Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1991
11/02/1991CA2040989A1 Washing/drying method and apparatus
11/02/1991CA2031422A1 Method for improving metal adhesion to polyimide surfaces
10/1991
10/31/1991WO1991016806A1 Process for applying a protective plastic film, and a device for carrying out the process
10/31/1991WO1991016805A1 Ceramic circuit board
10/31/1991WO1991016740A1 Intermediary adapter-connector
10/31/1991WO1991016736A1 Solder-bearing lead
10/31/1991WO1991016726A1 Multilayer circuit board for mounting ic and manufacture thereof
10/31/1991WO1991016725A1 Multilayer thin film wiring process featuring self-alignment of vias
10/31/1991WO1991016475A1 Improved process for preparing a nonconductive substrate for electroplating
10/31/1991WO1991016148A1 Process for applying a composite insulative coating to a substrate
10/31/1991DE4013569A1 Electrical component soldering - has soldering sections at component connections placed on connecting services of circuit board to be melted by a laser
10/31/1991DE4013456A1 Temperatur- und loesemittelbestaendige tinte fuer das strahldruckverfahren Jet printing process temperature and loesemittelbestaendige ink for the
10/31/1991CA2041545A1 Copolyimide film with improved properties
10/30/1991EP0454334A2 Photoresist composition
10/30/1991EP0454167A2 Laminated electrostatic printhead
10/30/1991EP0454109A1 New azeotropic or azeotrope-like mixture of 2,2,2-trifluoroethyl-1,1,2,2-tetrafluoroethylether and ethanol, and its use
10/30/1991EP0453858A1 Process for brazing metallized components to ceramic substrates
10/30/1991EP0453786A2 Convection transfer system
10/30/1991EP0453785A1 Method of making multilayer thin film circuit comprising integrated thin film resistors
10/30/1991EP0453633A1 Plated metal sheet provided with a plurality of plating layers, excellent in strippability and having a high hardness
10/30/1991EP0453629A1 Composite nickel-phosphorus alloy plated metal sheet excellent in strippability and having high hardness and method for manufacturing same
10/30/1991EP0453559A1 Method for manufacturing a soldered article.
10/30/1991EP0453499A1 Assembly of electrically interconnected articles
10/30/1991EP0453483A1 Non-toxic, non-flammable cleaner for printed board cleaning.
10/30/1991CN1055838A Miniature multiple conductor electrical connector
10/30/1991CN1055825A Positive-working photosonsitive electrostatic master
10/29/1991US5062149 Millimeter wave device and method of making
10/29/1991US5062054 Layout pattern generation and geometric processing system for LSI circuits
10/29/1991US5061990 Semiconductor device and the manufacture thereof
10/29/1991US5061830 Extension electrical switch system and method of manufacture
10/29/1991US5061824 Backpanel having multiple logic family signal layers
10/29/1991US5061822 Radial solution to chip carrier pitch deviation
10/29/1991US5061779 Liquid epoxy polymer composition and use thereof based on cycloaliphatic amine cured difunctional/polyfunctional resin blends
10/29/1991US5061776 Printed circuits
10/29/1991US5061744 Resist ink composition
10/29/1991US5061657 Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer
10/29/1991US5061552 Multi-layer ceramic substrate assembly and a process for manufacturing same
10/29/1991US5061551 UV-cured ink of a cycloaliphatic epoxy resin containing silver-coated magnetite having been positioned by magnetic waves to increase conductivity
10/29/1991US5061550 Multilayer material having a resistance layer formed on an electrically conductive layer and a multilayer board for a printed circuit board which has a resistance layer
10/29/1991US5061549 Heat activated to bond printed circuit to support; of a thermoplastic resin and a thermoconductive inorganic particulate filler
10/29/1991US5061548 Silane coating; hydrophobic, improved tensile and peel strength, dimensional stability
10/29/1991US5061547 Structure of conductive layers in multilayer substrates for minimizing blisters and delaminations
10/29/1991US5061438 Method of making a printed circuit board
10/29/1991US5061359 Plasma processing apparatus including three bus structures
10/29/1991US5061192 High density connector
10/29/1991US5061189 Lamp socket for use with a printed circuit board
10/29/1991US5060846 Integrated load compensation device
10/29/1991US5060844 Interconnection structure and test method
10/29/1991US5060595 Via filling by selective laser chemical vapor deposition
10/29/1991US5060370 Modification method for etched printed circuit boards
