Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2008
06/19/2008US20080142238 Large area circuitry using appliques
06/19/2008US20080142154 Rfid label technique
06/19/2008US20080141527 Method for manufacturing multilayer flexible printed circuit board
06/19/2008DE202006020411U1 Vorrichtung zur elektrischen Kontaktierung von Leiterplatinen Device for electrical contacting of circuit boards
06/19/2008DE10304867B4 Verfahren und Vorrichtung zur Herstellung einer Leiterplattenanordnung Method and apparatus for producing a circuit board assembly
06/19/2008DE102007006162B3 Method for manufacturing of three-dimensional circuit carrier, involves forming circuit carrier by flat, plate-shaped base body, which is made of thermoplastic material by thermal deformation process
06/19/2008DE102007002199A1 Method for manufacturing carrier fitted with components, involves applying electrical conducting structure including component connection areas on surface of electrically non-conducting carrier
06/18/2008EP1933610A1 Board structure and electronic device
06/18/2008EP1933609A1 Substrate structure
06/18/2008EP1933588A1 Sound transmitting membrane, electronic part with sound transmitting membrane, and process for producing circuit board having the electronic part mounted thereon
06/18/2008EP1933376A2 Transfer material, method for producing the same and wiring substrate produced by using the same
06/18/2008EP1932952A1 Method of surface treatment for the inhibition of wiskers
06/18/2008EP1932403A1 Method for generation of metal surface structures and apparatus therefor
06/18/2008EP1932402A1 Method of forming conductive tracks for flexible electronic circuits
06/18/2008EP1932057A2 Method of forming conductive tracks
06/18/2008EP1276358B1 Production method of a copper foil excellent in laser beam drilling performance
06/18/2008EP1275695B1 Curable composition and multilayered circuit substrate
06/18/2008EP1222725B1 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
06/18/2008EP1019986B1 Wiring board constructions and methods of making same
06/18/2008CN201073709Y Combined wave peak tin solder
06/18/2008CN101204125A Interconnecting board and three-dimensional wiring structure using it
06/18/2008CN101204124A Warpage preventing substrates and method of making the same
06/18/2008CN101203384A Silk-screen printing machine and solar battery
06/18/2008CN101203095A Method for preparation of multi-layer flexible circuit board
06/18/2008CN101203094A Method for multi-layer board semi-curing glue transferring of flexible printed wiring board
06/18/2008CN101203093A Circuit board metallic layer amending method
06/18/2008CN101203092A Difference pair identifying method
06/18/2008CN101203091A Circuit board renovation method
06/18/2008CN101203090A Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
06/18/2008CN101203089A Multilayer printed circuit board
06/18/2008CN101203088A Circuit board with selective surface roughness and preparation method
06/18/2008CN101200131A Method and mechanism for cleaning steel mesh of vision printer without interrupting printing
06/18/2008CN101200025A Soldering process
06/18/2008CN100396167C Bonding pads for a printed circuit board and formation method thereof
06/18/2008CN100396165C Differential wire assembling method for eliminating high speed board interferes
06/18/2008CN100395792C Checking marker and electronic machine
06/18/2008CN100395540C Optical inspection system having integrated component learning
06/18/2008CN100395519C Figure checking device
06/17/2008US7389012 Electro-optical module comprising flexible connection cable and method of making the same
06/17/2008US7388733 Method for making noble metal conductive leads for suspension assemblies
06/17/2008US7388448 Semi-suspended coplanar waveguide on a printed circuit board
06/17/2008US7388166 Stretchable fabric switch
06/17/2008US7388159 Printed wiring board and method for manufacturing the same
06/17/2008US7388158 Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
06/17/2008US7388157 Printed wiring board
06/17/2008US7387870 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
06/17/2008US7387827 Interconnection designs and materials having improved strength and fatigue life
06/17/2008US7387812 Heat-curable resin composition
06/17/2008US7387741 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
06/17/2008US7387717 Method of performing electrolytic treatment on a conductive layer of a substrate
06/17/2008US7387365 Nozzle for an inkjet printer incorporating a plunger assembly
06/17/2008US7387119 Dicing saw with variable indexing capability
06/17/2008US7386937 Method of making a biosensor
06/17/2008US7386936 Method for manufacturing in electrically conductive pattern
06/17/2008CA2296825C Electrical slip ring having a higher circuit density
06/12/2008WO2008069733A1 A surface-mountable waveguide arrangement
06/12/2008WO2008069714A1 A surface-mountable waveguide arrangement
06/12/2008WO2008069565A1 Method for high resolution ink-jet print using pre-patterned substrate and conductive substrate manufactured using the same
06/12/2008WO2008069328A1 Method of producing conductive circuit board
06/12/2008WO2008068387A1 An electric sensor web, system and a method for its manufacture
06/12/2008WO2008068163A2 Base film for preventing the electro-static discharge of an electronic module and module producing method using the base film
06/12/2008WO2008068118A1 Method for mounting a printed circuit board on a baseboard, and an arrangement, which is protected against short circuits, of a printed circuit board on an electrically conductive base board.
06/12/2008WO2008048554A3 Improved epoxy compositions
06/12/2008WO2008009475A3 Solder flux
06/12/2008US20080139014 Interconnect assemblies, and methods of forming interconnects
06/12/2008US20080138973 Microelectronic devices and methods for forming interconnects in microelectronic devices
06/12/2008US20080138934 Method of manufacturing multi-stack package
06/12/2008US20080138505 Formation method of metal layer on resin layer, printed wiring board, and production method thereof
06/12/2008US20080137318 Compliant structure for an electronic device, method of manufacturing same, and system containing same
06/12/2008US20080137316 Conductive patterns and methods of using them
06/12/2008US20080137314 Microelectronic substrate including embedded components and spacer layer and method of forming same
06/12/2008US20080137303 Dual cavity, high-heat dissipating printed wiring board assembly
06/12/2008US20080136428 Contacting component, method of producing the same, and test tool having the contacting component
06/12/2008US20080136033 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
06/12/2008US20080136013 Multilayer substrate and method of manufacturing the same
06/12/2008US20080135283 Protruding Electrode for Connecting Electronic Component, Electronic Component Mounted Body Using Such Electrode, and Methods for Manufacturing Such Electrode and Electronic Component Mounted Body
06/12/2008US20080135282 Printed multilayer circuit containing active devices and method of manufaturing
06/12/2008US20080135280 Wired circuit board
06/12/2008US20080134501 Method For Forming Electrically Conductive Patterns on an Insulating Substrate, and Resulting Device
06/12/2008US20080134500 Producing method of wired circuit board
06/12/2008US20080134499 a capacitor dielectric film of very high relative dielectric constant formed without forming through-holes in the substrate
06/12/2008DE10314502B4 Verfahren zum elektrolytischen Beschichten einer Halbleiterstruktur A method for electrolytic coating of a semiconductor structure
06/12/2008DE102007045073A1 Lösung zum Ablösen von Metall und deren Verwendung in einem Verfahren zum Ablösen von Metall Solution for stripping the metal and their use in a method for stripping metal
06/12/2008CA2671163A1 An electric sensor web, system and a method for its manufacture
06/11/2008EP1931186A1 Multilayered circuit board and electronic equipment
06/11/2008EP1931183A2 Electronic device
06/11/2008EP1930843A1 Backing film adapted for preventing electronic module electrostatic discharges and method of manufacturing a module implementing the backing film
06/11/2008EP1930117A1 Lead-free low-temperature solder
06/11/2008EP1929848A1 Connection of two semi-conductor plates or flat components by means of a mechanical lock
06/11/2008EP1929846A2 System and method for shielded coaxial cable attachment
06/11/2008EP1928694A1 Conductive textile, antenna and vehicle seat
06/11/2008EP1198860B1 Electrical transmission arrangement
06/11/2008EP0743812B1 Multilayer printed wiring board and process for producing the same
06/11/2008CN101199248A 多层印刷线路板 Multilayer printed circuit boards
06/11/2008CN101199247A Printed wiring board
06/11/2008CN101199246A Method for manufacturing a circuit board structure, and a circuit board structure
06/11/2008CN101199245A A patterned metal layer using thermal transfer
06/11/2008CN101199244A Method for manufacturing a circuit board structure, and a circuit board structure
06/11/2008CN101199243A RF front-end module for picocell and microcell base station transceivers
06/11/2008CN101199242A Method for manufacturing a circuit board structure, and a circuit board structure