| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/25/1992 | US5091251 Adhesive tapes and semiconductor devices |
| 02/25/1992 | US5091218 Method for producing a metallized pattern on a substrate |
| 02/25/1992 | US5091212 Applying electrode paste to selected portions of electronic surface through slit of specified width |
| 02/25/1992 | US5090926 Solderable lead |
| 02/25/1992 | US5090919 Terminal piece sealing structure |
| 02/25/1992 | US5090918 Isothermal termination block having a multi-layer thermal conductor |
| 02/25/1992 | US5090847 Pressure foot for microwave drill detection system |
| 02/25/1992 | US5090609 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
| 02/25/1992 | US5090362 Arrangement for galvanization of treatment goods in a series of baths |
| 02/25/1992 | US5090284 Mechanisms for driving punch pins in punching apparatus |
| 02/25/1992 | US5090122 Method for manufacturing a three-dimensional circuit substrate |
| 02/25/1992 | US5090121 Apparatus and method for fabricating cirucit pattern on conductive surface of circuit board |
| 02/25/1992 | US5090120 Process for forming solder lands in a printed wiring board manufacturing method |
| 02/25/1992 | US5090116 Method of assembling a connector to a circuit element and soldering lead frame for use therein |
| 02/25/1992 | CA1296288C Method for selective chemical plating |
| 02/24/1992 | CA2049660A1 Electroless plating of materials having electrophilic polarity |
| 02/23/1992 | WO1992003205A1 Method and device for cleaning |
| 02/23/1992 | CA2066753A1 Cleaning method and cleaning apparatus |
| 02/20/1992 | WO1992003034A1 Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
| 02/20/1992 | WO1992003029A1 Device for heat treatment of substrate |
| 02/20/1992 | WO1992002953A1 Molded integrated circuit package |
| 02/20/1992 | WO1992002377A1 Composition and process for promoting adhesion on metal surfaces |
| 02/20/1992 | DE4026233A1 Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung Circuit board with electrical components, in particular in SMD version |
| 02/20/1992 | DE4024908A1 Prodn. of resist patterns on substrates, esp. drilled substrates - by laminating substrate with a solid resist, removing the protective film, applying a liq. resist, exposing with a mask, and developing |
| 02/19/1992 | EP0471577A1 Horizontal carrying type electroplating apparatus |
| 02/19/1992 | EP0471471A1 Package enclosing semiconductor devices |
| 02/19/1992 | EP0471386A2 Process for the preparation of conductive patterns on thermoplastic polymer base substrates |
| 02/19/1992 | EP0471326A1 Positive type photoresist composition |
| 02/19/1992 | EP0471219A2 Surface mount electrical connector and method of making the same |
| 02/19/1992 | EP0471196A2 Image analysis method |
| 02/19/1992 | EP0471149A2 Method for the manufacture of electrical membrane panels having circuits on flexible plastic films |
| 02/19/1992 | EP0471148A2 Device for disconnecting and/or connecting of bus lines at a computer and circuit for a multiuser/multitask system with graphic capability |
| 02/19/1992 | EP0471034A1 Twisted wire jumper electrical interconnector |
| 02/19/1992 | CN1015582B Carrier substrate and method for preparing same |
| 02/19/1992 | CN1015554B Dissolution of metals utilizing tungsten-diol complexes 2 |
| 02/18/1992 | WO1992003846A1 Anodized aluminum electronic package components |
| 02/18/1992 | US5089881 Fine-pitch chip carrier |
| 02/18/1992 | US5089877 Electrical power to a circuit device |
| 02/18/1992 | US5089750 Lead connection structure |
| 02/18/1992 | US5089593 Polyimide containing 4,4'-bis(4-amino-2-trifluoromethylphenoxy)-biphenyl moieties |
| 02/18/1992 | US5089440 Solder interconnection structure and process for making |
| 02/18/1992 | US5089356 Joints resistant to thermal fatigue |
| 02/18/1992 | US5089355 Metal layer subjected to compression plastic deformation; dimensional stability |
| 02/18/1992 | US5089346 Heat resistant adhesive composition and bonding method using the same |
| 02/18/1992 | US5089314 Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
| 02/18/1992 | US5089071 Process for producing a multilayered ceramic structure using an adhesive film |
| 02/18/1992 | US5088639 Soldering process |
| 02/18/1992 | US5088189 Electronic manufacturing process |
| 02/18/1992 | CA2088165A1 Anodized aluminum electronic package components |
