| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 10/14/1992 | EP0508946A1 Metal foil with structural surface |
| 10/14/1992 | EP0508821A2 Process for manufacturing multi-layer glass ceramic substrate |
| 10/14/1992 | EP0508722A1 Electrically conductive adhesive tape |
| 10/14/1992 | EP0508610A2 Laminates containing addition-curable silicone adhesive compositions |
| 10/14/1992 | EP0508399A2 Method of producing thin film-deposited substrate |
| 10/14/1992 | EP0508368A2 Process for treating film comprising liquid crystal polymer |
| 10/14/1992 | EP0508305A2 Mounting of electronic components on substrates |
| 10/14/1992 | EP0508286A2 Housing for installation in motor vehicles for retaining electronic components |
| 10/14/1992 | EP0508195A1 Method of forming a microelectronic package having a copper substrate |
| 10/14/1992 | EP0508137A2 Liquid-crystal display device and process for producing the same |
| 10/14/1992 | EP0508035A1 Process for metallising surfaces using metal powder |
| 10/14/1992 | CN1065373A Wave soldering in protective atmosphere enclosure over solder pot |
| 10/14/1992 | CN1065372A Solder-coated printed circuit board and method of manufacturing same |
| 10/14/1992 | CN1065280A Compositions of cupric alloy |
| 10/14/1992 | CN1018621B Laser scribing system and method |
| 10/13/1992 | WO1992019091A1 Process for the metallization of non-conductors, in particular circuit boards, and the use of nitrogen-containing quaternary salts in the process |
| 10/13/1992 | US5155692 Technique for routing conductive paths |
| 10/13/1992 | US5155665 Copper sheet bonded to surface of ceramic substrate; hardness |
| 10/13/1992 | US5155655 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| 10/13/1992 | US5155577 Integrated circuit carriers and a method for making engineering changes in said carriers |
| 10/13/1992 | US5155325 Method of bonding by laser driven explosive cladding |
| 10/13/1992 | US5155306 Switch substrate and method of manufacture |
| 10/13/1992 | US5155301 Electrical connection and method for making the same |
| 10/13/1992 | US5155143 Conformal coatings cured with actinic radiation |
| 10/13/1992 | US5155010 Photopolymerizable layer on support is exposed to light to modify surface thickness in a selective area to accept a color layer from a color carrier; compression, removal of color carrier so color remains on image carrier |
| 10/13/1992 | US5154772 Apparatus for treating plate-shaped articles |
| 10/13/1992 | US5154621 Printed circuit board contact system |
| 10/13/1992 | US5154546 Method for drilling multilayer printed circuit boards |
| 10/13/1992 | US5154341 Noncollapsing multisolder interconnection |
| 10/13/1992 | US5154338 For soldering electrical components |
| 10/13/1992 | US5153987 Process for producing printed wiring boards |
| 10/13/1992 | US5153986 Method for fabricating metal core layers for a multi-layer circuit board |
| 10/13/1992 | US5153985 Method of assembly for the application of electronic components to flexible printed circuits |
| 10/13/1992 | CA2108279A1 Process for the metallization of non-conductors, in particular circuit boards, and the use of nitrogen- containing quaternary salts in the process |
| 10/13/1992 | CA2062604A1 Electrically conductive adhesive tape |
| 10/13/1992 | CA2061296A1 Method for metallizing surfaces by means of metal powders |
| 10/13/1992 | CA1308817C Low dielectric composite substrate |
| 10/13/1992 | CA1308816C Testing process for electronic devices |
| 10/11/1992 | WO1992018002A1 Nitrosation of homocysteine as a method for treating homocysteinemia |
| 10/11/1992 | CA2108152A1 Nitrosation of homocysteine as a method for treating homocysteinemia |
| 10/11/1992 | CA2063503A1 Metal foil with a structure surface |
| 10/08/1992 | DE4110686A1 Kontaktanordnung fuer ein elektrisches oder elektronisches bauteil Contact arrangement for an electrical or electronic component |
| 10/08/1992 | DE4108651C1 Screen printing method reproducing consistent coat thicknesses on substrates - measuring distance between underneath side of film and surface to be printed and supplying computer with result for registering any deviation |
| 10/07/1992 | EP0507719A1 Improved glass-ceramic to copper adhesion |
| 10/07/1992 | EP0507718A1 Low lead content Pb-Sn-Ag-Sb solder alloy useful in an interconnect metallization structure |
| 10/07/1992 | EP0507074A1 Cleaning agents comprising beta-diketone and beta-ketoimine ligands and a process for using the same |
| 10/07/1992 | EP0507043A2 Selective and precise etching and plating of conductive substrates |
| 10/07/1992 | EP0506993A1 High resolution patterning on solid substrates |
