| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/09/2008 | US7422772 Applicator with nozzle; supplying fluid; needle for termination fluid flow; initiating a flow of pressurized fluid along the fluid path and through spaces between splines in the fluid path upstream of a distal end of the cap; discharging the pressurized fluid |
| 09/09/2008 | US7422141 Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale |
| 09/09/2008 | US7421781 Method of forming a module component having a plurality of penetration holes |
| 09/09/2008 | US7421780 Methods for fabricating thermal management systems for micro-components |
| 09/09/2008 | US7421779 Multilayer board manufacturing method |
| 09/09/2008 | US7421778 Method of making an electronic assembly |
| 09/09/2008 | US7421777 Method of manufacturing multilayer wiring substrate using temporary metal support layer |
| 09/09/2008 | US7421767 Method for manufacturing a piezoelectric vibration device |
| 09/09/2008 | CA2367318C Filling device and method for filling balls in the apertures of a ball-receiving element |
| 09/04/2008 | WO2008105744A2 Method and apparatus for assembling surface mount devices |
| 09/04/2008 | WO2008105561A1 Circuit board and method for manufacturing the same |
| 09/04/2008 | WO2008105496A1 Interposer with capacitor mounted thereon and method for manufacturing the interposer |
| 09/04/2008 | WO2008105481A1 Process for producing circuit board |
| 09/04/2008 | WO2008105480A1 Film for metal film transfer, method for transferring metal film, and method for manufacturing circuit board |
| 09/04/2008 | WO2008105448A1 Confirmation screen display method for external appearance inspection device |
| 09/04/2008 | WO2008105443A1 Solder transfer sheet and solder transfer method |
| 09/04/2008 | WO2008105397A1 Circuit board for soldering having adhesion property and wetting property |
| 09/04/2008 | WO2008105200A1 Flame retardant adhesive composition, flexible copper-clad laminates and cover lay films |
| 09/04/2008 | WO2008105149A1 Circuit module |
| 09/04/2008 | WO2008104950A1 Printed circuit board with a blind hole for mounting a component |
| 09/04/2008 | WO2008055751A3 Electronic housing using novel flexible printed circuit board technology |
| 09/04/2008 | US20080213613 Solder Precoating Method and Workpiece For Electronic Equipment |
| 09/04/2008 | US20080213019 Process for Producing Rfid Labels |
| 09/04/2008 | US20080212304 Wave Absorber and Manufacturing Method of Wave Absorber |
| 09/04/2008 | US20080212301 Electronic part mounting board and method of mounting the same |
| 09/04/2008 | US20080212300 Circuit board and method of manufacturing same |
| 09/04/2008 | US20080212297 Flash Memory Device Assembly Using Adhesive |
| 09/04/2008 | US20080212288 Electronic component package and manufacturing method thereof |
| 09/04/2008 | US20080212287 Semiconductor package structure with buried electronic device and manufacturing method therof |
| 09/04/2008 | US20080212255 Electrostatic chuck and method for manufacturing same |
| 09/04/2008 | US20080211629 Polymeric Film Substrate for Use in Radio-Frequency Responsive |
| 09/04/2008 | US20080211077 Low profile chip scale stacking system and method |
| 09/04/2008 | US20080210604 Article having a circuit soldered with parts and method for recycling wastes of the same |
| 09/04/2008 | US20080210563 enhanced layer to layer bonding; electroplating |
| 09/04/2008 | US20080210462 Method for manufacturing circuit modules and circuit module |
| 09/04/2008 | US20080210458 Flexible substrate, multilayer flexible substrate and process for producing the same |
| 09/04/2008 | US20080210457 Tape carrier for semiconductor device and method for making same |
| 09/04/2008 | US20080210456 Method For Producing Electrically Conductive Patterns on a Non-Developable Surface of an Insulating Substrate, and Resulting Device |
| 09/04/2008 | US20080209722 Method for forming via hole having fine hole land |
| 09/04/2008 | US20080209721 Multipoint nanoprobe and method for fabrication |
| 09/04/2008 | US20080209719 Method for making a probe card |
| 09/04/2008 | US20080209718 Method of manufacturing multi-layered printed circuit board |
| 09/04/2008 | US20080209717 Thermal bonding structure and manufacture process of flexible printed circuit board |
| 09/04/2008 | US20080209703 Piezoelectric vibrators, piezoelectric devices comprising same, and methods for producing same |
| 09/04/2008 | DE202008007337U1 Vorrichtung zur Trocknung, insbesondere zur vorherigen Reinigung, Spülung und anschließenden Trocknung, von insbesondere im wesentlichen flächigen Gegenständen An apparatus for drying, especially to previous cleaning, rinsing and subsequent drying, in particular of substantially flat articles |
| 09/04/2008 | DE19953841B4 Dualprozessor-Adapterkarte Dual processor adapter card |
| 09/04/2008 | DE10261410B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
| 09/04/2008 | DE102007060510A1 Leiterplatten-Herstellungsverfahren, Leiterplatte und elektronische Anordnung PCB manufacturing process, circuit board and electronic device |
| 09/04/2008 | DE102007010395A1 Method for production of electrical heater and temperature sensor, |
| 09/04/2008 | DE102006009812B4 Montageanordnung für mehrere Leistungshalbleiter und Schaltung mit einer solchen Montageanordnung A mounting assembly of several power semiconductor circuit and with such a mounting arrangement |
| 09/03/2008 | EP1965620A1 Method for manufacturing printed wiring board |
| 09/03/2008 | EP1965618A1 Composition for removing residue from wiring board and cleaning method |
| 09/03/2008 | EP1965617A2 Method for encapsulting multiple lead frames |
| 09/03/2008 | EP1965616A1 Glass substrate having circuit pattern and process for producing the same |
| 09/03/2008 | EP1965615A1 Module having built-in component and method for fabricating such module |
| 09/03/2008 | EP1965614A1 Circuit board connecting structure, circuit board connecting section, and electronic apparatus |
| 09/03/2008 | EP1964869A1 Thermosetting resin composition |
| 09/03/2008 | EP1704168A4 Uv for ink jet printer |
| 09/03/2008 | EP1698016B1 Triangular conforming transmission structure |
| 09/03/2008 | EP1588594A4 Circuit board standoff |
| 09/03/2008 | EP1521868B1 Device and method for monitoring an electrolytic process |
| 09/03/2008 | EP1009205B1 Single-sided circuit board and method for manufacturing the same |
| 09/03/2008 | CN201110927Y Tooth hole detecting probe structure |
| 09/03/2008 | CN101257994A Soldering tin alloy, electric substrate using the same and manufacturing method thereof |
| 09/03/2008 | CN101257982A Forming tools |
| 09/03/2008 | CN101257775A Method of manufacturing wiring substrate and method of manufacturing electronic component device |
| 09/03/2008 | CN101257774A Method for manufacturing multilayer printed wiring board |
| 09/03/2008 | CN101257773A Method of manufacturing multi-layered printed circuit board |
| 09/03/2008 | CN101257772A Printed circuit board manufacturing method, printed circuit board, and electronic apparatus |
| 09/03/2008 | CN101257771A Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same |
| 09/03/2008 | CN101257770A Manufacturing method for embedding heat radiating fin on printed circuit board |
| 09/03/2008 | CN101257769A Contraposition method for manufacturing printed circuit board |
| 09/03/2008 | CN101257767A Printed circuit board and manufacturing method thereof |
| 09/03/2008 | CN101257766A Printed circuit board and method of producing the same |
| 09/03/2008 | CN101257142A Annular satellite navigation aerial and manufacturing method thereof |
| 09/03/2008 | CN101257140A Method for manufacturing aerial module group through laser engraving |
| 09/03/2008 | CN101257004A Wiring structure, forming method of the same and printed wiring board |
| 09/03/2008 | CN101256990A Electronic apparatus and mounting method |
| 09/03/2008 | CN101256973A Layered microelectronic contact and method for fabricating same |
| 09/03/2008 | CN101256962A Electronic part and method for manufacturing the same |
| 09/03/2008 | CN101256633A Method of separating vertical and horizontal components of a raster image |
| 09/03/2008 | CN101254893A Method for making micromachine moving piece and metal intraconnection thereof |
| 09/03/2008 | CN100417316C Method and apparatus for applying a glue layer on flat components and mounting device for placing flat components |
| 09/03/2008 | CN100417313C Method for improving high quality ratio of circuit board process |
| 09/03/2008 | CN100417311C Pressure welding structure and manufacturing method of flexible printed circuit board |
| 09/03/2008 | CN100417310C Printed circuit board with radiating element, its manufacturing method and device containing it |
| 09/03/2008 | CN100416921C Adhesive film for circuit connection, and circuit connection structure |
| 09/03/2008 | CN100416814C Structure for mounting semiconductor and method of manufacturing mounting substrate used therein |
| 09/03/2008 | CN100416771C Combined wet etching method and system for stacked films |
| 09/03/2008 | CN100416760C Pattern forming method |
| 09/03/2008 | CN100416752C Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus |
| 09/03/2008 | CN100415634C Electronic device with covering layer in cavity, and manufacture method thereof |
| 09/03/2008 | CN100415518C Wiring pattern formation method |
| 09/03/2008 | CN100415517C Method for coating material, color filter substrate and method of manufacturing device |
| 09/02/2008 | US7420821 Electronic module and driving circuit board therefor |
| 09/02/2008 | US7420769 Data storage device enclosure with overmolded connector to provide conductive lead support |
| 09/02/2008 | US7420644 Liquid crystal display device and fabricating method thereof |
| 09/02/2008 | US7420266 Circuit device and manufacturing method thereof |
| 09/02/2008 | US7420131 Wiring substrate |
| 09/02/2008 | US7420129 Semiconductor package including a semiconductor device, and method of manufacturing the same |