| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/14/1992 | US5080722 Method for cleaning electrical connectors |
| 01/14/1992 | US5080539 Tracer for router head |
| 01/14/1992 | US5080455 Ion beam sputter processing |
| 01/14/1992 | US5080279 Method for tape automated bonding |
| 01/14/1992 | US5080036 Thick film drawing apparatus |
| 01/14/1992 | CA1294375C Self regulating temperature heater as an integral part of a printed circuit board |
| 01/14/1992 | CA1294374C Braided electrical connector |
| 01/14/1992 | CA1294238C Selective electrolytic removal of metal coating from base metal with alkanesulfonic acid solution |
| 01/14/1992 | CA1294201C Thin film adhering method and thin film adhering apparatus |
| 01/14/1992 | CA1294117C Method of making deactivatable tags |
| 01/09/1992 | WO1992000611A1 SYNTHESIS OF HIGH Tc SUPERCONDUCTING COATINGS AND PATTERNS BY MELT WRITING AND OXIDATION OF METALLIC PRECURSOR ALLOYS |
| 01/09/1992 | WO1992000552A1 Image-forming process |
| 01/09/1992 | WO1992000405A1 Rinsing of copper foil after anti-tarnish treatment |
| 01/09/1992 | WO1992000404A1 Process for preparing nonconductive substrates |
| 01/09/1992 | DE4021581A1 Verfahren zur bewegung eines bohrungen aufweisenden gutes bei dessen nasschemischer behandlung, zb galvanisierung, sowie vorrichtung zur durchfuehrung des verfahrens A method of motion of holes having good when it is wet chemical treatment, eg electroplating, and apparatus for performing the method |
| 01/09/1992 | DE4020215A1 Screen printing device for circuit board - conveys board between two vertical facing printers which simultaneously print both sides |
| 01/09/1992 | DE4019509A1 Mounting housing holding electronic components - has projections from base serving to resist shock when container is placed on PCB |
| 01/09/1992 | CA2086512A1 Rinsing of copper foil after anti-tarnish treatment |
| 01/08/1992 | EP0465233A2 Vision inspection systems |
| 01/08/1992 | EP0465199A1 Multiple lamination high density interconnect process and structure |
| 01/08/1992 | EP0465197A2 Multi-sublayer dielectric layers |
| 01/08/1992 | EP0465195A2 Multiple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing Tg's |
| 01/08/1992 | EP0465138A2 Interconnection of electronic components |
| 01/08/1992 | EP0465037A1 Solvent composition |
| 01/08/1992 | EP0464926A2 Process and disposition for assembling printed circuit boards |
| 01/08/1992 | EP0464842A2 An electronic component comprising a dielectric and a method for manufacturing the same |
| 01/08/1992 | EP0464652A1 Agent and method for removing rosin-base solder flux |
| 01/08/1992 | EP0464643A2 Process for improving the surface of liquid crystal polymers |
| 01/08/1992 | EP0464507A2 Method and apparatus for the continuous manufacture of planar, resin containing laminates |
| 01/08/1992 | EP0464238A1 Method and apparatus for patch coating printed circuit boards |
| 01/08/1992 | EP0464232A1 Solder connector and process for making an electrical circuit with this solder connector |
| 01/08/1992 | EP0464224A1 Method of and material for forming thick filmy pattern |
| 01/08/1992 | EP0464199A1 Electrically conductive pressure sensitive adhesive. |
| 01/08/1992 | EP0464144A1 A multilayer film and laminate for use in producing printed circuit boards. |
| 01/08/1992 | EP0464074A1 Plug contact arrangement |
| 01/08/1992 | CN2092849U Supporting board for the use of printing dual face of circuit board |
| 01/07/1992 | WO1992001088A1 Process for moving an item with drillings during its wet chemical treatment, e.g. galvanisation, and device for implementing the process |
| 01/07/1992 | US5079673 Ic card module |
| 01/07/1992 | US5079600 Metal plating paths on solid substrate |
| 01/07/1992 | US5079430 Ultraviolet radiation projector and optical image forming apparatus |
| 01/07/1992 | US5079193 Encapsulant composition |
| 01/07/1992 | US5079070 Diffusion bonding from support sheet |
| 01/07/1992 | US5079069 Multilayer |
| 01/07/1992 | US5079065 Multilayer; sheet containing holes impregnated with resin; electroconductive circuit |
| 01/07/1992 | US5079040 Process for electrolessly depositing nickel |
| 01/07/1992 | US5078831 Method of making multilayer printed wiring board |
| 01/07/1992 | US5078612 Electrical contacts |
| 01/07/1992 | US5078558 Low mass spindle and Z-axis unit |
| 01/07/1992 | US5078474 Exposure apparatus having a magnifying lens system |
| 01/07/1992 | US5078082 Method and apparatus for applying bonding material to a populated mounting surface |
