| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/09/1992 | US5121297 Flexible printed circuits |
| 06/09/1992 | US5120678 Infiltrating gap between component and substrate with polymer-precursor liquid, curing to solidy and protect |
| 06/09/1992 | US5120665 Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits |
| 06/09/1992 | US5120633 Polymers with acid-labile ester/ether pendant groups and acid-generating photoinitiators; positives; printed circuits; resolution |
| 06/09/1992 | US5120629 Positive-working photosensitive electrostatic master |
| 06/09/1992 | US5120591 Conductive pattern board and method for producing the same |
| 06/09/1992 | US5120590 Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing |
| 06/09/1992 | US5120578 Coating composition |
| 06/09/1992 | US5120572 Integrated resistors and capacitors |
| 06/09/1992 | US5120462 Solvent cleaning mixtures for printed circuits with soldering flux |
| 06/09/1992 | US5120386 Film sticking method and apparatus |
| 06/09/1992 | US5120384 Method of manufacturing multilayer laminate |
| 06/09/1992 | US5120371 Process of cleaning soldering flux and/or adhesive tape with terpenet and monobasic ester |
| 06/09/1992 | US5120370 Cleaning process |
| 06/09/1992 | US5120339 Method for fabricating a low thermal expansion coefficient glass fiber-reinforced polymer matrix composite substrate and composite substrate |
| 06/09/1992 | US5120257 Lanced hold-downs |
| 06/09/1992 | US5119990 High pressure fluid processing device |
| 06/09/1992 | US5119759 Apparatus for solder nozzle height sensing |
| 06/09/1992 | CA1303243C Method for manufacturing metal core printed circuit boards |
| 06/09/1992 | CA1303240C Printed-wiring board |
| 06/09/1992 | CA1303235C Three-dimensional printed circuit board |
| 06/09/1992 | CA1303166C Solder post retention means |
| 06/09/1992 | CA1302947C Copper-chromium-polyimide composite |
| 06/09/1992 | CA1302851C Textured polyimide film |
| 06/04/1992 | DE4042593A1 Aq. cleaning compsn. free from chloro:fluorohydrocarbon |
| 06/03/1992 | EP0488705A1 Laminate film having a thermocurable resin layer |
| 06/03/1992 | EP0488703A1 Electrodeposition process and device |
| 06/03/1992 | EP0488581A2 Flexible welding board for battery pack |
| 06/03/1992 | EP0488574A2 Personal data card construction |
| 06/03/1992 | EP0488555A2 Compositions and processes for use in the fabrication of printed circuits |
| 06/03/1992 | EP0488535A2 Method and apparatus for manufacturing electrodes for multilayer ceramic capacitors |
| 06/03/1992 | EP0488525A1 Alkoxyalkyl ester solubility inhibitors for phenolic resins |
| 06/03/1992 | EP0488468A2 Device for removing a peduncle from a printed circuit board |
| 06/03/1992 | EP0488339A1 Flame-resistant photo-curable resin composition |
| 06/03/1992 | EP0488299A1 Method of manufacturing a multi-layered wiring board |
| 06/03/1992 | EP0488298A2 Connector with equal lateral force contact spacer plate |
| 06/03/1992 | EP0488206A2 Method of and apparatus for inspecting pattern on printed board |
| 06/03/1992 | EP0488091A2 Plastic-packaged semiconductor device and method of forming the same |
| 06/03/1992 | EP0488066A1 Chemically etchable adhesives |
| 06/03/1992 | EP0488062A1 Laminates utilizing chemically etchable adhesives |
| 06/03/1992 | EP0488031A2 Method of and apparatus for inspecting a printed circuit board |
| 06/03/1992 | EP0487954A2 Method of and apparatus for inspecting line width on printed board |
| 06/03/1992 | EP0487950A1 Multilayer circuit board using the micro wiring technology |
| 06/03/1992 | EP0487866A2 Electrical connector assembly for mounting on a printed circuit board |
| 06/03/1992 | EP0487857A2 Enhancement of polyimide adhesion on reactive metals |
| 06/03/1992 | EP0487854A2 Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
| 06/03/1992 | EP0487782A1 Method of soldering circuit boards |
| 06/03/1992 | EP0487640A1 Capacitor laminate for printed circuit board. |
| 06/03/1992 | EP0313580B1 Radiation curable temporary solder mask |
| 06/03/1992 | CN1061585A Method for reducing shrinkage during firing of ceramic bodies |
| 06/02/1992 | USRE33947 Expansion laser beam; focusing; forming grooves |
| 06/02/1992 | US5119272 Circuit board and method of producing circuit board |
| 06/02/1992 | US5119240 Assembly of parts forming an angle between them and process for obtaining said assembly |
