| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/26/1992 | CA2059891A1 Compositions for the production of seed layers |
| 07/23/1992 | WO1992012227A1 High temperature flashpoint, stable cleaning composition |
| 07/23/1992 | DE4201129A1 Palladium-coated printed wiring boards - for integrated circuits, with improved solderability |
| 07/23/1992 | DE4101165A1 Corrosion protected LCD mfr. - involves precious metal coating of metal portions after bonding operations |
| 07/23/1992 | CA2077895A1 High temperature flashpoint, stable cleaning composition |
| 07/23/1992 | CA2059709A1 Flexible laminates |
| 07/23/1992 | CA2059707A1 Electrodeposition method |
| 07/22/1992 | EP0495629A1 Vertical lead-on-chip package |
| 07/22/1992 | EP0495540A2 Multi-level board, especially for high frequency |
| 07/22/1992 | EP0495468A2 Method of producing treated copper foil, products thereof and electrolyte useful in such method |
| 07/22/1992 | EP0495035A1 Method of applying metallized contacts to a solar cell |
| 07/22/1992 | EP0494975A1 Azeotrope-like compositions of 1,3-dichloro-1,1,2,2,3-pentafluoropropane and 2-methyl-2-propanol. |
| 07/22/1992 | EP0494913A1 Electro-active cradle circuits for the detection of access or penetration |
| 07/22/1992 | EP0266412B1 Surface mountable diode |
| 07/22/1992 | CN2110977U Plane antenna for tv and radar |
| 07/21/1992 | US5132879 Secondary board for mounting of components having differing bonding requirements |
| 07/21/1992 | US5132877 Molded electrical assembly having an integral connector |
| 07/21/1992 | US5132864 Printed circuit board |
| 07/21/1992 | US5132351 Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent |
| 07/21/1992 | US5132248 Direct write with microelectronic circuit fabrication |
| 07/21/1992 | US5132191 A polycarbonate as substrates modified with nitrates for adhesion |
| 07/21/1992 | US5132185 Ceramic articles having heat-sealable metallic coatings |
| 07/21/1992 | US5132058 Molding, magnetism |
| 07/21/1992 | US5132039 Dimethylcyclooctadienes, Surfactant |
| 07/21/1992 | US5132038 Anionic surfactants containing sulfonate diphenyl ether |
| 07/21/1992 | US5131972 Film guide device for a film bonding apparatus |
| 07/21/1992 | US5131941 High Temperature, Radiation |
| 07/21/1992 | US5131852 Electrical socket |
| 07/21/1992 | US5131584 Method to interconnect electric components by means of solder elements |
| 07/21/1992 | US5131141 Method for preparing a double-sided flexible circuit board with electrical connection at a through-hole |
| 07/21/1992 | US5131140 Method for evaluating plane splits in printed circuit boards |
| 07/21/1992 | CA1305374C Application of conductive metallic film to a glass ceramic support surface |
| 07/16/1992 | DE4100865A1 Use of reactive substrate in thick film resistor mfr. - has thick dielectric layer acting as adhesion promoter and insulating layer, between resistor layer and substrate |
| 07/16/1992 | DE4100839A1 Aq. acidic oxidising bath for removing tin@ or alloy layers - from printed circuit boards, contg. phenyl or benzyl quat. ammonium salt to prevent corrosion of copper |
| 07/15/1992 | EP0494668A2 Polyimide multilayer wiring board and method of producing same |
| 07/15/1992 | EP0494574A2 Device for multiple-point application of equal forces |
| 07/15/1992 | EP0494560A2 Support for printed circuits with heat dissipation means |
| 07/15/1992 | EP0494463A2 Connection method and connection device for electrical connection of small portions |
| 07/15/1992 | EP0494458A1 Composite element for electric connector and method for the fabrication of such an element |
| 07/15/1992 | EP0494153A1 Compound arrangement with printed circuit board. |
| 07/15/1992 | EP0321514B1 Method of coating copper conductors on polyimide |
| 07/14/1992 | US5130833 Liquid crystal device and manufacturing method therefor |
| 07/14/1992 | US5130780 Dual in-line packaging with improved moisture resistance |
| 07/14/1992 | US5130779 Solder mass having conductive encapsulating arrangement |
| 07/14/1992 | US5130768 Compact, high-density packaging apparatus for high performance semiconductor devices |
| 07/14/1992 | US5130682 Dielectric filter and mounting bracket assembly |
| 07/14/1992 | US5130498 Aluminum nitride, aluminum alloy, bonding layer, resistance against thermal stress |
| 07/14/1992 | US5130229 Photosensitive polymer overlays having both wiring and interconnecting metallurgy |
| 07/14/1992 | US5130192 Process for preparing metallized polyimide film |
| 07/14/1992 | US5130179 Insulation, glass powder, metal powder |