| 01/07/1992 | US5078063 Precision mechanical squeegee holding assembly |
| 01/07/1992 | US5077891 Isolation the break; extrusion of electroconductive resin |
| 01/07/1992 | CA2086762A1 Process for moving an item with drillings during its wet chemical treatment e.g. galvanisation, and device for implementing the process |
| 01/07/1992 | CA1294060C Pull-raising member and pull-raising unit for peeling thin-film |
| 01/06/1992 | WO1992001086A1 Etching solution |
| 01/02/1992 | EP0463872A2 Method of manufacturing circuit board and circuit board itself manufactured by said method |
| 01/02/1992 | EP0463788A2 Method for tape automated bonding |
| 01/02/1992 | EP0463769A2 Binder system based on thermally depolymerisable polycarbonate |
| 01/02/1992 | EP0463693A2 Apparatus and system for punching printed circuit boards |
| 01/02/1992 | EP0463559A2 Packaged semiconductor device and a manufacturing process therefor |
| 01/02/1992 | EP0463297A1 Arrangement comprising substrate and component and method of making the same |
| 01/02/1992 | EP0463105A1 High capacitance laminates. |
| 01/02/1992 | EP0463098A1 A fluxless soldering process. |
| 01/02/1992 | EP0380639A4 High dielectric constant flexible sheet material |
| 01/02/1992 | DE4120417A1 Photosensitive electron-pptn. coating mass - obtd. using photosensitive cpd. contg. quinone di:azide sulphonic acid units and water-soluble or -dispersible resin |
| 01/01/1992 | CN1057562A Keyboard type complex printed-circuit board and manufacturing thereof |
| 12/31/1991 | USRE33780 Components feeding apparatus |
| 12/31/1991 | US5077639 Circuit plate for the optimal decoupling of circuits with digital ic's |
| 12/31/1991 | US5077632 Ceramic, circuit substrate and electronic circuit substrate by use thereof and process for producing ceramic |
| 12/31/1991 | US5077176 Depositing photoresist layer, developing, sprayed with clearee r, etching solution and anti-tarnishing solution |
| 12/31/1991 | US5077136 Ammoniation of polyimide surface |
| 12/31/1991 | US5077115 Matrix; ceramic filler coated with rubbery polymer that bonds to the filler; thin film bonding poly; multilayer printed wiring boards |
| 12/31/1991 | US5077100 Coating with alloyable metal, exposing to tungsten-bearing gas and irradiating |
| 12/31/1991 | US5077099 Electroless copper plating process and apparatus |
| 12/31/1991 | US5077085 High resolution metal patterning of ultra-thin films on solid substrates |
| 12/31/1991 | US5077084 Process for producing a flexible printed base |
| 12/31/1991 | US5077083 Epoxy-silanol functional UV curable polymers |
| 12/31/1991 | US5076885 Using copper tetramine complex |
| 12/31/1991 | US5076864 Oxidizing copper surface to darken, treating with acidic auueous solution of reducing agent |
| 12/31/1991 | US5076841 Polymer solution with hydrous oxide of a metal dispersed therein |
| 12/31/1991 | US5076804 Electrical connector assembly for mounting on a printed circuit board |
| 12/31/1991 | US5076796 Terminal pin for soldering to a printed circuit board |
| 12/31/1991 | US5076486 Barrier disk |
| 12/31/1991 | US5076485 Bonding electrical leads to pads with particles |
| 12/31/1991 | US5075965 Low temperature controlled collapse chip attach process |
| 12/31/1991 | CA1293822C Method for applying flux to a substrate |
| 12/31/1991 | CA1293783C Near-linear spring connect structure for flexible interconnect circuits |
| 12/31/1991 | CA1293759C Snap on fuse cover |
| 12/31/1991 | CA1293653C Nozzle device |
| 12/31/1991 | CA1293605C Process for treating reinforced polymer composite |
| 12/30/1991 | WO1992000263A1 Partially fluorinated alkanes having a tertiary structure |
| 12/30/1991 | CA2085222A1 Partially fluorinated alkanes having a tertiary structure |
| 12/27/1991 | EP0462943A1 Method of copper plating |
| 12/27/1991 | EP0462550A2 Stripping method for removing resist from a printed circuit board |
| 12/27/1991 | EP0462384A1 Holder for maniature incandescent lamp |
| 12/27/1991 | EP0462301A1 A solder leveler |
| 12/27/1991 | EP0462266A1 Method for manufacturing flexible printed circuits, printed circuit thereby manufactured, and device for implementing the method. |
| 12/27/1991 | EP0428695A4 Improved three-dimensional circuit component assembly and method corresponding thereto |
| 12/27/1991 | EP0417294A4 Method and device for making integrated circuits |
| 12/27/1991 | EP0380634A4 Method of laser drilling fluoropolymer materials |