| 06/02/1992 | US5119173 Method of making integrated circuit to package connections |
| 06/02/1992 | US5119127 Photoresist exposure method and apparatus therefor |
| 06/02/1992 | US5119070 Resonant tag |
| 06/02/1992 | US5118584 Method of producing microbump circuits for flip chip mounting |
| 06/02/1992 | US5118556 Film material for film carrier manufacture and a method for manufacturing film carrier |
| 06/02/1992 | US5118458 Method for molding an article integrated with a multi-layer flexible circuit and an apparatus for carrying out the method |
| 06/02/1992 | US5118386 Covering;, electroplating; etching; controlling height and diameter |
| 06/02/1992 | US5118385 Multilayer electrical interconnect fabrication with few process steps |
| 06/02/1992 | US5118359 Method of cleaning using partially fluorinated alkanes having a tertiary structure as solvent |
| 06/02/1992 | US5118299 Cone electrical contact |
| 06/02/1992 | US5118298 Through hole mounting of integrated circuit adapter leads |
| 06/02/1992 | US5118029 Paste of lead salt of an organic acid and tin powder |
| 06/02/1992 | US5118027 Method of aligning and mounting solder balls to a substrate |
| 06/02/1992 | US5117554 Tab routing method and apparatus |
| 06/02/1992 | CA1302588C Printed circuit board for mounting in a backplane |
| 06/02/1992 | CA1302536C Flexible circuit and connector |
| 06/02/1992 | CA1302156C Screen printing machine |
| 05/31/1992 | CA2056640A1 Flame-resistant photo-curable resin composition |
| 05/31/1992 | CA2056594A1 Laminate film having a thermocurable resin layer |
| 05/30/1992 | CA2052989A1 Compositions and processes for use in the fabrication of printed circuits |
| 05/29/1992 | WO1992009186A1 Process for the production of copper-coated substrates |
| 05/29/1992 | WO1992009102A1 A method of making a multilayer thin film structure |
| 05/29/1992 | WO1992008940A1 Ovens for treating lamellae |
| 05/29/1992 | WO1992008554A1 An apparatus for cleaning workshop products |
| 05/29/1992 | CA2056037A1 Electrodeposition process and device |
| 05/28/1992 | CA2056218A1 Method of preparing a printed substrate |
| 05/28/1992 | CA2056184A1 Device for removing a peduncle from a printed circuit board |
| 05/27/1992 | EP0487338A1 A thin film conductive device and method of manufacture thereof |
| 05/27/1992 | EP0487315A2 Method and apparatus for electronic component mounting |
| 05/27/1992 | EP0487011A1 Process and apparatus for the electrolytic treatment of platelike articles |
| 05/27/1992 | EP0486845A2 Electrical connector with solder mask |
| 05/27/1992 | EP0486811A2 Procedure for producing in series components and composite materials for its execution |
| 05/27/1992 | EP0486685A1 Use of organic acids in low residue solder pastes |
| 05/27/1992 | DE4132330A1 Electroplating surface of polycarbonate modified with ABS - has surface conditioned by contacting with halogenated organic cpd. in aq. medium before etching with acid and plating |
| 05/27/1992 | DE4037428A1 Solderless connector for multi-chip modules and standard boards - has tapered holes in flat frame for self-securing spring providing contacts between substrate and board |
| 05/27/1992 | CA2055919A1 Chemically etchable adhesives |
| 05/27/1992 | CA2055878A1 Laminates utilizing chemically etchable adhesives |
| 05/26/1992 | US5117330 Fixture for circuit components |
| 05/26/1992 | US5117300 Electrical circuit device with different types of conductor paths |
| 05/26/1992 | US5117282 Stacked configuration for integrated circuit devices |
| 05/26/1992 | US5117275 Electronic substrate multiple location conductor attachment technology |
| 05/26/1992 | US5117069 Circuit board fabrication |
| 05/26/1992 | US5117068 Surface mount package for R.F. devices |
| 05/26/1992 | US5116718 Contact printing process |
| 05/26/1992 | US5116700 Connected terminal pieces with planar base portion bonded to respective terminal and planar top end portion twisted perpendicular to base portion, each base facing in parallel with other base, top being outside element's outer perimeter |
| 05/26/1992 | US5116670 Composed of polybasic acid and polyhydric alcohol; ester bonded to one terminal; electronics |
| 05/26/1992 | US5116657 Spheroid copper and copper oxide particles coated with organic titanium compound; printed circuit substrates |