| 10/07/1992 | EP0506927A1 Method for removing contaminants from the surfaces of articles |
| 10/07/1992 | EP0506859A1 Flip chip technology using electrically conductive polymers and dielectrics. |
| 10/07/1992 | EP0506786A1 Weakening wire supplied through a wire bonder. |
| 10/06/1992 | US5153843 Layout of large multistage interconnection networks technical field |
| 10/06/1992 | US5153818 Ic memory card with an anisotropic conductive rubber interconnector |
| 10/06/1992 | US5153707 Film material for manufacturing film carriers having outer lead portions with inner and outer metallic layers |
| 10/06/1992 | US5153408 Method and structure for repairing electrical lines |
| 10/06/1992 | US5153384 Circuit board and process for manufacturing same |
| 10/06/1992 | US5153101 Photoresist |
| 10/06/1992 | US5153100 Borate coinitiators for photopolymerizable compositions |
| 10/06/1992 | US5153084 Process for preparing a photo-mask for imaging three-dimensional objects |
| 10/06/1992 | US5153051 Multilayer thermoplastic substrate |
| 10/06/1992 | US5153050 Easy to handle extreemly thin copper foil, free of dust, finger prints, particle and grease spots, prevents resin bleeding around the tooling pins |
| 10/06/1992 | US5153024 Process for manufacturing a printed circuit board by coating a polymeric substrate with a modified polyamine layer and further contacting the coated substrate with noble metal ions |
| 10/06/1992 | US5153023 Process for catalysis of electroless metal plating on plastic |
| 10/06/1992 | US5152913 Cleaning composition based on 1,1-dichloro-1-fluoroethane, methyl formate and methanol |
| 10/06/1992 | US5152868 Elastomer connector for integrated circuits or similar, and method of manufacturing same |
| 10/06/1992 | US5152863 Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| 10/06/1992 | US5152702 Through board connector having a removable solder mask |
| 10/06/1992 | US5152696 Z-axis connectors for stacked printed circuit board assemblies |
| 10/06/1992 | US5152695 Surface mount electrical connector |
| 10/06/1992 | US5152451 Controlled solder oxidation process |
| 10/06/1992 | US5152447 Hot gas jet device for installing and removing components with respect to a substrate and improved tip for use therewith |
| 10/06/1992 | US5152219 Screen process printing apparatus using a screen reinforced by strips |
| 10/06/1992 | US5152057 Molded integrated circuit package |
| 10/06/1992 | US5152056 Method for replacing tape automated bonding components on a printed circuit board |
| 10/06/1992 | US5152054 Method of making film carrier structure for integrated circuit tape automated bonding |
| 10/06/1992 | CA1308494C Connection structure between components for semiconductor apparatus |
| 10/06/1992 | CA1308385C Apparatus and method for separating adherent films |
| 10/06/1992 | CA1308311C Conductive metallization of substrates via developing agents |
| 10/06/1992 | CA1308293C Thin film artwork compounds |
| 10/01/1992 | WO1992017043A1 Swelling solution for printed circuit board polymers before alkaline-oxydative etching and use of this solution |
| 10/01/1992 | WO1992016970A1 Method of manufacturing two-layer tab tape |
| 10/01/1992 | WO1992016877A1 Resist formation |
| 09/30/1992 | EP0506562A1 Electrical connecting process |
| 09/30/1992 | EP0506445A1 Electric connection structure between circuit boards |
| 09/30/1992 | EP0506260A2 Interconnection of opposite sides of a circuit board |
| 09/30/1992 | EP0506254A1 An automatic continuous processing apparatus |
| 09/30/1992 | EP0506217A2 Method for measuring deviations of the layers in a multilayer device and apparatus to realise this method |
| 09/30/1992 | EP0506122A2 Power module |
| 09/30/1992 | EP0506090A2 Semiconductor device with electromagnetic shield |
| 09/30/1992 | EP0506062A2 Stripline shielding techniques in low temperature co-fired ceramic |
| 09/30/1992 | EP0505894A1 Coating processes and apparatus |
| 09/30/1992 | EP0505859A1 Electronic package for high density applications |
| 09/30/1992 | CN1018486B Personal computer processor card interconnect system |
| 09/29/1992 | WO1992017820A1 Photodefinable interlevel dielectrics |
| 09/29/1992 | US5151868 Signal line terminal allocation method |
| 09/29/1992 | US5151846 Surface mountable rectifier and method for fabricating same |
| 09/29/1992 | US5151386 Method of applying metallized contacts to a solar cell |
| 09/29/1992 | US5151377 Method for forming contacts |
| 09/29/1992 | US5151373 Method of making a solar cell electrode |
| 09/29/1992 | US5151304 Multilayer element with polyimide support, coating, crystallization, washing and conversion of polyimide to polyamide and polyamide to polyimide |