| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/29/1992 | US5151300 Multilayer printed wiring boards for printed circuits |
| 09/29/1992 | US5150830 Method of bonding a sheet of metal, such as copper, on an aluminum nitride substrate |
| 09/29/1992 | US5150727 Fluid baffle for recirculating of fluid |
| 09/29/1992 | CA2105657A1 Photodefinable interlevel dielectrics |
| 09/29/1992 | CA1308057C Aqueous electroplating bath and method for electroplating tin and/or lead |
| 09/28/1992 | WO1992017903A2 Three-dimensional multichip module systems and methods of fabrication |
| 09/28/1992 | WO1992017901A1 Multichip integrated circuit module and method of fabrication |
| 09/28/1992 | CA2106873A1 Three-dimensional multichip module systems and methods of fabrication |
| 09/28/1992 | CA2106872A1 Multichip integrated circuit module and method of fabrication |
| 09/28/1992 | CA2063121A1 Stripline shielding techniques in low temperature co-fired ceramic |
| 09/24/1992 | DE4109363A1 Bonding electrical or electronic component to wiring substrate - using electroconductive adhesive for terminals and insulating adhesive for mounting |
| 09/23/1992 | EP0505307A2 A method for forming sealed co-fired glass ceramic structures |
| 09/23/1992 | EP0505248A1 Method of manufacturing semiconductor device having unit circuit-blocks and semiconductor devices produced thereby |
| 09/23/1992 | EP0505227A2 Method for making resist patterns for large area circuit base |
| 09/23/1992 | EP0505076A1 Pressing apparatus and method |
| 09/23/1992 | EP0504850A1 Laser machining method and apparatus therefor |
| 09/23/1992 | EP0504656A1 Method and device for treating one side of plate-like articles |
| 09/23/1992 | EP0504601A2 Substrate soldering in a reducing atmosphere |
| 09/23/1992 | EP0504569A2 Method of coating or sealing of electronic components or component groups |
| 09/23/1992 | EP0504411A1 Semiconductor device having many lead pins |
| 09/23/1992 | EP0504314A1 Novel bistriazene compounds and polymeric compositions crosslinked therewith. |
| 09/23/1992 | EP0451254A4 Multilayer circuit board having microporous layers and process for making same |
| 09/23/1992 | CA2063619A1 Regeneration of alkaline permanganate solutions and electrochemical cell therefor |
| 09/22/1992 | US5150423 Method of and device for inspecting pattern of printed circuit board |
| 09/22/1992 | US5150094 Holder for a cartridge type fuse |
| 09/22/1992 | US5150088 Stripline shielding techniques in low temperature co-fired ceramic |
| 09/22/1992 | US5149615 Applying multicoat of chromium adhesion, gold plating seed, polyimide dielectric, passivation layer and electroplated copper conductors; patterning, dissolving, exposing and etching to form desired integrated circuit |
| 09/22/1992 | US5149590 Fluoropolymer filled with ceramic having a coating of fluorinated silane |
| 09/22/1992 | US5149404 Determining linewidth by electric field |
| 09/22/1992 | US5149394 Epoxy resins, glass fabric, copper foils |
| 09/22/1992 | US5148968 Solder bump stretch device |
| 09/22/1992 | US5148963 Method for solder nozzle height sensing |
| 09/22/1992 | US5148962 Holder for soldering a flexible circuit board to a substrate |
| 09/22/1992 | US5148765 Printed-wireboard photoimaging |
| 09/22/1992 | US5148595 Attaching electrically integrated circuit dies to conductive traces formed by photolithographically etching a copper foil layer on a narrow substrate of precise thickness |
| 09/22/1992 | CA2063479A1 Method and system for punching holes in a sheet material |
| 09/22/1992 | CA1307857C Printed circuit board having an injection molded substrate |
| 09/17/1992 | WO1992016090A1 Registration system |
| 09/17/1992 | WO1992016089A1 Electrical device, in particular a switching or control device for motor vehicles |
| 09/17/1992 | WO1992016016A1 Laser lithography for integrated circuit manufacture |
| 09/17/1992 | WO1992016004A1 Fusible flexible printed circuit and method of making same |
| 09/17/1992 | WO1992015723A1 Process for adhering metal to polyimide film |
| 09/17/1992 | WO1992015628A1 Photosensitive compositions containing comb polymer binders |
| 09/17/1992 | WO1992015408A1 Specific microsieve, specific composite body |
| 09/17/1992 | WO1992015403A1 Process and apparatus for coating both sides of plate-shaped workpieces and apparatus for turning over the workpieces |
| 09/17/1992 | DE4108667A1 Composite circuit board with metallic base plate - obtd. by fixing a thick layer conductor plate on a metallic base plate using a pressure hardenable silicone adhesive hardened in separate oven process |
| 09/17/1992 | DE4108155A1 Mfg. two layer circuit board with through contacts - photo-etching copper@ layers with laser cutting of board and soldering for flexible construction |
