| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/09/2008 | EP1909541A1 Lighting device of discharge lamp, illumination apparatus and illumination system |
| 04/09/2008 | EP1908853A1 METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN |
| 04/09/2008 | EP1908584A1 Laminated glazing |
| 04/09/2008 | EP1908339A1 Mounting electrical components |
| 04/09/2008 | EP1651439B1 Device for step-wise lamination of steps |
| 04/09/2008 | EP1472914B1 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
| 04/09/2008 | EP1224339B1 Selective deposition of organic solderability preservative on copper |
| 04/09/2008 | EP1169718B1 Arrangement and method for trimming electronic components on a substrate |
| 04/09/2008 | CN101160733A 高频模块 High-frequency module |
| 04/09/2008 | CN101160674A Composite films suitable for use in opto-electronic and electronic devices |
| 04/09/2008 | CN101160632A Metal conductive film and process for producing the same |
| 04/09/2008 | CN101160584A Circuit wiring interference analysis device, interference analysis program, database used in interference analysis device, and asymmetrically connected line model |
| 04/09/2008 | CN101160213A Printing screens |
| 04/09/2008 | CN101160194A Pin to transmitting substance |
| 04/09/2008 | CN101160193A Jet solder vessel |
| 04/09/2008 | CN101160027A Method of producing circuit board and compound circuit substrates with through-hole plating structure |
| 04/09/2008 | CN101160026A Primer, conductor foil with resin, laminate and process for producing the laminate |
| 04/09/2008 | CN101160025A Spilled stannum port external-open L-shaped kettle port |
| 04/09/2008 | CN101160024A Manufacturing method of imbedded PBC |
| 04/09/2008 | CN101160023A Method for manufacturing cover lay of printed circuit board |
| 04/09/2008 | CN101160022A Filling coated material for lamination and laminating technique of flexible circuit board |
| 04/09/2008 | CN101160021A Whole panel cutting device and cutting method for jigsaw of printed circuit board |
| 04/09/2008 | CN101160019A Wiring board |
| 04/09/2008 | CN101160017A Wired circuit board and electronic device |
| 04/09/2008 | CN101159240A Electronic device and method of manufacturing the same |
| 04/09/2008 | CN101159239A Electronic device and method of manufacturing the same |
| 04/09/2008 | CN101159238A Electronic device and method of manufacturing the same |
| 04/09/2008 | CN101159181A Plated substrate and method of manufacturing the same |
| 04/09/2008 | CN101159180A Element substrate and method of manufacturing the same |
| 04/09/2008 | CN101159179A Element substrate and method of manufacturing the same |
| 04/09/2008 | CN101159036A RFID label technique |
| 04/09/2008 | CN100381027C Printed wiring board and method of producing same |
| 04/09/2008 | CN100381026C Printed wiring board and method of producing same |
| 04/09/2008 | CN100381025C Flexible wiring board with multilayer structure and its making method |
| 04/09/2008 | CN100381024C Method and apparatus for encapsulating semiconductor device |
| 04/09/2008 | CN100381023C Carriers for printed circuit board marking |
| 04/09/2008 | CN100380741C Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 04/09/2008 | CN100380657C Multi-configuration processor-memory substrate device |
| 04/09/2008 | CN100380637C Wiring board and semiconductor package using the same |
| 04/09/2008 | CN100380540C Dielectric structure |
| 04/09/2008 | CN100380450C Electric connector and member assembly for hard disk driver |
| 04/09/2008 | CN100379898C Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 04/09/2008 | CN100379896C Chemical processing method and chemical processing device |
| 04/09/2008 | CN100379832C Adhesive for circuit components connection circuit board and producing method thereof |
| 04/09/2008 | CN100379781C Polyoxazolidone adhesive resin compoistion prepared from polyepoxides and polyisocyanates |
| 04/08/2008 | US7355863 High frequency multilayer integrated circuit |
| 04/08/2008 | US7355862 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module |
| 04/08/2008 | US7355853 Module structure and module comprising it |
| 04/08/2008 | US7355818 Disc drive integral actuator pins |
| 04/08/2008 | US7355504 Electrical devices |
| 04/08/2008 | US7355288 Low fabrication cost, high performance, high reliability chip scale package |
| 04/08/2008 | US7355127 Printed wiring board and electronic device using the same |
| 04/08/2008 | US7354699 Easily removal of marking without defect; patterning multilayer photoresist masking layer covering marking; etching |
| 04/08/2008 | US7354697 Forming conductor pattern on dielectric; overcoating with photosensitive solders photoresists, then transparent protective coating; exposure to light |
