| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/19/2008 | US7412923 Stencil device for accurately applying solder paste to a printed circuit board |
| 08/19/2008 | CA2343173C Method for producing multi-layer circuits |
| 08/14/2008 | WO2008098060A2 Enhanced localized distributive capacitance for circuit boards |
| 08/14/2008 | WO2008097714A1 Dynamic pad size to reduce solder fatigue |
| 08/14/2008 | WO2008097574A2 Method for designing a leadless chip carrier |
| 08/14/2008 | WO2008097218A1 Heat spreader plating methods and devices |
| 08/14/2008 | WO2008096633A1 Mounting board and electronic device |
| 08/14/2008 | WO2008096197A1 Electronics package and manufacturing method thereof |
| 08/14/2008 | WO2008095755A1 Connection, method and device for the uniform coupling-in of laser beams during laser welding and laser soldering, in particular on highly reflective materials |
| 08/14/2008 | WO2008095405A1 Microelectronic element and method of manufacturing the same |
| 08/14/2008 | WO2008095338A1 A mutual connection structure between multi-layer boards and manufacturing method thereof |
| 08/14/2008 | WO2008095337A1 A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof |
| 08/14/2008 | WO2008063761A3 Method of packaging a device using a dielectric layer |
| 08/14/2008 | WO2008058258A8 Use of breakouts in printed circuit board designs |
| 08/14/2008 | WO2008035961A3 Device for electrochemically depositing a material on a plateshaped substrate |
| 08/14/2008 | WO2008029376A3 Deposition of conductive polymer and metallization of non-conductive substrates |
| 08/14/2008 | US20080195817 SD Flash Memory Card Manufacturing Using Rigid-Flex PCB |
| 08/14/2008 | US20080194063 Oxidation of copper or chromium-nickel-iron alloy metal article; reduction in hydrogen; producing macroscopically smooth surface portions and a plurality of multiply curved nanopores; coating; semiconductors |
| 08/14/2008 | US20080193747 Composite Films Suitable For Use In Opto-Electronic And Electronic Devices |
| 08/14/2008 | US20080193641 Method For Applying A Material Onto A Substrate Using A Droplet Printing Technique |
| 08/14/2008 | US20080192453 Multilayer interconnection substrate and manufacturing method therefor |
| 08/14/2008 | US20080192450 Electronics Module and Method for Manufacturing the Same |
| 08/14/2008 | US20080192447 Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module |
| 08/14/2008 | US20080192443 Electronic Component Module and Method for Manufacturing the Same |
| 08/14/2008 | US20080192074 Method and Device for the Production of a Three-Dimensional Multi-Material Component by Means of Ink-Jet-Type Printing |
| 08/14/2008 | US20080191354 Circuitized substrate with p-aramid dielectric layers and method of making same |
| 08/14/2008 | US20080191353 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same |
| 08/14/2008 | US20080190658 Multilayer printed wiring board |
| 08/14/2008 | US20080190657 Circuit Board |
| 08/14/2008 | US20080190656 Trimming Of Embedded Passive Components Using Pulsed Heating |
| 08/14/2008 | US20080190655 Component With Buried Ductile Conductive Bumps And Method Of Electrical Connection Between Said Component And A Component Equipped With Hard Conductive Points |
| 08/14/2008 | US20080190654 Printed Wiring Board |
| 08/14/2008 | US20080189943 Multilayered printed circuit board and manufacturing method thereof |
| 08/14/2008 | US20080189941 Method of Manufacture of Electronic or Functional Devices |
| 08/14/2008 | DE102007004483A1 Steering column module for vehicle, has module housing, electrical conductor plate and functional unit that has another electrical conductor plate |
| 08/14/2008 | DE102005061989B4 Haltevorrichtung für eine Schablone Holding device for a stencil |
| 08/13/2008 | EP1956878A2 Method of manufacturing multilayer wiring board |
| 08/13/2008 | EP1956877A2 Multilayer wiring board and method of manuftacturing the same |
| 08/13/2008 | EP1956876A1 Ceramic substrate, electronic device, and process for producing ceramic substrate |
| 08/13/2008 | EP1956875A2 Wired circuit board and method for producing the same |
| 08/13/2008 | EP1956874A1 Wiring system with integrated electronics |
| 08/13/2008 | EP1956873A2 Electronic device and method of manufacturing the same |
| 08/13/2008 | EP1956872A2 Environmental protection coating system and method |
| 08/13/2008 | EP1956616A1 Methods of making high capacitance density embedded ceramic capacitors |
| 08/13/2008 | EP1956114A1 A layer assembly, a method of forming said layer assembly and a circuit carrier comprising said layer assembly |
| 08/13/2008 | EP1955863A1 Printing mask and solar cell, and flat panel display ad chip capacitor |
| 08/13/2008 | EP1606431B1 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 08/13/2008 | EP1534788B1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 08/13/2008 | EP1454508B1 Flexible electric circuit for heating comprising a metallised fabric |
| 08/13/2008 | EP1145610B1 Electronic control device |
| 08/13/2008 | EP1009204B1 Multilayer printed wiring board and method for manufacturing the same |
