| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/22/2008 | US7402894 Integrated circuit carrier |
| 07/22/2008 | US7402759 Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board |
| 07/22/2008 | US7402758 Telescoping blind via in three-layer core |
| 07/22/2008 | US7402755 Circuit board with quality-indicator mark and method for indicating quality of the circuit board |
| 07/22/2008 | US7402508 Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board |
| 07/22/2008 | US7402457 Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces |
| 07/22/2008 | US7402254 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
| 07/22/2008 | US7401900 Inkjet nozzle with long ink supply channel |
| 07/22/2008 | US7401884 Inkjet printhead with integral nozzle plate |
| 07/22/2008 | US7401744 Jetting device and a method of jetting device |
| 07/22/2008 | US7401725 System and method for improving hard drive actuator lead attachment |
| 07/22/2008 | US7401403 Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios |
| 07/22/2008 | US7401402 Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor |
| 07/22/2008 | US7401393 Method for removing solder bumps from LSI |
| 07/17/2008 | WO2008084795A1 Dust removal device |
| 07/17/2008 | WO2008084673A1 Semiconductor device and method for manufacturing the semiconductor device |
| 07/17/2008 | WO2008083794A1 Led module with gold bonding |
| 07/17/2008 | WO2008043612A3 Method for the production of a sensor component, and sensor component |
| 07/17/2008 | WO2007145541A3 Circuit board |
| 07/17/2008 | US20080171220 a copper clad laminate coated with copper foils of different thicknesses on both sides, a first copper foil on one side of the laminate is not recrystallizable by hot pressing and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil; reduce warping |
| 07/17/2008 | US20080171138 Process For Producing A Printed Wiring Board |
| 07/17/2008 | US20080170372 Electronic control apparatus and method of manufacturing the same |
| 07/17/2008 | US20080170196 Contact Structure, Display Device and Electronic Device |
| 07/17/2008 | US20080170110 Circuit board with terminals arranged in a single row and disposed at board edges, cartridges with the circuit board, and methods for making same |
| 07/17/2008 | US20080169124 Padless via and method for making same |
| 07/17/2008 | US20080169123 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 07/17/2008 | US20080169122 Electrically Conductive Ink, Electrically Conductive Circuit, and Non-Contact-Type Medium |
| 07/17/2008 | US20080169120 Printed circuit board and method of manufacturing printed ciruit board |
| 07/17/2008 | US20080168652 Method of manufacturing a multilayer wiring board |
| 07/17/2008 | US20080168651 Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
| 07/17/2008 | US20080168647 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 07/17/2008 | US20080168638 Piezoelectric substrate for a saw device |
| 07/17/2008 | DE102007062425A1 Device for contacting contact surface with another contact surface over contact element, has contact element, which is embodied partly to flexible substrate and has conductor connecting both contact surfaces |
| 07/17/2008 | DE102007002193A1 Mehrteiliges Kontaktierungsbauteil Multipart Kontaktierungsbauteil |
| 07/17/2008 | DE102006058731A1 Leiterplattenverbindung PCB connection |
| 07/16/2008 | EP1945013A1 Multilayer printed wiring board and method for manufacturing same |
| 07/16/2008 | EP1945012A1 LED module with gold bonding |
| 07/16/2008 | EP1945010A2 Multi-layer substrate and electronic device having the same |
| 07/16/2008 | EP1945009A2 Combination assembly of led and liquid-vapor thermally dissipating device |
| 07/16/2008 | EP1944834A2 Compliant pin |
| 07/16/2008 | EP1944552A2 Cook top control pad and alphanumeric displays integrated therewith |
| 07/16/2008 | EP1944335A2 Flame retardant resin compositions and use thereof |
| 07/16/2008 | EP1943888A2 A component adapted for being mounted on a substrate and a method of mounting a surface mounted device |
| 07/16/2008 | EP1943104A1 Multilayer imageable element with improved chemical resistance |
| 07/16/2008 | EP1185151B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/16/2008 | EP0989914B1 Multilayer metalized composite on polymer film product and process |
| 07/16/2008 | CN201087976Y 层压机 Laminating machine |
| 07/16/2008 | CN201086069Y Flat material cleaning machine combination wheel capable of being movably dissembled |
| 07/16/2008 | CN101223835A Process for producing wiring board covered with thermoplastic liquid crystal polymer film |
| 07/16/2008 | CN101223834A Apparatus and methods for continuously depositing a pattern of material onto a substrate |
| 07/16/2008 | CN101223015A Process for producing prepreg with carrier, prepreg with carrier, process for producing thin-type double sided board, thin-type double sided board, and process for producing multilayered printed wirin |
| 07/16/2008 | CN101223002A Solder free from lead for additional supply and method of regulating Cu concentration and Ni concentration in solder bath |
| 07/16/2008 | CN101222824A Multi-layer substrate and electronic device having the same |
| 07/16/2008 | CN101222823A Method for manufacturing multilayer printed wiring board |
| 07/16/2008 | CN101222822A Printed wiring board unit for method of detecting rising level of electrically-conductive body in bore |
| 07/16/2008 | CN101222821A Method and device for fixing element on substrate |
| 07/16/2008 | CN101222820A Production method for circuit board directly embedded in passive component |
| 07/16/2008 | CN101222819A Production method of embedded passive element |
| 07/16/2008 | CN101222818A Wiring substrate and manufacturing method thereof, and semiconductor device |
| 07/16/2008 | CN101222817A Blind hole plate and its processing method |
| 07/16/2008 | CN101222816A Sheets for drilling |
| 07/16/2008 | CN101221963A Electronic assembly for image sensor device and fabrication method thereof |
| 07/16/2008 | CN101221940A 厚膜电路元件及其制造方法 Thick film circuit device and manufacturing method |
| 07/16/2008 | CN101221771A Suspension board with circuit |
| 07/16/2008 | CN101219741A Film peeling off device |
| 07/16/2008 | CN101219596A Liquid droplet ejection apparatus, method of manufacturing electrooptical device, and electrooptical device |
| 07/16/2008 | CN100403861C Method of fixing IC package onto circuit board |
| 07/16/2008 | CN100403583C Secondary battery |
| 07/16/2008 | CN100403544C 摄像机模块及其制造方法 Camera module and its manufacturing method |
| 07/16/2008 | CN100403511C Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus |
| 07/16/2008 | CN100403501C Method and apparatus for filling vias |
| 07/16/2008 | CN100403500C Circuit device manufacturing method |
| 07/16/2008 | CN100403460C Surface contact type sandwich circuit protection device and making method thereof |
| 07/16/2008 | CN100403140C Liquid crystal display device and method for manufacturing liquid crystal display device |
| 07/16/2008 | CN100402285C Position adjustment platform of full-automatic vision printing machine |
| 07/16/2008 | CN100402273C Method for producing flexible metal foil-polyimide laminate |
| 07/15/2008 | US7400515 Circuit board electrode connection structure |
| 07/15/2008 | US7400514 Non-rigid conductor link measurement sensor and method for the production thereof |
| 07/15/2008 | US7400513 Conductive printed board, multicore cable and ultrasonic probe using the same |
| 07/15/2008 | US7400512 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
| 07/15/2008 | US7400222 Grooved coaxial-type transmission line, manufacturing method and packaging method thereof |
| 07/15/2008 | US7400157 Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes |
| 07/15/2008 | US7400040 Thermal interface apparatus, systems, and methods |
| 07/15/2008 | US7399928 Flexible flat cable and method of manufacturing the same |
| 07/15/2008 | US7399661 Method for making an integrated circuit substrate having embedded back-side access conductors and vias |
| 07/15/2008 | US7399579 Article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental meta; additional conductive material may then be deposited onto the elemental metal to produce a microstructure |
| 07/15/2008 | US7399321 Soldering method of nonaqueous-electrolyte secondary-battery |
| 07/15/2008 | US7398597 Method of fabricating monolithic microelectromechanical fluid ejection device |
| 07/15/2008 | US7398588 SOI component comprising margins for separation |
| 07/15/2008 | CA2176625C Radio frequency identification tag |
| 07/10/2008 | WO2008083002A1 Printing system with conductive element |
| 07/10/2008 | WO2008082847A2 Rotating contact element and methods of fabrication |
| 07/10/2008 | WO2008081981A1 Screen printing apparatus and screen printing method |
| 07/10/2008 | WO2008081969A1 Connecting method of electronic component |
| 07/10/2008 | WO2008081939A1 Laser reflow device |
| 07/10/2008 | WO2008081490A1 Gripping device and clamping pincers with double cathode contact on both sides of a dielectric substratum to be electroplated |
| 07/10/2008 | WO2008081430A2 Stencil printers and the like, optical systems therefor, and methods of printing and inspection |
| 07/10/2008 | WO2008080893A1 Process for producing electrically conductive surfaces |
| 07/10/2008 | WO2008080834A1 Translucent panel for connecting electronic components |
| 07/10/2008 | WO2008080749A1 Electric contacting device, particularly for electronic circuits, and electric/electronic circuit |