Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2008
05/01/2008US20080099932 Resilient carrier assembly for an integrated circuit
05/01/2008US20080099928 Low fabrication cost, high performance, high reliability chip scale package
05/01/2008US20080099338 Depositing a first pattern onto a substrate using the first mask to forming a first layer, removing the first mask, depositing a second material, building additional layers adjacent to and adhered to previously formed layers; removing undesired elements of material via etching or electropolishing
05/01/2008US20080099237 Printed circuit board and electronic component device
05/01/2008US20080099236 Method for mating flexure to flex-print circuit and flexure therefor
05/01/2008US20080099235 Printed-wiring board, method for forming electrode of the board, and hard disk device
05/01/2008US20080099234 Electronic module with dual connectivity
05/01/2008US20080099230 Flex-rigid wiring board and method of manufacturing the same
05/01/2008US20080099121 Conductive Paste and Method for Manufacturing Multilayer Printed Wiring Board Using the Same
05/01/2008US20080098597 Method of manufacturing circuit board
05/01/2008US20080098596 Method for forming transcriptional circuit and method for manufacturing circuit board
05/01/2008US20080098595 Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate
05/01/2008US20080098591 Mounting apparatus and method to control mounting apparatus
04/2008
04/30/2008EP1916885A2 Printed circuit board and electronic component device
04/30/2008EP1916883A1 Lighting device of discharge lamp, illumination apparatus and illumination system
04/30/2008EP1916709A1 Method of bonding
04/30/2008EP1916670A2 Patterning PEDOT:PSS layer by controlled electrochemical reaction
04/30/2008EP1916553A1 Device for the electrical connection
04/30/2008EP1916098A1 Laminate and process for producing the same
04/30/2008EP1915776A2 Technique for efficiently patterning an underbump metallization layer using a dry etch process
04/30/2008EP1915774A2 Printable semiconductor structures and related methods of making and assembling
04/30/2008EP1495154B1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
04/30/2008EP0964496B1 Electric connection box
04/30/2008DE4337675B4 Verfahren zur Herstellung von stapelbaren Halbleitergehäusen A process for the production of stackable semiconductor packages
04/30/2008DE202007018320U1 Löt- oder Klebevorrichtung Soldering or gluing machine
04/30/2008DE112006001506T5 Platinenstruktur und Verfahren zu ihrer Herstellung Platinum structure and process for their preparation
04/30/2008DE10308448B4 Hochfrequenzmodul RF module
04/30/2008DE102007037079A1 Formulation for use in generation of electrical conductive or optical coatings, comprises silver metal particles, solvent, dispersion agent and additives
04/30/2008DE102006051379A1 Transponder for textiles has first elastic wire antenna of known length stuck to textile substrate and wire ends in region of chip module with embroidery pattern
04/30/2008DE102006050964A1 Electrical and/or electronic component e.g. microchip module, applying method, involves moving electronic circuits from transfer belt under pressure effect on printed good that is guided to conveyer system in position-accurate manner
04/30/2008DE102006050023A1 Verfahren zur Bearbeitung von Material durch Schwerionenbestrahlung und nachfolgenden Ätzprozess A method for processing material by heavy ion irradiation and subsequent etching process
04/30/2008CN201054862Y Placement machine positioning platform for linear motor drive
04/30/2008CN101171895A Printed wiring board
04/30/2008CN101171894A Printed wiring board
04/30/2008CN101171893A Circuit substrate connection structure and circuit substrate connection method
04/30/2008CN101171675A Bonding sheet sticking equipment and method
04/30/2008CN101170897A No empty hole installation method for installing electronic components
04/30/2008CN101170895A Optical module producing method and apparatus
04/30/2008CN101170879A Multilayer wiring board and method of manufacturing the same
04/30/2008CN101170878A Method for manufacturing print circuit board
04/30/2008CN101170877A Combination method of soft and hard printed circuit board
04/30/2008CN101170876A Manufacturing method and structure of built-in passive component
04/30/2008CN101170875A Circuit board and its manufacture method
04/30/2008CN101170874A Method for forming transcription circuit and method for manufacturing circuit board
04/30/2008CN101170873A Circuit board unit and method for production thereof