| 08/13/2008 | CN101243735A Method of manufacturing pattern-forming metal structures on a carrier substrate |
| 08/13/2008 | CN101243734A Printed wiring board manufacturing process |
| 08/13/2008 | CN101243361A Work transfer apparatus, image forming apparatus provided with such work transfer apparatus, and work transfer method |
| 08/13/2008 | CN101243210A Tin electrodeposits having properties or characteristics that minimize tin whisker growth |
| 08/13/2008 | CN101243205A Method for electrically conductive circuit formation |
| 08/13/2008 | CN101242714A Method of manufacturing multilayer wiring board |
| 08/13/2008 | CN101242713A Multilayer wiring board and method of manufacturing the same |
| 08/13/2008 | CN101242712A Felting thin film for circuit substrate, covering layer and circuit substrate using the same |
| 08/13/2008 | CN101242711A Test mark structure, substrate sheet laminate and design method thereof, multilayered circuit substrate, and method for inspecting lamination matching precision of the multilayered circuit substrate |
| 08/13/2008 | CN101242710A Multilayer circuit board and its making method |
| 08/13/2008 | CN101241903A Wiring board, semiconductor device having the wiring board, and manufacturing and packaging method thereof |
| 08/13/2008 | CN101241801A A design method for digital controllable variable capacitor |
| 08/13/2008 | CN101239508A Backing board for laminating covered copper plate |
| 08/13/2008 | CN100411500C Multichip module including substrate with an array of interconnect structures |
| 08/13/2008 | CN100411253C Connector and its manufacturing method |
| 08/13/2008 | CN100411252C Ground terminal, printed board mounted with a ground terminal, and mounting method thereof |
| 08/13/2008 | CN100411204C Light-emitting diode thermal management system |
| 08/13/2008 | CN100411187C Distributing substrate, electrooptical apparatus and manufacturing method thereof |
| 08/13/2008 | CN100411163C Semiconductor device of chip on film |
| 08/13/2008 | CN100411155C Laminated electronic part and its manufacturing method |
| 08/13/2008 | CN100411154C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 08/13/2008 | CN100410785C Matrix display device and method for manufacturing the same, and heat pressing connection head |
| 08/13/2008 | CN100410066C Apparatus for pressing component |
| 08/12/2008 | US7412683 Printed wiring board design method, program therefor, recording medium storing the program recorded therein, printed wiring board design device using them and CAD system |
| 08/12/2008 | US7411763 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| 08/12/2008 | US7411477 Inductor |
| 08/12/2008 | US7411304 Semiconductor interconnect having conductive spring contacts |
| 08/12/2008 | US7411295 Circuit board, device mounting structure, device mounting method, and electronic apparatus |
| 08/12/2008 | US7411294 Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
| 08/12/2008 | US7410905 Method for fabricating thin film pattern, device and fabricating method therefor, method for fabricating liquid crystal display, liquid crystal display, method for fabricating active matrix substrate, electro-optical apparatus, and electrical apparatus |
| 08/12/2008 | US7410900 Metallisation |
| 08/12/2008 | US7410833 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 08/12/2008 | US7410826 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device |
| 08/12/2008 | US7410698 Conductive core materials form projections on the outer surface of a base particle, which is covered by a film of a different a conductive material; enhanced conduction reliability; low connection resistance |
| 08/12/2008 | US7410673 Smooth board and process for preparing a smooth board |
| 08/12/2008 | US7410590 Transferable micro spring structure |
| 08/12/2008 | US7410250 Inkjet nozzle with supply duct dimensioned for viscous damping |
| 08/12/2008 | US7410243 Inkjet nozzle with resiliently biased ejection actuator |
| 08/12/2008 | US7410093 Solder wave process for solder shunts for printed circuit board |
| 08/12/2008 | US7409761 Electronic component mounting apparatus and method of mounting electronic components |
| 08/07/2008 | WO2008093643A1 Photosensitive element |
| 08/07/2008 | WO2008093579A1 Multilayer body, method for producing substrate, substrate and semiconductor device |
| 08/07/2008 | WO2008093373A1 Production process of printed circuits on which electronic components without leading wire are soldered. |
| 08/07/2008 | WO2008092708A1 A method of soldering a circuit carrier, a layer assembly, a method of forming said layer assembly and a circuit carrier comprising said layer assembly |
| 08/07/2008 | WO2008092520A1 Contact system |
| 08/07/2008 | WO2008092414A1 Method for the production of a pluggable connection contact on a semiconductor module and semiconductor module produced by this method |
| 08/07/2008 | WO2008092309A1 Process for electroplating a printed circuit board with through-holes uncoverd by mask |
| 08/07/2008 | WO2008057598A3 Alternating via fanout patterns |
| 08/07/2008 | WO2007118875A3 Electroplating device and method |