10/29/1991US5060369 Printed wiring board construction
10/29/1991CA2040015A1 Applying apparatus
10/29/1991CA1291588C No thermal cure dry film solder mask
10/27/1991CA2031015A1 Registration of artwork panels in the manufacture of printed circuit boards
10/27/1991CA2028073A1 Composite nickel-phosphorus alloy plated metal sheet excellent in strippability and having high hardness and method for manufacturing same
10/26/1991CA2015499A1 Method and apparatus for loading pins for circuit boards
10/24/1991DE4013256C1 Solder paste for sticking electrical components on substrates - comprises mixt. of silver powder and low melting glass powder
10/24/1991DE4012903A1 Verfahren zum aufbringen einer kunststoffschutzschicht sowie vorrichtung zur durchfuehrung des verfahrens A method for muster a plastic protective layer and device for implementing the method
10/23/1991EP0453307A2 Photocurable self-retainable gel, shaped article prepared therefrom, applications and preparations thereof
10/23/1991EP0453269A1 Improvements in or relating to the movement of spray guns
10/23/1991EP0453237A2 Photosensitive, heat-resistant resin composition and pattern formation process
10/23/1991EP0453235A2 Photosensitive resin composition and method of forming conductive pattern
10/23/1991EP0453147A1 Testing electronic components
10/23/1991EP0453046A1 Connecting element
10/23/1991EP0453023A1 Flexible circuit board and method for contacting at least one contact surface with the circuit board
10/23/1991EP0452812A2 Resistive laminate for printed circuit boards
10/23/1991EP0452657A1 Fluid pressure actuated electrical connector
10/23/1991EP0452641A1 Plug-in fixing element for printed circuit boards
10/23/1991EP0452553A2 IC memory card
10/23/1991EP0452552A2 Film peeling method and apparatus for practicing same
10/23/1991EP0452506A1 METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's
10/23/1991CN1014481B Heat-pressing inlaying method for making printed circuit board
10/22/1991US5060288 Infrared heater array for IC soldering
10/22/1991US5060276 Technique for object orientation detection using a feed-forward neural network
10/22/1991US5060117 Tape of connections for assembly-line mounting of surface-mounted components
10/22/1991US5060114 Conformable pad with thermally conductive additive for heat dissipation
10/22/1991US5060049 Multiple resistivity wiring apparatus
10/22/1991US5059756 Self regulating temperature heater with thermally conductive extensions
10/22/1991US5059728 Solvents; industrial cleaning applications
10/22/1991US5059635 Methods for reducing the reactivity of articles destined for disposal
10/22/1991US5059485 Depositing copper and/or nickel on a substrate, heating and pressing
10/22/1991US5059454 Method for making patterned thin film
10/22/1991US5059450 Addition of oxygen exclusively in the polymer eliminating zone to avoid oxidation of the metal
10/22/1991US5059449 Method of selectively providing a metal from the liquid phase on a substrate by means of a laser
10/22/1991US5059272 Method for the manufacture of electronic circuits utilizing a composition with insulating and electroconductive properties
10/22/1991US5059262 Squirting fine metal steands onto substrate
10/22/1991US5059242 Adhesion promoter conductor tracks of printed circuits
10/22/1991US5058800 Method of making electric circuit device
10/22/1991US5058799 Metallized ceramic substrate and method therefor
10/22/1991US5058796 Apparatus for fastening electronic components to substrates
10/22/1991CA1291274C Wire/disk board-to-board interconnect device
10/22/1991CA1291273C Lyotropic liquid crystalline oriented polymer substrate for printed wire board
10/20/1991CA2040619A1 Photocurable self-retainable gel, shaped article prepared therefrom, applications and preparations thereof
10/19/1991WO1991016737A1 Miniature multiple conductor electrical connector
10/19/1991CA2078864A1 Miniature multiple conductor electrical connector
10/19/1991CA2040692A1 Connecting element
10/17/1991WO1991015937A1 A multi-layer printed circuit board and a method for assuring assembly in a selected order
10/17/1991WO1991015808A1 Resist material for use in thick film resists
10/17/1991DE4012217A1 Push-in connector for circuit boards
10/17/1991DE4012061A1 Solvent-free, isotropic adhesive and conductive paste - comprises cycloaliphatic epoxide¨ resin and mixt. of two types of electrically conductive particles differing in size and shape
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