| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/06/1992 | EP0483408A1 Removable VLSI package |
| 05/06/1992 | EP0472653A4 Preparation of cyano-containing perfluoropolymers having iodine curesites |
| 05/06/1992 | CN1060861A Enhancement of polyimide adhesion on reactive metals |
| 05/06/1992 | CN1016573B Carrier of electronic elements and manufacture thereof |
| 05/05/1992 | US5111406 Method for determining drill target locations in a multilayer board panel |
| 05/05/1992 | US5111364 Impact resistant layer for a circuit board |
| 05/05/1992 | US5111363 Mount for electronic parts |
| 05/05/1992 | US5111279 Apparatus for isolation of flux materials in "flip-chip" manufacturing |
| 05/05/1992 | US5111278 Three-dimensional multichip module systems |
| 05/05/1992 | US5111200 Broadband space-division switching network with linkage in a printed circuit board having multi-layer micro-strip lines |
| 05/05/1992 | US5111176 Dual position, flat mount piggyback fuse holder |
| 05/05/1992 | US5111003 Multilayer wiring substrate |
| 05/05/1992 | US5110903 Process for the preparation of mixed parylene dimers free of alpha-halogens |
| 05/05/1992 | US5110664 Thick film and thin film composite substrate and electronic circuit apparatus using it |
| 05/05/1992 | US5110654 Ceramic multilayer wiring substrate |
| 05/05/1992 | US5110633 Finely particulate metal oxide filler; acid aqueous solution of noble metal salt |
| 05/05/1992 | US5110618 Process for electrostatically coating a substrate using an aerosol |
| 05/05/1992 | US5110615 Method for dispensing viscous materials a constant height above a workpiece surface |
| 05/05/1992 | US5110409 Enhanced plasma etching |
| 05/05/1992 | US5110400 Apparatus for bonding continuous thin film to discrete base plates and cutting thereof |
| 05/05/1992 | US5110393 Method of peeling a bonded film from a circuit board |
| 05/05/1992 | US5110391 Method and apparatus for automatically bonding film to a substrate and cutting the film to desired size |
| 05/05/1992 | US5110384 Process for making electrically conductive patterns |
| 05/05/1992 | US5110355 Treatment of printed circuits before electroplating |
| 05/05/1992 | US5110299 High density interconnect |
| 05/05/1992 | US5110298 Solderless interconnect |
| 05/05/1992 | US5110098 Universal platen holddown apparatus |
| 05/05/1992 | US5110036 Method and apparatus for solder leveling of printed circuit boards |
| 05/05/1992 | US5109601 Method of marking a thin film package |
| 05/05/1992 | US5109596 Adapter arrangement for electrically connecting flat wire carriers |
| 05/05/1992 | US5109584 Printed circuit board adapter supplying apparatus and method for use in printed circuit board drilling apparatus |
| 05/05/1992 | CA1299935C Process for adhesive metallization of plastics |
| 05/05/1992 | CA1299873C Grinding guide and method for controlling the automatic grinding of objects |
| 05/01/1992 | CA2054374A1 Method and apparatus for applying surface treatment to metal foil |
| 05/01/1992 | CA2054282A1 Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| 04/30/1992 | WO1992007452A1 Reusing liquids in a liquid cleaning apparatus |
| 04/30/1992 | WO1992007112A1 Binary azeotropic compositions of (cf3chfchfcf2cf3) with methanol or ethanol or isopropanol |
| 04/30/1992 | WO1992007111A1 Ternary azeotropic compositions of 43-10mee (cf3chfchfcf2cf3) and trans 1,2-dichloroethylene with methanol or ethanol |
| 04/30/1992 | WO1992006941A1 Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions |
| 04/30/1992 | WO1992006856A1 Composition and method for improving adherence of copper foil to resinous substrates |
| 04/30/1992 | DE4134172A1 Tape automated bonding interconnect device mfr. |
| 04/30/1992 | DE4033969A1 Programmable control or switchgear with terminals on housing - which are included in plug socket with contacts coacting with selected plug contacts for various operating modes |
| 04/29/1992 | EP0482734A1 Electroless Pb-Sn alloy plating bath composition |
| 04/29/1992 | EP0482431A1 Electronic substrate multiple location conductor attachment technology |
| 04/29/1992 | CN1060686A Ternary azeotropic compositions of 1,1,1,2,3,4,4,5,5,5-decafluoropentance and trans 1,2-dichloroethylene with methanol or ethanol |
| 04/29/1992 | CN1016483B Method and device for the cleaning, activation and/or metallization of holes drilled in holizontally guided circuit boards |
| 04/29/1992 | CN1016467B Photosensitive compositions containing microgels |
| 04/28/1992 | US5109479 Method of designing three dimensional electrical circuits |
| 04/28/1992 | US5109320 System for connecting integrated circuit dies to a printed wiring board |
| 04/28/1992 | US5109319 Terminal arrangement for axial lead electrically asymmetric electronic components |
| 04/28/1992 | US5109269 Method and means for positioning surface mounted electronic components on a printed wiring board |
| 04/28/1992 | US5109058 Curable resin solution compositions, their preparation, and electronic part protective coatings |
| 04/28/1992 | US5108823 Process for the metallization of moldings of polyarylene sulfides |
| 04/28/1992 | US5108822 With dielectric film of reduced thickness |
| 04/28/1992 | US5108819 Thin film electrical component |
| 04/28/1992 | US5108786 Method of making printed circuit boards |
| 04/28/1992 | US5108785 Via formation method for multilayer interconnect board |
| 04/28/1992 | US5108571 Process for coating a dielectric substrate with copper |
| 04/28/1992 | US5108562 Microelectronic packages; using base and oxidizer acid for copper etching |
| 04/28/1992 | US5108553 Two metal layer tape automated bonding |
| 04/28/1992 | US5108541 Processes for electrically conductive decals filled with inorganic insulator material |
| 04/28/1992 | US5108236 Low mass spindle and z-axis unit |
| 04/28/1992 | US5108026 Eutectic bonding of metal to ceramic |
| 04/28/1992 | US5108024 Method of inspecting solder joints |
| 04/28/1992 | US5107759 Solder paste stencil printer |
| 04/28/1992 | US5107587 Method for the construction and application of a circuit-board interface for electrical connection in control and monitoring apparatus |
| 04/28/1992 | CA1299476C High lamination speed automatic laminator |
| 04/25/1992 | WO1992007971A1 Cvd of metal films from beta-diketonate complexes |
| 04/25/1992 | CA2090038A1 Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal films |
| 04/23/1992 | WO1992007113A1 Method for removing contaminants from the surfaces of articles |
| 04/23/1992 | DE4035792C1 Printed circuit board panel de-edging device - has two saw-blades mounted in bearingblockings which can be positionally adjusted |
| 04/23/1992 | DE4033430A1 Solder coating of conductor pattern for attaching TAB-assembled device - consists of placing foil of flux material with a solder pattern on top, over substrate pattern |
| 04/23/1992 | DE4033199A1 PCB mfr. using miniature through-pins - achieves high component density using vertical solder dipping process |
| 04/22/1992 | EP0481736A2 Organic resin multi-layer wiring substrate and method of making the same |
| 04/22/1992 | EP0481637A2 Method for firing ceramic articles |
| 04/22/1992 | EP0481483A1 Method of manufacturing the front mask of a display device |
| 04/22/1992 | EP0481472A1 Multilayer printed wiring board and process for manufacturing the same |
| 04/22/1992 | EP0481308A1 Method of manufacturing ceramics circuit board |
| 04/22/1992 | EP0481271A1 Multilayer printed circuit board and manufacturing method |
| 04/22/1992 | EP0481177A1 Printed circuit board with soldered integrated circuit |
| 04/22/1992 | EP0258284B1 Installation for coating and drying both sides of printed circuit boards or similar structures |
| 04/22/1992 | EP0222899B1 Tooth restoration composition, structure and methods |
| 04/22/1992 | CN1060505A Binary azeotropic compositions of (cf3chfchfcf2cf3) with methanol or ethanol or isopropanol |
| 04/22/1992 | CN1060461A Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions |
| 04/22/1992 | CN1016381B Photosensitive compositions containing microcapsules concentrated in surface layer |
| 04/21/1992 | US5107329 Pin-grid array semiconductor device |
| 04/21/1992 | US5107324 Two-terminal semiconductor device of surface installation type |
| 04/21/1992 | US5107078 Electric connection or disconnection element, integrated circuit including such elements and the corresponding connection or disconnection method |
| 04/21/1992 | US5106940 Dihydroxy-pendant rigid-rod benzobisazole polymer |
| 04/21/1992 | US5106537 Mixture of carbon black and ionomer |
| 04/21/1992 | US5106473 Process for metallizing a through-hole board |
| 04/21/1992 | US5106462 Process of producing copper plated resin article |
| 04/21/1992 | US5106461 High-density, multi-level interconnects, flex circuits, and tape for tab |
| 04/21/1992 | US5106454 Process for multilayer printed circuit board manufacture |
| 04/21/1992 | US5106425 Method for maintaining a flammable solvent in a non-flammable environment |
| 04/21/1992 | US5106313 Header device |
| 04/21/1992 | US5106310 Z-Axis pin connectors for stacked printed circuit board assemblies |
| 04/21/1992 | US5106308 Planar contact grid array connector |
| 04/21/1992 | US5105537 High speed electrochemical etching in aqueous salt solution by selective anodic dissolution of mask-defined areas |
| 04/21/1992 | CA1299258C Contact elements for miniature inductor |