Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
---|
05/01/2008 | US20080099932 Resilient carrier assembly for an integrated circuit |
05/01/2008 | US20080099928 Low fabrication cost, high performance, high reliability chip scale package |
05/01/2008 | US20080099338 Depositing a first pattern onto a substrate using the first mask to forming a first layer, removing the first mask, depositing a second material, building additional layers adjacent to and adhered to previously formed layers; removing undesired elements of material via etching or electropolishing |
05/01/2008 | US20080099237 Printed circuit board and electronic component device |
05/01/2008 | US20080099236 Method for mating flexure to flex-print circuit and flexure therefor |
05/01/2008 | US20080099235 Printed-wiring board, method for forming electrode of the board, and hard disk device |
05/01/2008 | US20080099234 Electronic module with dual connectivity |
05/01/2008 | US20080099230 Flex-rigid wiring board and method of manufacturing the same |
05/01/2008 | US20080099121 Conductive Paste and Method for Manufacturing Multilayer Printed Wiring Board Using the Same |
05/01/2008 | US20080098597 Method of manufacturing circuit board |
05/01/2008 | US20080098596 Method for forming transcriptional circuit and method for manufacturing circuit board |
05/01/2008 | US20080098595 Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate |
05/01/2008 | US20080098591 Mounting apparatus and method to control mounting apparatus |
04/30/2008 | EP1916885A2 Printed circuit board and electronic component device |
04/30/2008 | EP1916883A1 Lighting device of discharge lamp, illumination apparatus and illumination system |
04/30/2008 | EP1916709A1 Method of bonding |
04/30/2008 | EP1916670A2 Patterning PEDOT:PSS layer by controlled electrochemical reaction |
04/30/2008 | EP1916553A1 Device for the electrical connection |
04/30/2008 | EP1916098A1 Laminate and process for producing the same |
04/30/2008 | EP1915776A2 Technique for efficiently patterning an underbump metallization layer using a dry etch process |
04/30/2008 | EP1915774A2 Printable semiconductor structures and related methods of making and assembling |
04/30/2008 | EP1495154B1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
04/30/2008 | EP0964496B1 Electric connection box |
04/30/2008 | DE4337675B4 Verfahren zur Herstellung von stapelbaren Halbleitergehäusen A process for the production of stackable semiconductor packages |
04/30/2008 | DE202007018320U1 Löt- oder Klebevorrichtung Soldering or gluing machine |
04/30/2008 | DE112006001506T5 Platinenstruktur und Verfahren zu ihrer Herstellung Platinum structure and process for their preparation |
04/30/2008 | DE10308448B4 Hochfrequenzmodul RF module |
04/30/2008 | DE102007037079A1 Formulation for use in generation of electrical conductive or optical coatings, comprises silver metal particles, solvent, dispersion agent and additives |
04/30/2008 | DE102006051379A1 Transponder for textiles has first elastic wire antenna of known length stuck to textile substrate and wire ends in region of chip module with embroidery pattern |
04/30/2008 | DE102006050964A1 Electrical and/or electronic component e.g. microchip module, applying method, involves moving electronic circuits from transfer belt under pressure effect on printed good that is guided to conveyer system in position-accurate manner |
04/30/2008 | DE102006050023A1 Verfahren zur Bearbeitung von Material durch Schwerionenbestrahlung und nachfolgenden Ätzprozess A method for processing material by heavy ion irradiation and subsequent etching process |
04/30/2008 | CN201054862Y Placement machine positioning platform for linear motor drive |
04/30/2008 | CN101171895A Printed wiring board |
04/30/2008 | CN101171894A Printed wiring board |
04/30/2008 | CN101171893A Circuit substrate connection structure and circuit substrate connection method |
04/30/2008 | CN101171675A Bonding sheet sticking equipment and method |
04/30/2008 | CN101170897A No empty hole installation method for installing electronic components |
04/30/2008 | CN101170895A Optical module producing method and apparatus |
04/30/2008 | CN101170879A Multilayer wiring board and method of manufacturing the same |
04/30/2008 | CN101170878A Method for manufacturing print circuit board |
04/30/2008 | CN101170877A Combination method of soft and hard printed circuit board |
04/30/2008 | CN101170876A Manufacturing method and structure of built-in passive component |
04/30/2008 | CN101170875A Circuit board and its manufacture method |
04/30/2008 | CN101170874A Method for forming transcription circuit and method for manufacturing circuit board |
04/30/2008 | CN101170873A Circuit board unit and method for production thereof |
04/30/2008 | CN101170872A A power amplifier component and its manufacturing method |
04/30/2008 | CN101170869A Print circuit board embedding capacitor and its manufacture method |
04/30/2008 | CN101170231A Board-mounted type connector to which a shield plate is attached |
04/30/2008 | CN101170105A Optical device module, fabrication method thereof, optical device unit and fabrication method thereof |
04/30/2008 | CN101170069A Hole opening method for high-aligning degree welding prevention layer |
04/30/2008 | CN101169986A Electrically conductive paste and method of making the same |
04/30/2008 | CN101169590A Light solidifying heat curing resin composition and printing circuit board using the same |
04/30/2008 | CN101169182A Wave generator belt wheel |
04/30/2008 | CN101168207A Tin wave generator |
04/30/2008 | CN101168206A Tin wave generating device |
04/30/2008 | CN101168205A Tin wave generating machine impeller |
04/30/2008 | CN100386013C Substrate holding method and method of manufacturing electronic part |
04/30/2008 | CN100386012C Apparatus and method for replacement of defective parts of pcb panel |
04/30/2008 | CN100386010C Shielding for EMI-endangered electronic components and/or circuits of electronic devices |
04/30/2008 | CN100386006C Printed circuit board and formation method |
04/30/2008 | CN100385999C Surface mounting elemctronic element encapsulation |
04/30/2008 | CN100385661C Method and apparatus for encoding information in IC package |
04/30/2008 | CN100385656C Arrangement of vias in a substrate to support a ball grid array |
04/30/2008 | CN100385655C 集成电路封装 IC packaging |
04/30/2008 | CN100384951C Insect repellent coating and industrial product using the same |
04/30/2008 | CN100384620C Sheet for thermal pressing |
04/30/2008 | CN100384579C Operating method and trolley for a laser machining system |
04/29/2008 | US7366629 High frequency module board device |
04/29/2008 | US7365414 Component packaging apparatus, systems, and methods |
04/29/2008 | US7365272 Circuit board with identifiable information and method for fabricating the same |
04/29/2008 | US7365008 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus |
04/29/2008 | US7364996 Methods of fabricating patterned layers on a substrate |
04/29/2008 | US7364941 Circuit device manufacturing method |
04/29/2008 | US7364769 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof |
04/29/2008 | US7364625 Rinsing processes and equipment |
04/29/2008 | US7364622 Method and apparatus for fabricating a device, and the device and an electronic equipment |
04/29/2008 | US7364270 Fluid ejection device having an elongate micro-electromechanical actuator |
04/29/2008 | US7363704 RFID tag and method of manufacturing RFID tag |
04/24/2008 | WO2008048928A2 Methods of patterning a material on polymeric substrates |
04/24/2008 | WO2008047918A1 Electronic device package structure and package manufacturing method |
04/24/2008 | WO2008047888A1 Method for forming solder layer on printed-wiring board and slurry discharge device |
04/24/2008 | WO2008047866A1 Resin composition and coating-film-forming material comprising the same |
04/24/2008 | WO2008047852A1 Multilayer substrate |
04/24/2008 | WO2008047718A1 Multilayer printed wiring board and method for manufacturing the same |
04/24/2008 | WO2008047650A1 Processing method, processing device, program and computer readable storage medium |
04/24/2008 | WO2008047644A1 Electric information processing method for cad system, device thereof, program, and computer-readable storage medium |
04/24/2008 | WO2008047639A1 Purifying catalyst for gas within reflow furnace, method for preventing contamination of reflow furnace, and reflow furnace |
04/24/2008 | WO2008047583A1 Curable resin composition, composite body, molded body, laminate and multilayer circuit board |
04/24/2008 | WO2008047422A1 Wiring pattern inspecting method and wiring pattern inspecting system |
04/24/2008 | WO2008046395A1 Method of working material by heavy ion bombardment and a subsequent etching process |
04/24/2008 | WO2008046188A1 Circuit board with regional flexibility |
04/24/2008 | WO2007130349A3 Wireless access point |
04/24/2008 | US20080096323 Integrated circuit die/package interconnect |
04/24/2008 | US20080096314 Ball grid array package and method thereof |
04/24/2008 | US20080096016 Laminated body used to produce printed wiring board, and method of producing printed wiring board using the same |
04/24/2008 | US20080095637 Solid state fluid level sensor |
04/24/2008 | US20080094807 Single Chip USB Packages With Swivel Cover |
04/24/2008 | US20080094805 Electronics Module and Method for Manufacturing the Same |
04/24/2008 | US20080094640 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structure |
04/24/2008 | US20080093423 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |