| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/04/2008 | EP1837383B1 Die-attach composition for high power semiconductors |
| 06/04/2008 | EP1588596A4 Circuit board stiffener |
| 06/04/2008 | EP1425948B1 A method of etching copper on cards |
| 06/04/2008 | EP1297385B1 Material and method for making an electroconductive pattern |
| 06/04/2008 | EP1165311A4 Multilayer ceramic circuit boards with embedded resistors |
| 06/04/2008 | CN101194547A Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method |
| 06/04/2008 | CN101194542A Flexible circuit substrate |
| 06/04/2008 | CN101194541A Method for soldering module substrate |
| 06/04/2008 | CN101194540A Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
| 06/04/2008 | CN101193505A Method for manufacturing stacking printing wiring plate |
| 06/04/2008 | CN101193504A Multilayered printed-wiring board and inter-layer connecting method thereof |
| 06/04/2008 | CN101193503A A making method for multi-layer flexible circuit board |
| 06/04/2008 | CN101193502A Circuit board structure and its making method |
| 06/04/2008 | CN101193501A Method for controlling plating layer thickness distribution in FPC making process |
| 06/04/2008 | CN101193500A Pattern forming method and circuit board |
| 06/04/2008 | CN101193499A Patterning method, droplet discharging device and circuit board |
| 06/04/2008 | CN101193498A Printed circuit board, printed circuit board assembly, manufacturing method of printed circuit board, warpage correcting method of printed circuit board and electronic device |
| 06/04/2008 | CN101193493A Circuit board structure and its dielectric layer structure |
| 06/04/2008 | CN101193492A Flexible circuit board and making method |
| 06/04/2008 | CN101192542A Circuit board structure and its manufacture method |
| 06/04/2008 | CN100393184C Substrate with channel guide |
| 06/04/2008 | CN100393183C Method for producing circuit-forming board |
| 06/04/2008 | CN100392834C Reinforced solder bump structure and method for forming a reinforced solder bump |
| 06/04/2008 | CN100392827C Method of manufacturing display device |
| 06/04/2008 | CN100392806C Electronic part and method for manufacturing the same |
| 06/04/2008 | CN100392782C Keyboard |
| 06/04/2008 | CN100392725C Production method of suspension board with circuit |
| 06/04/2008 | CN100392517C Suspension board with circuit |
| 06/04/2008 | CN100391730C Copper surface treatment for preventing microcrack in soft circuit |
| 06/03/2008 | US7382630 Board-mounting device |
| 06/03/2008 | US7382628 Circuit-component-containing module |
| 06/03/2008 | US7382619 Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency |
| 06/03/2008 | US7382389 Methods and systems for thermal-based laser processing a multi-material device |
| 06/03/2008 | US7381941 Contact image sensing module with movement detecting function |
| 06/03/2008 | US7381905 Structure for fixing an electronic device to a substrate |
| 06/03/2008 | US7381902 Wiring board and method of manufacturing the same |
| 06/03/2008 | US7381591 Flip-chip adaptor package for bare die |
| 06/03/2008 | US7381475 Treated copper foil and circuit board |
| 06/03/2008 | US7381449 Method for coating material, method of manufacturing color filter substrate, method of manufacturing electroluminescence display device, method of manufacturing plasma display device, and ejection device |
| 06/03/2008 | US7381283 Applying a constraining layer with windows on it that does not need to be removed after firing; simplifies procedures to lower production cost; high quality multilayer ceramics |
| 06/03/2008 | US7381064 Flexible flat cable termination structure for a clockspring |
| 06/03/2008 | US7380961 Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
| 06/03/2008 | US7380895 Droplet ejection device |
| 06/03/2008 | US7380690 Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate |
| 06/03/2008 | US7380338 Circuit board and manufacturing method thereof |
| 06/03/2008 | US7380337 Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module |
| 06/03/2008 | CA2422677C Technique for reducing the number of layers in a multilayer circuit board |
| 05/29/2008 | WO2008063138A2 An improved ball mounting apparatus and method |
| 05/29/2008 | WO2008063125A1 A process for treating a flexible thin film substrate, in the form of a dielectric plastic foil, and a thin film substrate thus formed |
| 05/29/2008 | WO2008063069A1 Method and apparatus for making partially coated products |
| 05/29/2008 | WO2008063063A1 Product with internal cavities, and method, system and mould for manufacturing such a product |
| 05/29/2008 | WO2008062496A1 Ceramic member, method of forming groove in ceramic member, and substrate for electronic part |
| 05/29/2008 | WO2008061385A2 Conductive textile material |
| 05/29/2008 | WO2008049006A3 Materials for use with interconnects of electrical devices and related methods |
| 05/29/2008 | WO2008032870A3 Electronic components mounting adhesive and electronic components mounting structure |
| 05/29/2008 | US20080124528 Printed electronic device and methods of determining the electrical value thereof |
| 05/29/2008 | US20080124490 Coating solution for forming wettability-varied pattern and method of producing pattern-formed body |
| 05/29/2008 | US20080123311 Ic chip package having force-adjustable member between stiffener and printed circuit board |
| 05/29/2008 | US20080123307 Printed circuit board, printed circuit board assembly, electronic device, manufacturing method of printed circuit board, and warpage correcting method of printed circuit board |
| 05/29/2008 | US20080123299 Circuit Device and Manufacturing Method of the Same |
| 05/29/2008 | US20080123273 Circuit Board Including Stubless Signal Paths and Method of Making Same |
| 05/29/2008 | US20080122547 Constant temperature type crystal oscillator |
| 05/29/2008 | US20080122057 Silicon carrier having increased flexibility |
| 05/29/2008 | US20080121832 Electric Interface for Water-Bearing Household Devices |
| 05/29/2008 | US20080121618 Method of Electrochemical Fabrication |
| 05/29/2008 | US20080121414 Printed circuit board and method for manufacturing thereof |
| 05/29/2008 | US20080120835 Method of making high speed interposer |
| 05/29/2008 | US20080120834 Fabrication method for producing conductive and functional geometric patterns |
| 05/29/2008 | US20080120833 Interconnect For Microelectronic Structures With Enhanced Spring Characteristics |
| 05/29/2008 | US20080120832 Solder ball loading method and solder ball loading apparatus |
| 05/29/2008 | US20080120828 High Density Planarized Inductor And Method Of Making The Same |
| 05/29/2008 | DE19950843B4 Lötvorrichtung Soldering device |
| 05/29/2008 | DE19704930B4 An der Oberfläche zu befestigende Verbinder, die die Kapillarwirkung fördern On the surface to be attached connector, which promote the capillary action |
| 05/29/2008 | DE10360206B4 Verfahren zum selektiven galvanischen Abscheiden in einer integrierten Schaltungsanordnung, insbesondere auf Kupfer, und integrierte Schaltungsanordnung A method of selectively electrodepositing in an integrated circuit arrangement, in particular copper, and integrated circuit arrangement |
| 05/29/2008 | DE10302022B4 Verfahren zur Herstellung eines verkleinerten Chippakets Process for the preparation of a reduced chip package |
| 05/29/2008 | DE102006056259A1 Elektrische Leiterplatte mit einer Anschlussklemme Electrical circuit board with a terminal |
| 05/29/2008 | DE102006056246A1 Heating device, useful for a hair dryer, comprises a holder from non-inflammable insulating material, as carrier of a resistor having a double spiral wire, where the wire and carrier are overlaid with a layer of inorganic water based dye |
| 05/29/2008 | DE102006056171A1 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung Device for determining and / or monitoring a process variable and method for contacting |
| 05/29/2008 | DE102006055576A1 Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger A method for producing a stretchable circuit carrier and stretchable circuit carrier |
| 05/29/2008 | DE102006053922A1 Modul mit Trägerelement Module with support element |
| 05/29/2008 | DE102006053792A1 Printed circuit board contacting device for motor vehicle, has zones lying on top of one another in boards, which are fixed together in mounting position and are arranged on top of each other, where zones are connected using contact unit |
| 05/29/2008 | DE102006053697A1 Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen und Herstellverfahren und Anwendung PCB and integrated with additive and contacted by ultrasound copper elements and production methods and application |
| 05/29/2008 | DE102006053696A1 Anlage zur Herstellung einer Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen Plant for the production of a printed circuit board with additive and integrated and contacted by ultrasound copper elements |
| 05/29/2008 | DE102005053779B4 Lötmaske oder Lötrahmen zum Verlöten von Elektronikbauteilen in einer Lötanlage Solder mask or solder frames for soldering of electronic components in a soldering |
| 05/29/2008 | CA2670092A1 Method and apparatus for making partially coated products |
| 05/28/2008 | EP1926358A1 Molding circuit component and process for producing the same |
| 05/28/2008 | EP1926357A2 Functional device fabrication apparatus and functional device fabricated with the same |
| 05/28/2008 | EP1926356A1 Product having a solid body and one or more rooms inside |
| 05/28/2008 | EP1926355A2 Method for manufacturing an extendable circuit support and extendable circuit support |
| 05/28/2008 | EP1926354A1 Thermally conductive bus, in particular for a calculation unit with a microprocessor |
| 05/28/2008 | EP1925974A2 Fabrication of a wiring pattern and of an active matrix substrate |
| 05/28/2008 | EP1925428A1 Method and apparatus for making partially coated products |
| 05/28/2008 | EP1925192A1 Laminated substrate for mounting electronic parts |
| 05/28/2008 | EP1924891A1 Device for determining the relative position of two substantially flat elements |
| 05/28/2008 | EP1924416A2 Forming conductive strips with loop-engageable touch fasteners |
| 05/28/2008 | EP1924393A1 Reducing joint embrittlement in lead-free soldering processes |
| 05/28/2008 | EP1572377B1 Direct writing of metallic conductor patterns on insulating surfaces |
| 05/28/2008 | EP1547100B1 Electronic transformer/inductor devices and methods for making same |
| 05/28/2008 | CN201066961Y Cover film mounting of flexible circuit board and compound tool |
| 05/28/2008 | CN201066960Y Tool for dust removing of flexible line board |