| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/21/1991 | DE4015858A1 Heisssiegelbeschichtung auf dispersionsbasis Heat-seal coating on dispersion-based |
| 11/20/1991 | CN2089232U Electric knife-engraving device for pcb |
| 11/19/1991 | WO1991019414A2 Process for dip-soldering printed circuit boards |
| 11/19/1991 | US5067042 Wiring board for flat package type integrated circuit device |
| 11/19/1991 | US5067007 Semiconductor device having leads for mounting to a surface of a printed circuit board |
| 11/19/1991 | US5066906 Time of use register for use with a utility meter |
| 11/19/1991 | US5066850 Soldering apparatus of a reflow type |
| 11/19/1991 | US5066844 Soldering device with stirrup electrodes and a suction pipette |
| 11/19/1991 | US5066691 Adhesive composition for metal-clad laminates |
| 11/19/1991 | US5066565 Selective protection of poly(tetra-fluoroethylene) from effects of chemical etching |
| 11/19/1991 | US5066545 Textured, hydrophilized surface, electroless nickel or cobalt coating, adhesive-free, printed circuits |
| 11/19/1991 | US5066544 Containing metal sulfide or nickel-tin intermetallic |
| 11/19/1991 | US5066417 Binary azeotropic compositions of 2,2-dichloro-1,2-difluoroethane with methanol, ethanol, or trans-1,2-dichloroethylene |
| 11/19/1991 | US5066374 Elimination of film defects due to hydrogen evolution during cathodic electrodeposition |
| 11/19/1991 | US5066368 Process for producing black integrally colored anodized aluminum components |
| 11/19/1991 | US5066367 Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| 11/19/1991 | US5066366 Method for making foil |
| 11/19/1991 | US5066360 Using resist as protective covering for metallized appertures so they are not destroyed during etching of circuit board pattern |
| 11/19/1991 | US5066357 Method for making flexible circuit card with laser-contoured vias and machined capacitors |
| 11/19/1991 | US5066171 Method for drilling a printed circuit board |
| 11/19/1991 | US5065944 Reinforced spray manifold |
| 11/19/1991 | US5065933 Electronic device manipulating apparatus and method |
| 11/19/1991 | US5065932 Solder placement nozzle with inert cover gas and inert gas bleed |
| 11/19/1991 | US5065692 Solder flux applicator |
| 11/19/1991 | US5065506 Method of manufacturing circuit board |
| 11/19/1991 | US5065505 Method for connecting circuit boards |
| 11/19/1991 | CA2083135A1 Process for dip-soldering printed circuit boards |
| 11/18/1991 | WO1991017858A1 Use of organic acids in low residue solder pastes |
| 11/18/1991 | CA2063834A1 Use of organic acids in low residue solder pastes |
| 11/18/1991 | CA2041114A1 Low leaching uv curable sealant and encapsulant with post cure mechanism |
| 11/16/1991 | CA2042459A1 Mixtures |
| 11/14/1991 | WO1991017219A1 Temperature and solvent-resistant ink for the ink-jet printing process |
| 11/14/1991 | WO1991016995A1 Solder flux applicator |
| 11/14/1991 | DE4113483A1 Fine wiring trace prodn. for single or multilayer circuits - by photocopying tacky pattern on temporary substrate, developing with conductive powder, transferring to substrate and sintering |
| 11/14/1991 | DE4112859A1 Conductive layer prodn. in LCD mfr. - by electroless nickel plating of structured indium-tin oxide layer without accidental connections between lines or layers |
| 11/14/1991 | DE4112857A1 Liquid crystal display - has isolating film with projecting conduction tracks on three sides |
| 11/14/1991 | DE4015292A1 Printing grid for PCB components - has cut away portions overlying different heights of substrate allowing grid to lie flat on carrier |
| 11/14/1991 | DE4014827A1 Flexible circuit line structure - e.g. electrical initiator for detonator, made by metal ion coating of voltage resistant plastic foil |
| 11/13/1991 | EP0456428A2 Electronic system having component parts bonded by a thermally conductive adhesive |
| 11/13/1991 | EP0456409A2 Water soluble soldering flux |
| 11/13/1991 | EP0456388A1 Processing high-density circuit substrates and container for use in such processing |
| 11/13/1991 | EP0456346A2 Silicone organic conformal coatings |
| 11/13/1991 | EP0456243A2 Composite sheet and a process for producing ceramic circuit board using same |
| 11/13/1991 | EP0455915A1 Electroless plating of nickel onto surfaces such as copper or fused tungsten |
| 11/13/1991 | EP0455891A1 Cone electrical contact |
| 11/13/1991 | EP0455829A1 Board holder in printed board boring machine |
| 11/13/1991 | EP0455714A1 A method of manufacturing a substrate for placement of electrical and/or electronic components. |
| 11/13/1991 | EP0455658A1 Method and device for fastening an electronic circuit substrate onto a support. |
| 11/13/1991 | EP0389559A4 Moldable/foldable radio housing |
| 11/13/1991 | CN2088773U Printing circuit board with tin lead coated only by welding tray |
| 11/13/1991 | CN1014763B Making method of printed-wiring board |
| 11/12/1991 | US5065285 Multi-layer circuit board, method of manufacturing the same and application thereof |
| 11/12/1991 | US5065284 Multilayer printed wiring board |
| 11/12/1991 | US5065283 Printed circuit board with busbar interconnections |
| 11/12/1991 | US5065282 Interconnection mechanisms for electronic components |
| 11/12/1991 | US5065280 Flex interconnect module |
| 11/12/1991 | US5065279 Integral protective enclosure for tab or similar delicate assembly mounted locally on a flexible printed circuit board |
| 11/12/1991 | US5065275 Titanate ceramic dielectric and calcium-magnesium silicate insulating laminate |
| 11/12/1991 | US5065228 Thin, flexible circuits |
| 11/12/1991 | US5065227 Integrated circuit packaging using flexible substrate |
| 11/12/1991 | US5064740 Photohardenable electrostatic element with improved environmental latitude |
| 11/12/1991 | US5064723 Adhesion promoter, coating |
| 11/12/1991 | US5064711 Substrate of a hybrid ic, method of forming a circuit pattern and apparatus of forming the same |
| 11/12/1991 | US5064681 Ablation to remove nucleation sites; vapor deposition |
| 11/12/1991 | US5064583 Method for applying mold release coating to separator plates for molding printed circuit boards |
| 11/12/1991 | US5064560 Ternary azeotropic compositions of 43-10mee (CF3 CHFCHFCH2 CF.sub. |
| 11/12/1991 | US5064559 Solvent cleaning printed circuits, refrigerants, heating media, blowing agents, aerosol propellants |
| 11/12/1991 | US5064511 Electrochemical graining of aluminum or aluminum alloy surfaces |
| 11/12/1991 | US5064481 Malic acid flux |
| 11/12/1991 | US5064469 Organic Amine, 1,2-Dihydroxybenzene Compound, Ethylene Glycol |
| 11/12/1991 | US5064377 Compression contact electrical connector assembly for a disc drive |
| 11/12/1991 | US5063951 Fluid treatment device |
| 11/12/1991 | US5063950 Apparatus and method for treating and/or cleaning of objects, particularly circuit boards |
| 11/12/1991 | US5063660 Method for manufacturing preforms coated with hard solder for repairing interconnect interruptions |
| 11/12/1991 | US5063658 Masking |
| 11/12/1991 | CA1291905C Electronic device fabrication on non-conductive polymer substrate |
| 11/08/1991 | CA2041807A1 Thermally conductive adhesive |
| 11/07/1991 | DE4113730A1 H.F. printed circuit substrate prodn. - from injection moulded thermoplastic resin board with accurate thickness by bonding to copper foil or laminate |
| 11/07/1991 | DE4014070A1 Mfg. process for printed circuit boards - forming by injection moulding with trenches filled in with conductive material for tracks |
| 11/06/1991 | EP0455465A2 Washing/drying method and apparatus |
| 11/06/1991 | EP0455229A2 Ceramic substrate used for fabricating electric or electronic circuit |
| 11/06/1991 | EP0455208A2 Copolyimide film with improved properties |
| 11/06/1991 | EP0455032A2 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions |
| 11/06/1991 | EP0454929A2 Method for improving metal adhesion to polyimide surfaces |
| 11/06/1991 | EP0454873A1 Drying method and apparatus therefor |
| 11/06/1991 | EP0394327B1 Central circuit arrangement for motor vehicles |
| 11/06/1991 | EP0380591A4 Fiber/resin composites, and method of making the same |
| 11/06/1991 | EP0187150B1 Composition and process for conditioning the surface of plastic substrates prior to metal plating |
| 11/05/1991 | US5063280 Method and apparatus for forming holes into printed circuit board |
| 11/05/1991 | US5063121 Sheet with metallized layer containing molybdenum, tungsten, activator metal or their alloys and interface layer of yttria and alumina |
| 11/05/1991 | US5062988 For printed circuits |
| 11/05/1991 | US5062939 Printed circuits, polyesters |
| 11/05/1991 | US5062930 Electrolytic permanganate generation |
| 11/05/1991 | US5062916 Method for the manufacture of electrical membrane panels having circuits on flexible plastic films |
| 11/05/1991 | US5062902 Fluxing agents comprising β-diketone and β-ketoimine ligands and a process for using the same |
| 11/05/1991 | US5062896 Solder/polymer composite paste and method |
| 11/05/1991 | US5062818 Miniature bulb assembly and method of producing the same |
| 11/05/1991 | US5062692 Exposure apparatus |
| 11/05/1991 | US5062567 Lead design to facilitate post-reflow solder joint quality inspection |
| 11/05/1991 | CA1291671C Cooling and exhaust unit for solder reflow system |