Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2008
08/07/2008US20080188578 Precursors for Porous Low-Dielectric Constant Materials for Use in Electronic Devices
08/07/2008US20080188092 Electronic Device Array
08/07/2008US20080187745 Component and method for manufacturing printed circuit boards
08/07/2008US20080186691 Implantable medical device housing reinforcement
08/07/2008US20080186690 Electronics Package And Manufacturing Method Thereof
08/07/2008US20080186682 Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure
08/07/2008US20080186650 Decoupling Capacitor with Controlled Equivalent Series Resistance
08/07/2008US20080186045 Test mark structure, substrate sheet laminate, multilayered circuit substrate, method for inspecting lamination matching precision of multilayered circuit substrate, and method for designing substrate sheet laminate
08/07/2008US20080186041 Probe Card Manufacturing Method Including Sensing Probe And The Probe Card, Probe Card Inspection System
08/07/2008US20080185181 Alternating via fanout patterns
08/07/2008US20080185178 Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
08/07/2008US20080185177 Circuit board structure for electrical testing and fabrication method thereof
08/07/2008US20080185176 Wiring Board Member For Forming Multilayer Wiring Board, Method of Manufacturing the Same, and Multilayer Wiring Board
08/07/2008US20080185175 Multilayer wiring board and method of manufacturing the same
08/07/2008US20080185173 Environmental Protection Coating System and Method
08/07/2008US20080185172 Printed wiring board and method of manufacturing the same
08/07/2008US20080185171 Tape for semiconductor package and cutting method thereof
08/07/2008US20080185170 Methods and Media for Processing a Circuit Board
08/07/2008US20080185034 Fly's Eye Lens Short Focal Length Solar Concentrator
08/07/2008US20080184558 Method of manufacturing printed circuit board
08/07/2008US20080184557 Surface mounting device and method for fabricating a printed circuit board
08/07/2008US20080184556 Connection structure of circuit substrate
08/07/2008US20080184555 Method of manufacturing multilayer wiring board
08/07/2008US20080184554 Mechanical assembly and electrical interconnection of the functional components of an active implantable medical device
08/07/2008DE10392524B4 Vorrichtungen mit spannungsvariablem Material zur direkten Anwendung Devices with voltage variable material for direct application
08/07/2008DE10340705B4 Metallkernleiterplatte und Verfahren zum Herstellen einer solchen Metallkernleiterplatte Metal core printed circuit board and method of manufacturing such a metal core printed circuit board
08/07/2008DE102007005345A1 Verfahren zum Reflow-Löten A method for reflow soldering
08/07/2008DE102007002769A1 Anschlussklemmleiste Terminal strip
08/06/2008EP1954114A1 Use of an adhesive composition for die-attaching high power semiconductors
08/06/2008EP1954112A1 Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plate
08/06/2008EP1954111A1 Process for producing multilayer ceramic substrate
08/06/2008EP1954110A1 Soldering apparatus and soldering method
08/06/2008EP1954109A1 Formation of metallic portions on a substrate
08/06/2008EP1954108A1 Electronic board including a heating resistor
08/06/2008EP1953871A2 Arrangement of one circuit board onto a second circuit board
08/06/2008EP1953818A1 Electronic component mounting board and method for manufacturing such board
08/06/2008EP1953262A1 Catalyst treatment method, electroless plating method, and method for formation of circuit by using the electroless plating method
08/06/2008EP1952934A1 Soldering paste and solder joints
08/06/2008EP1952680A2 Electrical connector on a flexible carrier
08/06/2008EP1952434A1 Electronic component soldering structure and electronic component soldering method
08/06/2008EP1409192A4 Method of ablating an opening in a hard, non-metallic substrate
08/06/2008EP1329002B1 Surface mount connector lead
08/06/2008EP1286579B1 Multilayer printed wiring board
08/06/2008EP1086337B1 Control and signaling device or signaling device with a luminous element
08/06/2008CN201096240Y PCB equipment pressure gauge fixing structure
08/06/2008CN101238764A Mini wave soldering system and method for soldering wires and pin configurations
08/06/2008CN101238763A Method of forming conductive pattern and wiring board
08/06/2008CN101238762A Surface mounting component having magnetic layer thereon and method of forming same
08/06/2008CN101238761A Wiring board and process for producing the same
08/06/2008CN101238760A Insulating curable composition, cured product thereof, and printed wiring board using same
