and related method and ball socket
03/06/2008WO2007105009A3 Improvements in circuits comprising a substrate carrying a conductive track
03/06/2008WO2007092325A3 Optimal imaging system and method for a stencil printer
03/06/2008US20080059932 Parallel Electronic Design Automation: Shared Simultaneous Editing
03/06/2008US20080058976 Fully automated paste dispense system for dispensing small dots and lines
03/06/2008US20080058230 Resin-coated metal plate and method of drilling printed wiring board using the metal plate
03/06/2008US20080057742 Circuit-connecting material and circuit terminal connected structure and connecting method
03/06/2008US20080057627 Method of manufacturing a combined multilayer circuit board having embedded chips
03/06/2008US20080057217 For stereolithography, allow for variation in color, opacity, and surface properties, form opaque white or colored objects
03/06/2008US20080057180 Fully automated paste dispense system for dispensing small dots and lines
03/06/2008US20080055873 Electronic part module and method of making the same
03/06/2008US20080055872 Printed circuit board and method for manufacturing printed circuit board
03/06/2008US20080055863 Method of manufacturing as component embedded printed circuit board
03/06/2008US20080054491 Semiconductor device, relay chip, and method for producing relay chip
03/06/2008US20080054462 Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same
03/06/2008US20080054227 Compositions for use in electronics devices
03/06/2008US20080054225 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer
03/06/2008US20080054023 Fully automated paste dispense system for dispensing small dots and lines
03/06/2008US20080053714 Input device and manufacturing method thereof
03/06/2008US20080053693 Multi-layer printed wiring board and manufacturing method thereof
03/06/2008US20080053692 Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same
03/06/2008US20080053690 Manufacturing method and structure for a substrate with vertically embedded capacitor
03/06/2008US20080053688 Printed circuit board and method of manufacturing the same
03/06/2008US20080053040 Assembly, production and quality assurance processes respecting electronic compliance monitor (ECM) tags
03/06/2008US20080052906 Method of manufacturing a component-embedded printed circuit board