| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/30/1992 | US5126818 Semiconductor device |
| 06/30/1992 | US5126751 Flush mount antenna |
| 06/30/1992 | US5126532 Apparatus and method of boring using laser |
| 06/30/1992 | US5126504 Easily strippable |
| 06/30/1992 | US5126192 Flame retardant, low dielectric constant microsphere filled laminate |
| 06/30/1992 | US5126030 Magnet coil between evaporation source and substrate; vapor deposition of hard, smooth films |
| 06/30/1992 | US5126016 Oxidation to soluble trivalent chromium |
| 06/30/1992 | US5125999 Thin film bonding method employing a structure for removing wetting agents |
| 06/30/1992 | US5125560 Method of soldering including removal of flux residue |
| 06/30/1992 | US5125557 Ceramics bonded product and method of producing the same |
| 06/28/1992 | CA2058382A1 Process and device for tinning the tinnable parts of an electronic component enclosure |
| 06/28/1992 | CA2058321A1 Process for treating surfaces |
| 06/25/1992 | WO1992011113A1 Direct bonding of copper to aluminum nitride substrates |
| 06/25/1992 | WO1992010925A1 Electrical device, in particular a switching and control device for motor vehicles |
| 06/25/1992 | WO1992010924A1 Process for producing through hole plated or multilayer printed circuit boards |
| 06/25/1992 | WO1992010923A1 Process for throughplating bores in plate-like workpieces, and device for carrying out the process |
| 06/25/1992 | WO1992010365A1 Non-beading, thin-film, metal-coated ceramic substrate |
| 06/25/1992 | WO1992010323A1 Shield gas wave soldering |
| 06/25/1992 | DE4041272A1 Wave-soldering apparatus - with reduction area produced by reducing flame by solder point to optimise soldering conditions |
| 06/25/1992 | DE4041043A1 Tool breakage control for circuit board machining - evaluates tool spindle speed upon displacement of tool w.r.t. workpiece |
| 06/24/1992 | EP0491599A1 Process and apparatus for bringing a molten metal compound to a substrate |
| 06/24/1992 | EP0491543A2 Via resistors within multilayer 3-dimensional structures/substrates |
| 06/24/1992 | EP0491542A1 Via capacitors within multi-layer 3-dimensional structures/substrates |
| 06/24/1992 | EP0491515A2 Use of amorphous carbon to promote adhesion between electroactive polymer films and conductive substrates |
| 06/24/1992 | EP0491492A2 Method and apparatus for solder leveling of printed circuit boards |
| 06/24/1992 | EP0491401A1 Thermal print head |
| 06/24/1992 | EP0491336A2 Electric circuit |
| 06/24/1992 | EP0491306A1 Aromatic polyimides derived from aromatic dianhydrides and chlorinated aromatic diamines |
| 06/24/1992 | EP0491269A1 High density connector |
| 06/24/1992 | EP0491072A1 Hearing aid |
| 06/24/1992 | EP0491020A1 Etching solution. |
| 06/24/1992 | CN1062257A Method for making switch and potentiometer in curcuit board |
| 06/23/1992 | US5124677 Waffleline-configured surface-mount package for high frequency signal coupling applications |
| 06/23/1992 | US5124633 Dual sided printed circuit board test system |
| 06/23/1992 | US5124523 Process for adapting the frequency band of an oscillating circuit made from a metal-plastic-metal sandwich foil useful as an identification label, and sandwich foil for implementing the process |
| 06/23/1992 | US5124522 High accuracy, high flexibility energy beam machining system |
| 06/23/1992 | US5124282 Thermally matched to alumina substrate |
| 06/23/1992 | US5124233 Photoresist compositions |
| 06/23/1992 | US5124175 Method of patterned metal reflow on interconnect substrates |
| 06/23/1992 | US5123998 Selective radiation of a substrate resin film, organometallization of non-irradiated region, etching |
| 06/23/1992 | US5123986 Conductive connecting method |
| 06/23/1992 | US5123851 Integrated connector module with conductive elastomeric contacts |
| 06/23/1992 | US5123849 Conductive gel area array connector |
| 06/23/1992 | US5123789 Method of and apparatus for machining printed circuit board |
| 06/23/1992 | CA1304169C Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like |
| 06/23/1992 | CA1304168C Twisted wire jumper electrical interconnector |
| 06/23/1992 | CA1303844C Screen printer apparatus |
| 06/21/1992 | WO1991009985A1 Electroless plating process |
| 06/21/1992 | CA2057970A1 Device for inerting a solder bath of a flow woldering machine |
| 06/21/1992 | CA2046882A1 Electroless plating method |
| 06/18/1992 | WO1992011323A1 Coating for printed substrate |
| 06/18/1992 | CA2057408A1 Aromatic polyimides derived from aromatic dianhydrides and chlorinated aromatic diamines |
