| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/02/2008 | US7420127 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| 09/02/2008 | US7419408 Stamped grid comprising a fastening element |
| 09/02/2008 | US7419387 Electric connection member utilizing ansiotropically conductive sheets |
| 09/02/2008 | US7419384 Plug for connection strips and method for the production thereof |
| 09/02/2008 | US7418780 Method for forming stacked via-holes in a multilayer printed circuit board |
| 09/02/2008 | US7418779 Method for balancing power plane pin currents in a printed wiring board using collinear slots |
| 09/02/2008 | CA2470898C A method and related apparatus for cutting a product from a sheet material |
| 08/28/2008 | WO2008103794A2 Conductive pattern formation method |
| 08/28/2008 | WO2008102795A1 Flexible multilayer wiring board |
| 08/28/2008 | WO2008102717A1 Multilayer printed-circuit board |
| 08/28/2008 | WO2008102692A1 Printed wiring board, method for manufacturing printed wiring board, and electronic device |
| 08/28/2008 | WO2008102476A1 Electronic circuit device, process for manufacturing the same and display apparatus |
| 08/28/2008 | WO2008102113A2 Printed circuit boards |
| 08/28/2008 | WO2008101884A2 Method for contacting electrical components |
| 08/28/2008 | WO2008076955A3 Microball mounting method and mounting device |
| 08/28/2008 | WO2008071576A3 Circuit arrangement and method for producing a circuit arrangement |
| 08/28/2008 | WO2008060256A3 Three-dimensional printed circuit board and manufacturing method thereof |
| 08/28/2008 | WO2007061448A3 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
| 08/28/2008 | US20080207035 Contacting Device for a Flexible Ribbon Conductor |
| 08/28/2008 | US20080206979 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 08/28/2008 | US20080206929 Printing device, production unit, and production method of electronic parts |
| 08/28/2008 | US20080206928 Soldering method and method of manufacturing semiconductor device including soldering method |
| 08/28/2008 | US20080206926 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 08/28/2008 | US20080206909 Composition of carbon nitride, thin film transistor with the composition of carbon nitride, display device with the thin film transistor, and manufacturing method thereof |
| 08/28/2008 | US20080206689 Method of Forming Flexible Electronic Circuits |
| 08/28/2008 | US20080205025 Package Having a Plurality of Mounting Orientations |
| 08/28/2008 | US20080205023 Electronic components on trenched substrates and method of forming same |
| 08/28/2008 | US20080205013 Solder layer and device bonding substrate using the same and method for manufacturing such a substrate |
| 08/28/2008 | US20080205012 Chip card module and method of producing a chip card module |
| 08/28/2008 | US20080205009 Electronic apparatus and mounting method |
| 08/28/2008 | US20080204993 Computing device |
| 08/28/2008 | US20080204519 Inkjet Printhead With Laterally Reciprocating Paddle |
| 08/28/2008 | US20080204518 Inkjet Printer With Low Nozzle To Chamber Cross-Section Ratio |
| 08/28/2008 | US20080203585 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 08/28/2008 | US20080202937 compression or vacuum molding polymer sheets into three-dimensional shapes, then etching and catalyzing surface with a catalyzing solution to enable the surface to be plated, performing electroless deposition of a first metallic layer and electrodepositing a second metal layer on the first layer |
| 08/28/2008 | US20080202807 Shielded flexible circuits and methods for manufacturing same |
| 08/28/2008 | US20080202803 Wiring structure, forming method of the same and printed wiring board |
| 08/28/2008 | US20080202802 Printed circuit board module having two printed circuit boards for mounting inline package elements and adhibit elements respectively |
| 08/28/2008 | US20080202801 Circuit Board Structure and Method for Manufacturing a Circuit Board Structure |
| 08/28/2008 | US20080202799 Embedding an electronic component between surfaces of a printed circuit board |
| 08/28/2008 | US20080202798 Transparent substrate with thin film and method for manufacturing transparent substrate with circuit pattern wherein such transparent substrate with thin film is used |
| 08/28/2008 | US20080202795 Method of Improving the Strength of a Spot-Welded Joint Between Fine Enameled Wire and Circuit Board |
| 08/28/2008 | US20080202792 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 08/28/2008 | US20080202587 System and method to supply chemical during semiconductor device fabrication |
| 08/28/2008 | US20080201945 Printed circuit board manufacturing method, printed circuit board, and electronic apparatus |
| 08/28/2008 | US20080201944 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 08/28/2008 | US20080201943 Electronic device substrate and its fabrication method, and electronic device and its fabrication method |
| 08/28/2008 | US20080201879 Foot cleaning device |
| 08/28/2008 | DE202006020456U1 Vorrichtung zur elektrisch leitenden Verbindung A device for electrically conductive connection |
| 08/28/2008 | DE102007029524B3 Fastening element for fastening of construction unit to printed board, has cylinder wall, where exterior surface of cylinder wall is provided with knurling, and internal thread, where cylinder wall has slot |
| 08/28/2008 | DE102007010731A1 Method for arranging electronic chip in circuit board, involves forming of cavity in circuit board and base of cavity is structured for forming connection point |
| 08/28/2008 | DE102007009371A1 Semiconductor chip mounting method, involves partially or completely soaking capillary meshing on substrate e.g. printed circuit board, using thin liquid adhesive, and fitting chips to capillary meshing |
| 08/28/2008 | DE102007008549A1 Elektrisches Gerät mit einer eine Anschlussstelle für einen elektrischen Anschlussleiter aufweisenden Leiterbahn und Verfahren zum Verbinden eines elektrischen Anschlussleiters mit einem solchen elektrischen Gerät Electrical device with a connection point for a conductor having an electrical connection conductor and method for connecting an electrical conductor to a connector such an electrical device |
| 08/28/2008 | DE102004038970B4 HF-Zwischenverbindung für Mehrfach-Verdrahtungsebenen mit impedanzdefinierten Leiterbahnstrukturen RF interconnect for multiple wiring layers with defined impedance interconnect structures |
| 08/28/2008 | CA2678309A1 Printed circuit boards |
| 08/27/2008 | EP1962569A1 Multilayer printed wiring plate, and method for fabricating the same |
| 08/27/2008 | EP1962568A2 Structure of light emitting diode and method to assemble thereof |
| 08/27/2008 | EP1962567A2 Press-fit pin and board structure |
| 08/27/2008 | EP1962566A2 Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices |
| 08/27/2008 | EP1962342A1 Substrate with built-in chip and method for manufacturing substrate with built-in chip |
| 08/27/2008 | EP1960119A1 Device, system and method for treating the surfaces of substrates |
| 08/27/2008 | EP1737600B1 Method and apparatus for transferring conductive pieces during semiconductor device fabrication |
| 08/27/2008 | EP1709215A4 Chromium-free antitarnish adhesion promoting treatment composition |
| 08/27/2008 | EP1701984A4 Uv led control loop and controller for uv curing |
| 08/27/2008 | EP1011298B1 Substrate for formation of special pattern, and method of manufacture of substrate |
| 08/27/2008 | CN101253825A Sheet-like composite electronic component and method for manufacturing same |
| 08/27/2008 | CN101253820A Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing |
| 08/27/2008 | CN101253258A Aqueous solution and method for removing ionic contaminants from the surface of a workpiece |
| 08/27/2008 | CN101253045A Method of laminating adherend |
| 08/27/2008 | CN101252817A Design producing method of multi-layer printed circuit board |
| 08/27/2008 | CN101252816A Circuit board dip welder control device with circuit board capable of choosing multiple temperature display |
| 08/27/2008 | CN101252815A Solder tray local tin plating method on circuit board |
| 08/27/2008 | CN101252814A Wiring substrate |
| 08/27/2008 | CN101252813A PTC thermal sensitive ceramic heating element |
| 08/27/2008 | CN101252812A Method for making PCB panel |
| 08/27/2008 | CN101252811A Method and device for inspecting printed circuit board wiring inverse flow path |
| 08/27/2008 | CN101252810A General-purpose plug socket tools |
| 08/27/2008 | CN101252809A Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices |
| 08/27/2008 | CN101252808A Soldering circuit plate and soldering method thereof |
| 08/27/2008 | CN101252807A Circuit board and electronic equipment having the same, method of manufacturing same |
| 08/27/2008 | CN101252094A Production method of electronic apparatus, production method of electronic equipment in which electronic apparatus is packaged, and production method of article in which electronic apparatus is mounte |
| 08/27/2008 | CN101252091A Forming method of sliver hole on substrate and substrate structure |
| 08/27/2008 | CN101252090A Surface treating process of circuit board |
| 08/27/2008 | CN101250386A Adhesive for electrode connection and connecting method using it |
| 08/27/2008 | CN101250318A Epoxy radical material for printing circuit copper clad laminate and preparation method thereof |
| 08/27/2008 | CN100415069C Solder ball supplying method and supplying device |
| 08/27/2008 | CN100415068C Method for forming a circuit, circuit board, apparatus for forming circuit board and ink set |
| 08/27/2008 | CN100415067C External connection terminal fixing structure and mobile terminal device |
| 08/27/2008 | CN100414689C Electronic part manufacturing method and electronic part |
| 08/27/2008 | CN100414677C Method of using pre-applied underfill encapsulant |
| 08/27/2008 | CN100414676C Stencil and method for depositing material onto a substrate |
| 08/27/2008 | CN100414649C Connecting structure, liquid crystal device, electronic equipment, and anisotropic conductive adhesive agent and a manufacturing method thereof |
| 08/27/2008 | CN100413890C Resin particle, conductive particle and anisotropic conductive adhesive containing the same |
| 08/27/2008 | CN100413684C Circuit protective composites |
| 08/27/2008 | CN100413675C Method for producing laminated plate |
| 08/27/2008 | CN100413598C Electronic device for direct slurry atomization and deposition |
| 08/26/2008 | US7418603 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program |
| 08/26/2008 | US7417871 Memory module |
| 08/26/2008 | US7417867 Printed wiring board and display apparatus |
| 08/26/2008 | US7417827 Head/slider supporting structure having lead wire inclined relative to slider pad |