| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/26/2008 | US7417596 Ground connection of a printed circuit board placed in a wristwatch type electronic device |
| 08/26/2008 | US7417523 Ultra-thin flexible inductor |
| 08/26/2008 | US7417322 Multi-chip module with embedded package and method for manufacturing the same |
| 08/26/2008 | US7417318 Thick film circuit board, method of producing the same and integrated circuit device |
| 08/26/2008 | US7417316 Wired circuit forming board, wired circuit board, and thin metal layer forming method |
| 08/26/2008 | US7417197 Direct contact power transfer pad and method of making same |
| 08/26/2008 | US7417195 Circuit board and circuit board connection structure |
| 08/26/2008 | US7416996 Method of making circuitized substrate |
| 08/26/2008 | US7416972 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion |
| 08/26/2008 | US7416812 Battery provided with terminals |
| 08/26/2008 | US7416763 Process for forming metal layers |
| 08/26/2008 | US7416759 Wiring pattern formation method, wiring pattern, and electronic device |
| 08/26/2008 | US7416687 a mixture of phenolic resins, melamine resins, electroconductive powders, solvents and bump forming aids comprising acyclic ethers, used for the formation of electrode bumps for connectiing multilayer printed circuits |
| 08/26/2008 | US7416611 Process and apparatus for treating a workpiece with gases |
| 08/26/2008 | US7416280 Inkjet printhead with hollow drop ejection chamber formed partly of actuator material |
| 08/26/2008 | US7416132 Memory card with and without enclosure |
| 08/26/2008 | US7416103 Flow soldering apparatus |
| 08/26/2008 | US7415761 Method of manufacturing multilayered circuit board |
| 08/26/2008 | US7415759 Method and apparatus for mounting semiconductor chips |
| 08/21/2008 | WO2008099940A1 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
| 08/21/2008 | WO2008099655A1 Photosensitive resin composition and layered product |
| 08/21/2008 | WO2008099635A1 Optical element, electronic module, and method for production of electronic module |
| 08/21/2008 | WO2008099596A1 Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film |
| 08/21/2008 | WO2008099594A1 Multilayer ceramic substrate and process for producing the same |
| 08/21/2008 | WO2008099527A1 Flexible circuit board and process for producing the same |
| 08/21/2008 | WO2008098861A1 Method and automatic mounting machine for mounting semiconductor chips on a substrate in the form of a flip-chip |
| 08/21/2008 | WO2008098828A1 Method and device for inserting a workpiece into a bore of a support of the workpiece |
| 08/21/2008 | WO2008098272A1 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board |
| 08/21/2008 | WO2008098271A1 Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor |
| 08/21/2008 | WO2008098270A1 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board |
| 08/21/2008 | WO2008098269A1 Method for removing a part of a planar material layer and multilayer structure |
| 08/21/2008 | WO2008081430A3 Stencil printers and the like, optical systems therefor, and methods of printing and inspection |
| 08/21/2008 | WO2008070532A3 Method for printing electrically conductive circuits |
| 08/21/2008 | WO2007017404A3 Arrangement for hermetically sealing components, and method for the production thereof |
| 08/21/2008 | US20080199988 Conductive pattern formation method |
| 08/21/2008 | US20080199665 Multilayer silver halide emulsion elements; transparent flexible support between photosensitive layers; imagewise exposure; conductive track patterns; printed circuits; display devices |
| 08/21/2008 | US20080199597 Method For Producing A Three-Dimensional Circuit |
| 08/21/2008 | US20080198566 Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board |
| 08/21/2008 | US20080197960 Coil unit, method of manufacturing the same, and electronic instrument |
| 08/21/2008 | US20080197866 Method of Manufacturing Needle for Probe Card Using Fine Processing Technology, Needle Manufactured by the Method, and Probe Card Comprising the Needle |
| 08/21/2008 | US20080197700 Method For the Attachment of Ribbon Cable Systems |
| 08/21/2008 | US20080197492 Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member |
| 08/21/2008 | US20080197471 Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method |
| 08/21/2008 | US20080196933 Printed circuit board substrate and method for constructing same |
| 08/21/2008 | US20080196932 Multilayer substrate including components therein |
| 08/21/2008 | US20080196931 Printed circuit board having embedded components and method for manufacturing thereof |
| 08/21/2008 | US20080196930 Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure |
| 08/21/2008 | US20080196928 Method For the Production of a Functional Constructional Unit, and Functional Constructional Unit |
| 08/21/2008 | US20080196507 Pressure sensor incorporating a compliant pin |
| 08/21/2008 | US20080196245 Method for mounting electronic components |
| 08/21/2008 | DE4447897B4 Verfahren zur Herstellung von Leiterplatten Process for the preparation of printed circuit boards |
| 08/21/2008 | DE4404986B4 Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung Means for contacting an electrical conductor and methods of making such a device |
| 08/21/2008 | DE19824225B4 Verfahren zur Herstellung einer gedruckten Schaltungsplatte A process for producing a printed circuit board |
| 08/21/2008 | DE112006002571T5 Kupferplattierter Schichtstoff, gedruckte Leiterplatte, mehrschichtige gedruckte Leiterplatte und Verfahren zum Herstellen derselben Copper-clad laminates, printed circuit board, multilayer printed circuit board and method of manufacturing the same |
| 08/21/2008 | DE102007008109A1 Printed circuit board arrangement has multiple printed circuit boards for opto-electronic components, where two neighbouring printed circuit boards are connected by a connecting body |
| 08/21/2008 | DE102004057505B4 Elektrisches Funktionsbauteil Electrical functional component |
| 08/21/2008 | DE102004046251B4 Verfahren zur biegenden Herstellung eines Geräts der Leistungselektronik A process for producing a bending of the power electronics unit |
| 08/21/2008 | DE102004006414B4 Verfahren zum partiellen Lösen einer leitfähigen Schicht A method for partial release of a conductive layer |
| 08/20/2008 | EP1958705A2 Viscous material noncontact jetting system |
| 08/20/2008 | EP1554915A4 Land grid array fabrication using elastomer core and conducting metal shell or mesh |
| 08/20/2008 | EP1314342B1 Method, apparatus and use of applying viscous medium on a substrate |
| 08/20/2008 | EP1229772B1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 08/20/2008 | EP1101228B1 Polymer thick-film resistor printed on planar circuit board surface |
| 08/20/2008 | CN201102088Y Machining tool bit for circuit board wire lead slot |
| 08/20/2008 | CN101248709A Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
| 08/20/2008 | CN101248708A Dielectric substrate with holes and method of manufacture |
| 08/20/2008 | CN101248521A Technique for efficiently patterning an underbump metallization layer using a dry etch process |
| 08/20/2008 | CN101247711A Recirculating loop manufacturing method of high-efficiency heat conduction substrate and high-efficiency heat conduction substrate recirculating loop component |
| 08/20/2008 | CN101247702A Multilayer printed circuit board |
| 08/20/2008 | CN101247701A Partial temperature controlling tools used for reflow process of circuit board |
| 08/20/2008 | CN101247700A Stirring type wet process machine and stirring type wet process |
| 08/20/2008 | CN101246990A Antenna production method and antenna structure |
| 08/20/2008 | CN101246989A Antenna production method and antenna structure |
| 08/20/2008 | CN101246871A Multi-layer ceramic substrate and its preparing process |
| 08/20/2008 | CN101246826A Method for mounting electronic components |
| 08/20/2008 | CN101246406A Electronic equipment |
| 08/20/2008 | CN101246268A Manufacture method for mount body, mount body and substrate |
| 08/20/2008 | CN101246175A Silk screen printing method for producing blood sugar test paper |
| 08/20/2008 | CN101244650A Method and apparatus for forming patterns, and liquid dryer |
| 08/20/2008 | CN100413386C Method of mounting wafer on printed wiring substrate |
| 08/20/2008 | CN100413385C Film bearing band for arranging electronic parts and printing screen mask for coating welding retardant |
| 08/20/2008 | CN100413384C Multi-layer printed circuit board and fabricating method thereof |
| 08/20/2008 | CN100413383C Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device |
| 08/20/2008 | CN100413070C Module with a built-in component, electronic device with the same, and manufacturing method of module with a built-in component |
| 08/20/2008 | CN100413056C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 08/20/2008 | CN100413029C Method of manufacturing circuit device |
| 08/20/2008 | CN100412995C Constrained sintering method for asymmetrical configurational dielectric layer |
| 08/20/2008 | CN100412873C System and method for modifying electronic design data |
| 08/20/2008 | CN100412183C Cleaning agent for removing solder flux and method for cleaning solder flux |
| 08/19/2008 | US7414307 Electronic device and pressure sensor |
| 08/19/2008 | US7414301 Printed circuit board with soldering lands |
| 08/19/2008 | US7413975 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 08/19/2008 | US7413965 Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape |
| 08/19/2008 | US7413930 Lead frame and method of manufacturing the lead frame |
| 08/19/2008 | US7413771 Coating solder metal particles with a charge director medium |
| 08/19/2008 | US7413765 Film forming method for manufacturing planar periodic structure having predetermined periodicity |
| 08/19/2008 | US7413686 Conductive particle and adhesive agent |
| 08/19/2008 | US7413670 Method for forming wiring on a substrate |
| 08/19/2008 | US7413452 Interconnector, method for manufacturing a plasma display device using the same, and a plasma display device with the same |
| 08/19/2008 | US7412983 Pattern forming method and apparatus, and device fabrication method and device |