04/30/2008CN101170872A A power amplifier component and its manufacturing method
04/30/2008CN101170869A Print circuit board embedding capacitor and its manufacture method
04/30/2008CN101170231A Board-mounted type connector to which a shield plate is attached
04/30/2008CN101170105A Optical device module, fabrication method thereof, optical device unit and fabrication method thereof
04/30/2008CN101170069A Hole opening method for high-aligning degree welding prevention layer
04/30/2008CN101169986A Electrically conductive paste and method of making the same
04/30/2008CN101169590A Light solidifying heat curing resin composition and printing circuit board using the same
04/30/2008CN101169182A Wave generator belt wheel
04/30/2008CN101168207A Tin wave generator
04/30/2008CN101168206A Tin wave generating device
04/30/2008CN101168205A Tin wave generating machine impeller
04/30/2008CN100386013C Substrate holding method and method of manufacturing electronic part
04/30/2008CN100386012C Apparatus and method for replacement of defective parts of pcb panel
04/30/2008CN100386010C Shielding for EMI-endangered electronic components and/or circuits of electronic devices
04/30/2008CN100386006C Printed circuit board and formation method
04/30/2008CN100385999C Surface mounting elemctronic element encapsulation
04/30/2008CN100385661C Method and apparatus for encoding information in IC package
04/30/2008CN100385656C Arrangement of vias in a substrate to support a ball grid array
04/30/2008CN100385655C 集成电路封装 IC packaging
04/30/2008CN100384951C Insect repellent coating and industrial product using the same
04/30/2008CN100384620C Sheet for thermal pressing
04/30/2008CN100384579C Operating method and trolley for a laser machining system
04/29/2008US7366629 High frequency module board device
04/29/2008US7365414 Component packaging apparatus, systems, and methods
04/29/2008US7365272 Circuit board with identifiable information and method for fabricating the same
04/29/2008US7365008 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus
04/29/2008US7364996 Methods of fabricating patterned layers on a substrate
04/29/2008US7364941 Circuit device manufacturing method
04/29/2008US7364769 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof
04/29/2008US7364625 Rinsing processes and equipment
04/29/2008US7364622 Method and apparatus for fabricating a device, and the device and an electronic equipment
04/29/2008US7364270 Fluid ejection device having an elongate micro-electromechanical actuator
04/29/2008US7363704 RFID tag and method of manufacturing RFID tag
04/24/2008WO2008048928A2 Methods of patterning a material on polymeric substrates
04/24/2008WO2008047918A1 Electronic device package structure and package manufacturing method
04/24/2008WO2008047888A1 Method for forming solder layer on printed-wiring board and slurry discharge device
04/24/2008WO2008047866A1 Resin composition and coating-film-forming material comprising the same
04/24/2008WO2008047852A1 Multilayer substrate
04/24/2008WO2008047718A1 Multilayer printed wiring board and method for manufacturing the same
04/24/2008WO2008047650A1 Processing method, processing device, program and computer readable storage medium
04/24/2008WO2008047644A1 Electric information processing method for cad system, device thereof, program, and computer-readable storage medium
04/24/2008WO2008047639A1 Purifying catalyst for gas within reflow furnace, method for preventing contamination of reflow furnace, and reflow furnace
04/24/2008WO2008047583A1 Curable resin composition, composite body, molded body, laminate and multilayer circuit board
04/24/2008WO2008047422A1 Wiring pattern inspecting method and wiring pattern inspecting system
04/24/2008WO2008046395A1 Method of working material by heavy ion bombardment and a subsequent etching process
04/24/2008WO2008046188A1 Circuit board with regional flexibility
04/24/2008WO2007130349A3 Wireless access point
04/24/2008US20080096323 Integrated circuit die/package interconnect
04/24/2008US20080096314 Ball grid array package and method thereof
04/24/2008US20080096016 Laminated body used to produce printed wiring board, and method of producing printed wiring board using the same
04/24/2008US20080095637 Solid state fluid level sensor
04/24/2008US20080094807 Single Chip USB Packages With Swivel Cover
04/24/2008US20080094805 Electronics Module and Method for Manufacturing the Same
04/24/2008US20080094640 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structure
04/24/2008US20080093423 Low viscosity precursor compositions and methods for the deposition of conductive electronic features