| 07/14/1992 | US5129962 Integrated circuits |
| 07/14/1992 | US5129956 Fluid delivery, nozzles, conveyors and sprayers |
| 07/14/1992 | US5129833 Low-force, high-density gel connector |
| 07/14/1992 | US5129832 Surface mount electrical connector and method of making the same |
| 07/14/1992 | US5129830 Z-axis pin connectors for stacked printed circuit board assemblies |
| 07/14/1992 | US5129829 Socket for a miniature incandescent lamp |
| 07/14/1992 | US5129573 Method for attaching through-hole devices to a circuit board using solder paste |
| 07/14/1992 | US5129142 Encapsulated circuitized power core alignment and lamination |
| 07/09/1992 | WO1992011665A1 Three-dimensional microwave circuit carrier and integral waveguide coupler |
| 07/09/1992 | WO1992011580A1 Photodefinable interlevel dielectrics |
| 07/09/1992 | WO1992011400A1 Azeotrope-like compositions of dichloropentafluoropropane, an alkanol having 1-3 carbon atoms and 2-methyl-2-propanol |
| 07/09/1992 | WO1992011110A1 A method of cloning printed wiring boards |
| 07/08/1992 | EP0493939A1 Flexible printed circuits |
| 07/08/1992 | EP0493644A1 Electrodialysis cell for removal of excess electrolytes formed during electrodeposition of photoresist coatings |
| 07/08/1992 | EP0448702A4 Application specific tape automated bonding |
| 07/07/1992 | US5128834 Surface mount receptacle for leaded components |
| 07/07/1992 | US5128749 Fused high density multi-layer integrated circuit module |
| 07/07/1992 | US5128746 Epoxy or polyester, flux, curing agents |
| 07/07/1992 | US5128506 Method and apparatus for selective infrared soldering using shielding fixtures |
| 07/07/1992 | US5128444 Heat resistant adhesive |
| 07/07/1992 | US5128057 For electronic components |
| 07/07/1992 | US5128008 Method of forming a microelectronic package having a copper substrate |
| 07/07/1992 | US5127998 Oxidation, non-photoresist |
| 07/07/1992 | US5127991 Alkyltrimethylammonium chloride |
| 07/07/1992 | US5127986 High power, high density interconnect method and apparatus for integrated circuits |
| 07/07/1992 | US5127572 Soldering method and tool |
| 07/07/1992 | US5127571 Water soluble soldering preflux and method of application |
| 07/07/1992 | US5127570 Flexible automated bonding method and apparatus |
| 07/07/1992 | US5127330 Method including treatment of ink on a plate to cause hardening at other than the ink outer surface before printing |
| 07/07/1992 | US5127158 Process for producing a printed circuit board with a syndiotactic polystyrene support |
| 07/07/1992 | CA1304865C Heat activatable adhesive for wire scribed circuits |
| 07/02/1992 | DE4040643A1 Simulation of integrated circuit in housing - involves components on base plate, corresp. to basic dimensions of original housing with terminals for original |
| 07/01/1992 | EP0493317A1 Radiosensitive composition on basis of water as solvent or dispersion medium, respectively |
| 07/01/1992 | EP0493240A2 Liquid crystal display module |
| 07/01/1992 | EP0493106A2 Method of locating objects |
| 07/01/1992 | EP0493103A2 Electrical connection system |
| 07/01/1992 | EP0492830A2 Method of indicating a cure point for ultraviolet radiation curing compositions by color change |
| 07/01/1992 | EP0492654A1 Method and device for tin plating tinnable bond pads of an electronic component housing |
| 07/01/1992 | EP0492518A1 A ceramic substrate for electronic circuit and a method for producing the same |
| 07/01/1992 | EP0492492A2 Method of securing a connector to a circuit element and soldering lead frame for use therein |
| 07/01/1992 | EP0492335A2 Method for surface treatment |
| 07/01/1992 | EP0492110A1 Method for connecting a flexible printed circuit board to an electrical component, apparatus obtainable thereby as well as a device for assembling a flexible printed circuit board |
| 07/01/1992 | EP0492095A2 Method and apparatus for machining circuit boards, in particular circuit boards with surface-mounted components |
| 07/01/1992 | EP0492017A1 Electrical terminal with frangible mounting leg and method of forming the same |
| 07/01/1992 | EP0223830B1 Solder-bearing leads |
| 07/01/1992 | CN2109051U Copper foil coaded gum |
| 07/01/1992 | CN1062445A Method for firing ceramic thick film circuits with photopolymerizable paste materials and products produced thereby |
| 07/01/1992 | CN1017301B Thick-film electrode material and preparing method thereof |
| 07/01/1992 | CA2057979A1 Flexible printed circuits |
| 06/30/1992 | US5126921 Electronic component and a method for manufacturing the same |