| 04/08/2008 | US7354299 Electrical connector |
| 04/08/2008 | US7353983 Vertical removal of excess solder from a circuit substrate |
| 04/08/2008 | US7353600 Circuit board fabrication method and circuit board |
| 04/08/2008 | US7353599 Fiducial markings for quality verification of high density circuit board connectors |
| 04/08/2008 | US7353598 Assembly comprising functional devices and method of making same |
| 04/08/2008 | US7353596 Component mounting method |
| 04/08/2008 | US7353595 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon |
| 04/08/2008 | US7353594 Component mounting method |
| 04/08/2008 | US7353593 Method for assembling micro structures |
| 04/08/2008 | US7353592 Method of fabricating an RF substrate with selected electrical properties |
| 04/08/2008 | US7353591 Method of manufacturing coreless substrate |
| 04/08/2008 | US7353590 Method of forming printed circuit card |
| 04/08/2008 | CA2438751C Technique for reducing the number of layers in a signal routing device |
| 04/05/2008 | CA2604754A1 Silver-containing nanoparticles with replacement stabilizer |
| 04/03/2008 | WO2008038663A1 Method for manufacturing printed wiring board |
| 04/03/2008 | WO2008038565A1 Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles |
| 04/03/2008 | WO2008038557A1 Adhesive sheet sticking device and sticking method |
| 04/03/2008 | WO2008038500A1 Laminate, method of forming conductive pattern, conductive pattern obtained thereby, printed wiring board, thin-layer transistor and apparatus utilizing these |
| 04/03/2008 | WO2008038482A1 Production method and production equipment of printed wiring board |
| 04/03/2008 | WO2008037559A1 Use of an adhesive composition for die-attaching high power semiconductors |
| 04/03/2008 | WO2008037508A1 Electronics assembly and method for production of an electronics assembly for use in automobile electronics |
| 04/03/2008 | WO2007145979A3 Liquid composition for deposition of organic active materials in the field of oled printing |
| 04/03/2008 | US20080081967 Method and apparatus for detecting misapplied sensors |
| 04/03/2008 | US20080081275 Coating metal particles with silica, absorb the polymerizable group onto the surfaces of the particles with a polymerizable group-containing silane coupling agent, polymerizing a monomer in the presence of the polymerizable group-containing particles |
| 04/03/2008 | US20080080154 Printed board and method for producing the printed board |
| 04/03/2008 | US20080080153 Printed wiring board reliably achieving electric connection with electronic component |
| 04/03/2008 | US20080080151 Circuit Module |
| 04/03/2008 | US20080080148 Memory card and method of manufacturing the same |
| 04/03/2008 | US20080080141 Electrical Circuit Package |
| 04/03/2008 | US20080079140 Electronic system modules and method of fabricaton |
| 04/03/2008 | US20080079136 Method and apparatus for supplying power to a semiconductor device using a capacitor dc shunt |
| 04/03/2008 | US20080079118 Reworkable passive element embedded printed circuit board |
| 04/03/2008 | US20080078572 Circuit board and method of manufacturing the same |
| 04/03/2008 | US20080078570 Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing |
| 04/03/2008 | DE19608032B4 An der Oberfläche zu befestigende, elektrische Kontakte On the surface to be fastened, electrical contacts |
| 04/03/2008 | DE102007045485A1 Method for manufacturing insulating substrate, involves laminating thermoplastic adhesive foil on base material, where conductor is laid on adhesive foil by ultrasound and covering material is laminated on adhesive foil |
| 04/03/2008 | DE102007040876A1 Multilayer printed circuit board, has substrate made of isolation material, and switching structures made of conducting material and laminated on top of each other by substrate in lamination direction |
| 04/03/2008 | DE102007039768A1 Printed circuit board treatment method, involves detecting relation between spindle operation time and displacement of point of drill held by spindle in axial direction according to number of revolutions |
| 04/03/2008 | DE102006046260A1 Bauteilanordnung Component arrangement |
| 04/03/2008 | DE10121296B4 Mobiltelefon Mobile phone |
| 04/02/2008 | EP1906719A1 Electronic controller |
| 04/02/2008 | EP1906718A2 Component assembly |
| 04/02/2008 | EP1906717A2 Component assembly |
| 04/02/2008 | EP1906716A2 Pattern forming apparatus and pattern forming method |
| 04/02/2008 | EP1906442A2 Fabrication of a wiring pattern and of an active matrix substrate |
| 04/02/2008 | EP1906325A2 Height-limit calculation apparatus, height-limit calculation method, method of manufacturing three-dimensional structure, and computer product |