08/06/2008CN101238229A Method of depositing copper in lead-free solder, method of granulating (CuX)6Sn5 compound and method of separating the same, and method of recovering tin
08/06/2008CN101238192A Polishing composition and polishing method
08/06/2008CN101237766A Circuit board carrier
08/06/2008CN101237747A A production technology for double-side lamp belt circuit board
08/06/2008CN101237746A Electronic board incorporating a heater wire
08/06/2008CN101237745A Punch and its using method
08/06/2008CN101237744A Soft circuit board and its making method
08/06/2008CN101236950A Low-temperature common burning porcelain base plate and its making method and its semiconductor encapsulation device
08/06/2008CN101236943A Heat-radiation no-chip board film base plate with built-in chip and its making method
08/06/2008CN101236358A Light source for exposure and exposure device using the same
08/06/2008CN101234455A Soldering tin paste composition and soldering-tin precoating method
08/06/2008CN100409730C Forming machine drilling method having inspection guide and device thereof
08/06/2008CN100409728C Method for reinforcing the connection of flat cable member and method for manufacturing image display unit
08/06/2008CN100409497C Connector having a built-in electronic part
08/06/2008CN100409435C Electric circuit elements, electric circuit assembly, electric circuit built-in modules and manufacture thereof
08/06/2008CN100409434C Semiconductor modules and manufacture method thereof
08/06/2008CN100409429C Semiconductor packaging element and method for packaging semiconductor
08/06/2008CN100409423C Method for interconnecting terminals and method for mounting semiconductor device
08/06/2008CN100409384C Electronic component-use substrate and electronic component
08/06/2008CN100409132C Method and device for treating objects by means of a liquid
08/06/2008CN100408251C Mixed alloy lead-free solder paste
08/05/2008US7409665 Method for checking return path of printed and CAD apparatus for designing patterns of printed board
08/05/2008US7408785 Structure for mounting electronic component on wiring board
08/05/2008US7408694 Rearview mirror constructed for efficient assembly
08/05/2008US7408611 Electronic apparatus with a wiring terminal
08/05/2008US7408264 SMT passive device noflow underfill methodology and structure
08/05/2008US7408258 Interconnection circuit and electronic module utilizing same
08/05/2008US7408120 Printed circuit board having axially parallel via holes
08/05/2008US7408015 Reacting functionalized trialkoxysilane with polyepoxide or diamine to yield silane adduct
08/05/2008US7407836 High-voltage module and method for producing same
08/05/2008US7407738 Applying alternating material layers on a ridge and then removing some of the alternating layers to expose edges; exposed edges can be of nearly arbitrary length and curvature; edges can be used to fabricate an array of nano-scale-width curved wires
08/05/2008US7407712 Superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use; printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board
08/05/2008US7407122 Method of processing multicomponent, composite and combined materials and use of so separated components
08/05/2008US7407081 Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
08/05/2008US7406762 Method of fabricating an electrical terminal connector
08/05/2008US7406761 Method of manufacturing vibrating micromechanical structures
07/2008
07/31/2008WO2008090993A1 Coupled circuit and its manufacturing method
07/31/2008WO2008090965A1 Lead terminal bonding method and printed circuit board
07/31/2008WO2008090835A1 Process for production of multilayer printed wiring boards
07/31/2008WO2008090803A1 Micro ball feeding method
07/31/2008WO2008090654A1 Two-layer flexible substrate, method for manufacturing the two-layer flexible substrate, and flexible printed wiring board manufactured from the two-layer flexible substrate
07/31/2008WO2008090653A1 Imaging apparatus, method for assembling imaging apparatus and portable terminal
07/31/2008WO2008090614A1 Prepreg, printed wiring board, multilayer circuit board and process for manufacturing printed wiring board
07/31/2008WO2008089743A1 Method and device for contacting, positioning and impinging a solder ball formation with laser energy
07/31/2008WO2007078893A3 Embedded waveguide printed circuit board structure
07/31/2008US20080182025 Circuit board and manufacturing method of the same
07/31/2008US20080180928 Printed circuit board and manufacturing method thereof
07/31/2008US20080180927 Compliant Penetrating Packaging Interconnect
07/31/2008US20080180900 Electronic Component for an Electronic Carrier Substrate
07/31/2008US20080180121 Probe card assembly and kit