Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1992
03/17/1992US5095628 Process of forming a rigid-flex circuit
03/17/1992CA1297596C Method for fabricating multilayer circuits
03/17/1992CA1297595C Printed circuit with thermal dissipator
03/17/1992CA1297393C Thin-film coating apparatus
03/12/1992DE4028503A1 Tool holder for machining e.g. of circuit boards - employs NC unit responsive to read=out of memorised data on condition of tools and machining requirements
03/12/1992DE4028440A1 Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering
03/11/1992WO1992004812A1 Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
03/11/1992EP0474605A2 Assembly and method of assembly for the application of electronic components to flexible printed circuits
03/11/1992EP0474528A1 Cleaning composition based on 1,1-dichloro-1-fluoroethane, methylene chloride and methanol
03/11/1992EP0474194A2 Method of masking electronic devices during processing and ultraviolet radiation curable maskant therefor
03/11/1992EP0474176A2 Thin film multilayer circuit and method of making thin film multilayer circuits
03/11/1992EP0474054A2 Flexible multi-layer polyimide film laminates and preparation thereof
03/11/1992EP0474009A1 Photopolymerisable composition and photopolymerisable recording material produced therefrom
03/11/1992EP0473929A1 Method of forming a thin film electronic device
03/11/1992EP0473912A2 Electric circuit and method to manufacture the same
03/11/1992EP0473911A2 Method for mounting electronic parts on a printed circuit board
03/11/1992EP0473795A1 Method of cleaning
03/11/1992EP0473647A1 Remapping database vectors to discrete pixels
03/11/1992EP0422213A4 Adhesion promotor for thermoplastic substrates
03/11/1992EP0243507B1 Flexible laminate for printed circuit board and process for its production
03/11/1992CN1059372A Dispersion strengthened lead-tin alloy solder
03/11/1992CA2050629A1 Process for defined etching of substrates
03/10/1992US5095407 Printed circuit
03/10/1992US5095406 Circuit board arrangement for electronic/electromechanical apparatus
03/10/1992US5095187 Weakening wire supplied through a wire bonder
03/10/1992US5095077 High performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism using polyester-aziridine reaction products
03/10/1992US5094811 Method of making a printed circuit board
03/10/1992US5094726 Limiting tin sludge formation in tin or tin-lead electroplating solutions
03/10/1992US5094713 Glass fibers, compounds of silicon or titanium
03/10/1992US5094701 Cleaning agents comprising beta-diketone and beta-ketoimine ligands and a process for using the same
03/10/1992US5094574 Spot facing method and apparatus for printed circuit board
03/10/1992US5093987 Method of assembling a connector to a circuit element and soldering component for use therein
03/10/1992US5093986 Method of forming bump electrodes
03/10/1992US5093985 Method of assembly for small electrical devices
03/10/1992CA1297209C Method for processing plastic packaged electronic devices
03/10/1992CA1297205C Method and apparatus for making a flexible interconnect
03/10/1992CA1297203C Compliant s-leads for chip carriers
03/10/1992CA1297202C Printed circuit board components with alternate mounting modes
03/05/1992WO1992003903A1 Method of producing a soldered joint, and equipment with such joints
03/05/1992WO1992003901A1 Circuit board with electrical components, in particular surface-mounted devices
03/05/1992WO1992003599A1 Method for printed circuit board pattern making using selectively etchable metal layers
03/05/1992WO1992003592A1 Process and compositions for forming metal oxide layers
03/05/1992WO1992003516A1 Cyanate ester adhesives for electronic applications
03/05/1992WO1992003040A1 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester
03/05/1992WO1991019414A3 Process for dip-soldering printed circuit boards
03/05/1992DE4027656A1 Contact element for circuit board with surface mounted devices - uses bent sheet metal C=shaped profile fitting around housing of surface mounted device
03/04/1992EP0473538A1 Cleaning compositions without fluoro-chloro-hydrocarbons
03/04/1992EP0473083A2 Detergent compositions comprising fluorinated hydrocarbons containing hydrogen
03/04/1992EP0473069A2 Electroless plating of materials having electrophilic polarity
03/04/1992EP0472830A1 Fiber reinforced epoxy prepreg and fabrication thereof
03/04/1992EP0472653A1 Preparation of cyano-containing perfluoropolymers having iodine curesites.