| 06/17/1992 | EP0490586A1 Method and apparatus for punching holes in a substrate |
| 06/17/1992 | EP0490530A2 Flexible circuit board |
| 06/17/1992 | EP0490501A2 Cleaning of articles |
| 06/17/1992 | EP0490214A2 Contact assembly between a transducer and a circuit board arranged in a handset of a subscriber set |
| 06/17/1992 | EP0490211A2 Electronic circuit packages with tear resistant organic cores |
| 06/17/1992 | EP0490161A2 A method for protecting surfaces of copper or a copper alloy from corrosion |
| 06/17/1992 | EP0490118A1 Photoimagable solder mask and photosensitive composition |
| 06/17/1992 | EP0489995A1 Flexible printed circuit package and flexible printed circuit for incorporation into such a package |
| 06/17/1992 | EP0489963A1 Means for handling green ceramic cards |
| 06/17/1992 | EP0489958A1 Circuit board for electronic control apparatus and method of making this circuit board |
| 06/17/1992 | EP0489802A1 Apparatus for cleaning mechanical devices using terpene compounds |
| 06/17/1992 | EP0489759A1 Process for producing a plated-through printed circuit board. |
| 06/17/1992 | DE4040226A1 Verfahren zur herstellung von durchkontaktierten leiterplatten oder multilayern Process for the preparation of through-hole printed circuit boards or multilayers |
| 06/17/1992 | DE4040119A1 Verfahren zum durchfluten von bohrungen in plattenfoermigen werkstuecken, insbesondere leiterplatten, und vorrichtung hierfuer A method for flood of holes in plattenfoermigen workpieces, particularly printed circuit and device for here |
| 06/17/1992 | CN2107756U Surface conglutination machine |
| 06/16/1992 | US5122930 For high speed signal tranmissions |
| 06/16/1992 | US5122929 Method of achieving selective inhibition and control of adhesion in thick-film conductors |
| 06/16/1992 | US5122635 Surface mounted device; monitoring temperature, time |
| 06/16/1992 | US5122621 Universal surface mount package |
| 06/16/1992 | US5122475 Method of making a high speed, high density semiconductor memory package with chip level repairability |
| 06/16/1992 | US5122440 Ultraviolet curing of photosensitive polyimides |
| 06/16/1992 | US5122439 Forming a pattern on a substrate |
| 06/16/1992 | US5122347 Provides simultaneous application of ultraviolet light to both sides of printed circuit board |
| 06/16/1992 | US5122215 Screen printing a mixed dielectric paint as thin strips pattern, press bonding, desolventizing |
| 06/16/1992 | US5122200 Method of cleaning printed circuit boards using formic acid |
| 06/16/1992 | US5122075 Electrical connector with improved retention feature |
| 06/16/1992 | US5122045 Mold for molding a package for a semiconductor device for detecting or emitting a magnetic line of force or light |
| 06/16/1992 | US5121875 Wave soldering in a protective atmosphere enclosure over a solder pot |
| 06/16/1992 | US5121874 Shield gas wave soldering |
| 06/16/1992 | US5121706 Apparatus for applying a composite insulative coating to a substrate |
| 06/16/1992 | CA1303712C Optical semiconductor device |
| 06/11/1992 | WO1992010079A1 Cubic molded article with built-in cubic conductor circuit and production method thereof |
| 06/11/1992 | WO1992010078A1 Device for soldering |
| 06/11/1992 | WO1992009883A1 Method and system for verifying substrate machining |
| 06/11/1992 | WO1992009400A1 Tacking agent |
| 06/11/1992 | WO1992009378A1 A process and composition for cleaning contaminants with terpene and monobasic ester |
| 06/11/1992 | DE4038765A1 Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate |
| 06/10/1992 | EP0489560A1 Positive type photosensitive anionic electrodeposition coating resin composition |
| 06/10/1992 | EP0489522A2 Display devices |
| 06/10/1992 | EP0489429A1 Method of producing flexible printed-circuit board covered with cover layer |
| 06/10/1992 | EP0489411A1 Process for catalysis of electroless metal plating on plastic |
| 06/10/1992 | EP0489384A2 Method for orienting at least one electronic component placed on a printed circuit board |
| 06/10/1992 | EP0489118A1 Multi-layer circuit board that suppresses radio frequency interference from high frequency signals. |
| 06/10/1992 | EP0229850B1 Connection terminals between substrates and method of producing the same |
| 06/10/1992 | CN1061874A Multi-pulse laser beam generation method and device |
| 06/10/1992 | CN1061787A Elimination of film defects due to hydrogen evolution during cathodic electrodeposition |
| 06/09/1992 | US5121311 Hinged LED holder |
| 06/09/1992 | US5121299 Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein |