| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/18/1992 | WO1992007058A1 Method and composition for cleaning articles |
| 04/18/1992 | CA2094153A1 Method and composition for cleaning articles |
| 04/18/1992 | CA2053521A1 Organic resin multi-layer wiring substrate and method of making the same |
| 04/17/1992 | CA2051842A1 Method for firing ceramic thick film circuits with photopolymerizable paste materials and products produced thereby |
| 04/16/1992 | WO1992006496A1 Multi-film hybrid circuit with power components |
| 04/16/1992 | WO1992006410A1 Improved ablation-transfer imaging/recording |
| 04/16/1992 | WO1992006402A1 A fine sphere, a spherical spacer for a liquid crystal display element and a liquid crystal display element using the same |
| 04/16/1992 | DE4130637A1 Mfg. connection element for power semiconductor module - esp. from one-side copper@ coated polyimide foil |
| 04/16/1992 | DE4032400A1 Patterned laminated plate mfr. - uses lengths of paper drawn off rolls to form the core to be fed to single level press |
| 04/15/1992 | EP0480754A2 Mounting device for mounting an electronic device on a substrate by the surface mounting technology |
| 04/15/1992 | EP0480703A2 Producing metal patterns on a substrate |
| 04/15/1992 | EP0480585A2 Device for conveying printed circuit board |
| 04/15/1992 | EP0480486A2 Thin film coating method |
| 04/15/1992 | EP0480365A2 Production of solder masked electric circuit boards |
| 04/15/1992 | EP0480194A2 High performance metal cone contact |
| 04/15/1992 | EP0480168A1 Apparatus to uniformly apply a force on a row of stacks in asintering oven |
| 04/15/1992 | EP0480154A2 Thermally stable photoimaging composition |
| 04/15/1992 | EP0480038A1 Ceramic circuit board |
| 04/15/1992 | EP0479986A1 A multi-layer printed circuit board and a method for assuring assembly in a selected order. |
| 04/14/1992 | US5105340 Circuit board |
| 04/14/1992 | US5105339 Arrangement for holding a printed circuit board fixed to a frame |
| 04/14/1992 | US5105261 Semiconductor device package having particular lead structure for mounting multiple circuit boards |
| 04/14/1992 | US5105215 Liquid crystal programmable photoresist exposure system |
| 04/14/1992 | US5105149 Apparatus for inspecting electronic devices mounted on a circuit board |
| 04/14/1992 | US5104944 Process for nucleophilic derivatization of materials having an imide group conjugated to an aromatic moiety |
| 04/14/1992 | US5104827 Method of making a plastic-packaged semiconductor device having lead support and alignment structure |
| 04/14/1992 | US5104734 Applying metal as metal benzotriazole; heating |
| 04/14/1992 | US5104707 Easy peeling of carrier film |
| 04/14/1992 | US5104689 Method and apparatus for automated solder deposition at multiple sites |
| 04/14/1992 | US5104688 Pretreatment composition and process for tin-lead immersion plating |
| 04/14/1992 | US5104687 Reduced cycle process for the manufacture of printed circuits, and a composition for carrying out said process |
| 04/14/1992 | US5104494 Method of restoring solderability |
| 04/14/1992 | US5104480 Direct patterning of metals over a thermally inefficient surface using a laser |
| 04/14/1992 | US5104339 Electrical circuit component with latching means for mounting to a circuit substrate |
| 04/14/1992 | US5104034 Soldering, immersion, fluid flow, withdrawal; circuit boards |
| 04/14/1992 | US5103846 Apparatus for cleaning mechanical devices using terpene compounds |
| 04/14/1992 | CA1298901C Means for detecting and adjusting metal salt concentration in an electroless plating bath |
| 04/14/1992 | CA1298740C Conductive metallization of substrates without developing agents |
| 04/13/1992 | CA2053338A1 Method of and apparatus for producing laminate boards |
| 04/09/1992 | DE4040662C1 Electrical plug connector - has poly-flex circuit into which ends of contact pins are plugged |
| 04/09/1992 | DE4031733A1 Mehrlagenhybride mit leistungsbauelementen Multi-layer hybrid with power devices |
| 04/09/1992 | DE4031437A1 Impregnating continuous substrate - by dipping in a bath, coiling on a perforated roll and subjecting to a low surrounding pressure to remove air, etc. |
| 04/09/1992 | CA2052937A1 Production of solder masked electric circuit boards |
| 04/08/1992 | EP0479503A2 Electrical connector |
| 04/08/1992 | EP0479219A1 Method for reducing shrinkage during firing of ceramic bodies |
| 04/08/1992 | EP0479205A2 Electronic circuit and method of making same |
| 04/08/1992 | EP0479018A2 Polyimid film with metal salt coating |
| 04/08/1992 | EP0478975A2 Process for producing a metal-organic polymer combination |
| 04/08/1992 | EP0478879A2 A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board |
| 04/08/1992 | EP0478562A1 Snap fit contact assembly. |
| 04/07/1992 | US5103375 Electronic module assembly and method of manufacture |
| 04/07/1992 | US5103293 Polyimides |
| 04/07/1992 | US5103247 Semiconductor device |
| 04/07/1992 | US5103071 Surface mount technology breakaway self regulating temperature heater |
| 04/07/1992 | US5102970 Filling holes in printed circuits |
| 04/07/1992 | US5102831 Method of manufacturing multi-chip package |
| 04/07/1992 | US5102829 Plastic pin grid array package |
| 04/07/1992 | US5102719 Ceramic, circuit substrate and electronic circuit substrate by use thereof and process for producing ceramic |
| 04/07/1992 | US5102718 Multi-chip substrate |
| 04/07/1992 | US5102712 Process for conformal coating of printed circuit boards |
| 04/07/1992 | US5102521 Horizontal carrying tape electroplating apparatus |
| 04/07/1992 | US5102519 Process for preparing a printed-circuit board |
| 04/07/1992 | US5102509 Plating |
| 04/07/1992 | US5102491 Wet lamination process and apparatus |
| 04/07/1992 | US5102356 Electrical connector having board retention means |
| 04/07/1992 | US5102030 Method for mounting electronic parts on printed circuit board |
| 04/07/1992 | CA1298634C Process and machinery for step-and-repeat vacuum-deposition or large-area thin-film-electronics matrix-circuits on monolithic glass panes through small perforated metal masks |
| 04/07/1992 | CA1298567C Method for making metallic patterns |
| 04/07/1992 | CA1298511C Solvent developable photoresist film |
| 04/07/1992 | CA1298451C Surface-roughened film and sheet, and process for production and use thereof |
| 04/05/1992 | CA2052210A1 Method for reducing shrinkage during firing of ceramic bodies |
| 04/02/1992 | WO1992005681A1 Device for the connection of a feeder line |
| 04/02/1992 | WO1992005679A1 Encapsulation method for electrical components |
| 04/02/1992 | WO1992005678A1 Mixture and process for the treatment of metal bodies |
| 04/02/1992 | WO1992005677A1 Process for manufacturing circuits |
| 04/02/1992 | WO1992005592A1 Piezoelectric component-mounting foil and foil-making method |
| 04/02/1992 | WO1992005583A1 Semiconductor device having many lead pins |
| 04/02/1992 | WO1992005127A1 Method for coating a dielectric ceramic piece |
| 04/02/1992 | WO1992005008A1 Method of cleaning printed circuit boards using water |
| 04/02/1992 | DE4030532A1 Hybrid multilevel circuit with metal substrate - bonded directly to glass-ceramic layer of lowest circuit level |
| 04/02/1992 | DE4029970A1 Compressing multilayer circuit boards - first aligning etched inner layers and intermediate adhesive foils, using positioning pins |
| 04/01/1992 | EP0478449A2 Screen printing ink and method of making a superconducting thick film by using this ink |
| 04/01/1992 | EP0478368A1 Integrated circuits and processes of manufacture |
| 04/01/1992 | EP0478320A2 Method for manufacturing printed circuit board |
| 04/01/1992 | EP0478313A2 A multilayer printed circuit board and manufacturing method therefor |
| 04/01/1992 | EP0478218A2 Structure of electric circuit for instrument panel of automobile and method for forming the same |
| 04/01/1992 | EP0478192A2 Solder deposition |
| 04/01/1992 | EP0478170A2 Solder deposition |
| 04/01/1992 | EP0478161A2 Soldering device |
| 04/01/1992 | EP0478157A2 Solder nozzle assembly |
| 04/01/1992 | EP0478051A2 Method for the manufacture, in a continuous process, of substrates for printed wire boards, and printed wire boards so manufactured |
| 04/01/1992 | EP0478010A2 Process for producing a continuous web of an electrically insulated metallic substrate |
| 04/01/1992 | EP0477981A2 Multi-layer circuit substrate having a non-planar shape, and a method for the manufacture thereof |
| 04/01/1992 | EP0477881A2 Ceramic electrical component with terminal metallizations for electrical connection through conductive adhesives |
| 04/01/1992 | EP0477766A1 Machine tool, in particular for working printed circuit boards |
| 04/01/1992 | EP0477543A2 Method for conditioning halogenated polymeric materials and structures fabricated therewith |
| 04/01/1992 | EP0477170A1 Method for the manufacture of multilayer printed circuit boards |
| 04/01/1992 | EP0464144A4 A multilayer film and laminate for use in producing printed circuit boards |
| 04/01/1992 | EP0275433B1 Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil |
| 04/01/1992 | EP0266397B1 High speed precision drilling system |