| 02/18/1992 | CA2049372A1 Flexible electrical interconnect |
| 02/18/1992 | CA1296107C Heater bar assembly |
| 02/18/1992 | CA1296083C Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate |
| 02/15/1992 | CA2048158A1 Cleaning composition with 1,1-dichloro-1-fluoroethane, methylene chloride and methanol |
| 02/14/1992 | WO1992003252A1 Solder fluxes bearing oxide removers generated by light |
| 02/12/1992 | EP0470839A2 Ceramic substrate having wiring incorporating silver |
| 02/12/1992 | EP0470757A2 Method of drilling of through-holes in printed circuit board panels |
| 02/12/1992 | EP0470740A2 Rigid-flexible printed circuit and process of forming such a circuit |
| 02/12/1992 | EP0470584A2 Continuous production of metal clad laminates |
| 02/12/1992 | EP0470425A1 Method and device for controlling the working depth for a numerically controlled machine tool |
| 02/12/1992 | EP0470404A1 Multipolar plug fixture |
| 02/12/1992 | EP0470318A2 Resonant tag and method of manufacturing the same |
| 02/12/1992 | EP0470262A1 Copper alloy composition |
| 02/12/1992 | EP0470232A1 Three dimensional plating or etching process and masks therefor |
| 02/11/1992 | US5088008 Circuit board for mounting electronic components |
| 02/11/1992 | US5088007 Compliant solder interconnection |
| 02/11/1992 | US5087658 Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste |
| 02/11/1992 | US5087509 Substrate used for fabrication of thick film circuit |
| 02/11/1992 | US5087497 Electric circuit substrate |
| 02/11/1992 | US5087495 Assembly for use in a process for making selective transfers to xerographic images on sheet material |
| 02/11/1992 | US5087494 Electrically conductive adhesive tape |
| 02/11/1992 | US5087413 Conducting material and a method of fabricating thereof |
| 02/11/1992 | US5087396 Directing laser beam at high melting nonmetallic inorganic powder and lower vaporizing binder; controling power density; vacuum removal of loosened powder |
| 02/11/1992 | US5087383 Novel azeotropic or azeotrope-like mixture of 2,2,2-trifluoroethyl 1,1,2,2-tetrafluoroethyl ether and ethanol, and its use |
| 02/11/1992 | US5087314 Electroconductive adhesive |
| 02/11/1992 | US5087156 Printed circuit board boring machine |
| 02/11/1992 | US5086967 Solder connection device |
| 02/11/1992 | US5086966 Palladium-coated solder ball |
| 02/11/1992 | CA1295761C Photopolymerizable compositions containing inorganic fillers |
| 02/11/1992 | CA1295461C Method of mounting refined contact surfaces on a substrate, and substrate provided with such contact surfaces |
| 02/10/1992 | WO1992002666A1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane; ethanol; and nitromethane |
| 02/10/1992 | CA2087847A1 Azeotrope-like compositions of 1,1-dichloro-1-fluroethane; ethanol; and nitromethane |
| 02/07/1992 | CA2045987A1 Continuous production of metal clad laminates |
| 02/06/1992 | WO1992002039A1 Improved interconnection structure and test method |
| 02/06/1992 | WO1992002034A1 High accuracy, high flexibility energy beam machining system |
| 02/05/1992 | EP0470031A2 Circuit board EMI suppressor |
| 02/05/1992 | EP0469973A1 Method for forming relief patterns |
| 02/05/1992 | EP0469957A1 Resin composition for image formation |
| 02/05/1992 | EP0469920A1 Method of manufacturing insulated substrate for semiconductor devices and patterned metal plate used therefor |
| 02/05/1992 | EP0469848A2 Attaching integrated circuits to circuit boards |
| 02/05/1992 | EP0469788A2 Method and apparatus for reflow-soldering of print circuit boards |
| 02/05/1992 | EP0469703A2 Multilayer printed circuits and process for their fabrication |
| 02/05/1992 | EP0469635A1 Method of making circuit boards |
| 02/05/1992 | EP0469537A2 Photoimageable electrodepositable photoresist composition |
| 02/05/1992 | EP0469470A1 Process for producing multilayered printed board |
| 02/05/1992 | EP0469456A1 Process for producing copper-clad laminate |
| 02/05/1992 | EP0469308A1 Multilayered circuit board assembly and method of making same |
| 02/05/1992 | CN1058431A Electrophoretic deposition process for photosensitive polymer composition |
| 02/04/1992 | US5086478 Finding fiducials on printed circuit boards to sub pixel accuracy |
| 02/04/1992 | US5086371 Printed circuit board assembly handle/stiffener |
| 02/04/1992 | US5086337 Connecting structure of electronic part and electronic device using the structure |