03/04/1992EP0284626B1 Process for metallizing non-conductive substrates
03/04/1992EP0248029B1 Method for selectively removing adhesives from polyimide substrates
03/04/1992CN1059167A Cleaning composition based 1, 1-dichloro-1-fluoric ether, methane dichloride and methanol
03/04/1992CN1015773B Printed circuit board for mounting in backplane
03/04/1992CN1015772B Soldering apparatus of reflow type
03/03/1992US5093761 Circuit board device
03/03/1992US5093640 Microstrip structure having contact pad compensation
03/03/1992US5093545 Method, system and composition for soldering by induction heating
03/03/1992US5093279 Coating a metal layer to fill recesses and treatment with laser
03/03/1992US5093186 Conductors in laminated through holes; noncracking; low electrical resistance
03/03/1992US5093183 Printed circuit board with layer and order of assembly identification
03/03/1992US5093038 Ultraviolet curable ink composition
03/03/1992US5092967 Removal of exposed nickel by forming nickel carbonyl vapor
03/03/1992US5092958 Method of manufacturing double-sided wiring substrate
03/03/1992US5092943 Dicarboxylic acid having electron withdrawing group as flux
03/03/1992US5092782 Integral elastomeric card edge connector
03/03/1992US5092781 Electrical connector using shape memory alloy coil springs
03/03/1992US5092510 Method and apparatus for circuit board support during component mounting
03/03/1992US5092266 Solder leveler
03/03/1992US5092036 Filling metal tubes, then etching tubes away
03/03/1992US5092035 Method of making printed circuit board assembly
03/03/1992US5092034 Soldering interconnect method for semiconductor packages
03/03/1992US5092033 Method for packaging semiconductor device
03/03/1992US5092032 Manufacturing method for a multilayer printed circuit board
03/03/1992CA1296833C Polymethylpentene release sheet
03/03/1992CA1296559C Method for forming images
02/1992
02/28/1992CA2049595A1 Borate coinitiators for photopolymerizable compositions
02/27/1992DE4026822A1 Surface mountable device carrier prodn. for reliability - esp. for mfg. tape-automated-bonding, by forming bond and contact elements on insulating polyimide film and resistance electroplating
02/27/1992DE4026802A1 Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure
02/27/1992DE4026722A1 Making soldered connection between component and PCB - locating discs on terminal pins to improve contact with soldering pads of flexible board
02/26/1992EP0472420A2 IC card connection structure
02/26/1992EP0472277A1 Method for laser scribing substrates
02/26/1992EP0472177A2 Matt film
02/26/1992EP0472158A2 Process for producing a printed wiring board
02/26/1992EP0472051A2 Three dimensional photographic method for transferring surface details of a body
02/26/1992EP0471938A1 High circuit density thermal carrier
02/26/1992EP0471936A1 Protection-foil for flexible circuit-plates
02/26/1992EP0397747A4 Three-dimensional circuit component assembly and method corresponding thereto
02/26/1992EP0204004B1 Wiring structure of a terminal circuit
02/26/1992CN1059066A Stripping method for removing resist from printed circuit board
02/26/1992CN1015613B Process and apparatus for continuous production of laminates
02/25/1992WO1992003902A1 Method and device for hermetic encapsulation of electronic components
02/25/1992US5091826 Printed wiring board connector
02/25/1992US5091771 Compact package for electronic module
02/25/1992US5091466 Insolubilization of soluble pre-imidized polyimides by polyhydrazine compounds
02/25/1992US5091339 Etching, patterning
02/25/1992US5091288 Method of forming detector array contact bumps for improved lift off of excess metal
02/25/1992US5091286 Laser-formed electrical component and method for making same
02/25/1992US5091283 Photocurable diallyl phthalate resin composition and printed circuit board using the same