| 09/17/1992 | DE4108073A1 Strong bonding of copper@ to polymer - uses copper@ pretreated by surface oxidn., redn. using formaldehyde soln. and then re-oxidn. by baking |
| 09/17/1992 | DE4107657A1 Circuit board plug mounting - is provided by pin engagement with through hole contacts in board |
| 09/16/1992 | EP0503389A2 Process for electroless plating tin, lead or tin-lead alloy |
| 09/16/1992 | EP0503351A2 Primer for metallising substrates |
| 09/16/1992 | EP0503089A1 A fine sphere, a spherical spacer for a liquid crystal display element and a liquid crystal display element using the same. |
| 09/16/1992 | CN1018325B Preparation of strip shaped electric poles for matrix displayer |
| 09/16/1992 | CN1018249B Solder and electronic circuit using the same |
| 09/15/1992 | US5148375 Soldering appearance inspection apparatus |
| 09/15/1992 | US5148355 Method for making printed circuits |
| 09/15/1992 | US5148349 Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
| 09/15/1992 | US5147760 Method of exposing printed wiring boards having through holes |
| 09/15/1992 | US5147759 Acrylic linear copolymer, ethylenically-unsaturated compound, photinitiator; easily etched |
| 09/15/1992 | US5147692 Electroless plating of nickel onto surfaces such as copper or fused tungston |
| 09/15/1992 | US5147680 Precise edges |
| 09/15/1992 | US5147519 Sacraficial substrate |
| 09/15/1992 | US5147518 Using an aminomercaptan compound as coupler |
| 09/15/1992 | US5147492 Method of bonding copper and resin |
| 09/15/1992 | US5147484 During burnout of binder |
| 09/15/1992 | US5147454 Electrolessly solder plating composition |
| 09/15/1992 | US5147210 Polymer film interconnect |
| 09/15/1992 | US5147209 Intermediary adapter-connector |
| 09/15/1992 | US5147208 Flexible printed circuit with raised contacts |
| 09/15/1992 | US5147084 Interconnection structure and test method |
| 09/15/1992 | US5147081 Flat pack desoldering tool |
| 09/15/1992 | US5146674 Manufacturing process of a high density substrate design |
| 09/15/1992 | CA2061985A1 Laminates containing addition-curable silicone adhesive compositions |
| 09/15/1992 | CA1307594C Multilayer electronic circuit and method of manufacture |
| 09/15/1992 | CA1307565C Composite electrical interconnection medium comprising a conductive network,and article, assembly, and method |
| 09/10/1992 | DE4107620A1 Elektrisches geraet, insbesondere schalt- oder steuergeraet fuer kraftfahrzeuge Geraet Electrical, particularly switchable or Steuergeraet for motor vehicles |
| 09/10/1992 | DE4107312A1 Mounting system for power semiconductor device - has heat conductive coupling between heat conductive layer beneath semiconductor device and insulating layer supporting circuit board |
| 09/09/1992 | EP0502819A1 Acid hardenable copolymers |
| 09/09/1992 | EP0502804A2 Structures for electrically conductive decals filled with organic insulator material |
| 09/09/1992 | EP0502614A2 Thin film circuit substrate and processes for its manufacture |
| 09/09/1992 | EP0502382A1 Light-sensitive composition and process |
| 09/09/1992 | EP0502023A1 Metallization of non-conductors |
| 09/09/1992 | EP0465593A4 Process and composition for forming black oxide layers |
| 09/09/1992 | EP0307412B1 Solder leveller |
| 09/08/1992 | WO1992015845A1 Method and apparatus for forming contacts |
| 09/08/1992 | US5146509 Method of inspecting defects in circuit pattern and system for carrying out the method |
| 09/08/1992 | US5146313 Metallized ceramic structure comprising aluminum nitride and tungsten layers |
| 09/08/1992 | US5145760 Positive-working photosensitive electrostatic master with improved invironmental latitude |
| 09/08/1992 | US5145741 Directing focused energy beam to delineate, controlled oxidation and decomposition, high speed solidification |
| 09/08/1992 | US5145722 Method and composition for protecting and enhancing the solderability of metallic surfaces |
| 09/08/1992 | US5145717 Stripping method for removing resist from a printed circuit board |
| 09/08/1992 | US5145715 Light transmission paste and metallic copper deposition method using same |
| 09/08/1992 | US5145714 Copper deposition |
| 09/08/1992 | US5145691 Apparatus for packing filler into through-holes or the like in a printed circuit board |
| 09/08/1992 | US5145598 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane, dichlorotrifluorethane, nitromethane and methanol or ethanol |
| 09/08/1992 | US5145572 Process for manufacturing through-hole contacting plated printed circuit |
| 09/08/1992 | US5145553 Method of making a flexible circuit member |
| 09/08/1992 | US5145551 High accuracy, high flexibility energy beam machining system |
| 09/08/1992 | US5145547 Apparatus for self-induced repair of circuit short and near-shorts |
| 09/08/1992 | US5145540 Finely dispersed, sinterable alumina, silica, magnesia, and glass; multilayer housings for microelectronics |