| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/26/1991 | WO1991020175A1 Method for verifying solder interconnection by x-ray |
| 12/25/1991 | CN1057282A Thermally conductive adhesive |
| 12/24/1991 | US5075759 Surface mounting semiconductor device and method |
| 12/24/1991 | US5075718 Exposure apparatus |
| 12/24/1991 | US5075252 Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction |
| 12/24/1991 | US5075039 Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
| 12/24/1991 | US5075037 Selective catalytic activation of polymeric films |
| 12/24/1991 | US5074969 Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate |
| 12/24/1991 | US5074968 Method and apparatus for stripping starting sheet |
| 12/24/1991 | US5074947 Flip chip technology using electrically conductive polymers and dielectrics |
| 12/24/1991 | US5074799 Gel connector of laminar construction |
| 12/24/1991 | US5074037 Process for producing electrical connections on a universal substrate |
| 12/24/1991 | US5074035 Method of making thin film laminate printed circuit |
| 12/24/1991 | CA1293544C Plated plastic castellated interconnect for electrical components |
| 12/24/1991 | CA1293434C Polynorbornene laminates |
| 12/22/1991 | CA2045086A1 Binder system |
| 12/21/1991 | CA2044986A1 Positive-type photosensitive electrodeposition coating composition |
| 12/21/1991 | CA2044693A1 Stripping method for removing resist from a printed circuit board |
| 12/20/1991 | WO1991020095A1 Solder interconnections and methods for making same |
| 12/19/1991 | DE4118814A1 Bonding multilayer circuit boards - applying heated dies on press after boards are accurately aligned |
| 12/19/1991 | DE4016236A1 Immersed body processing - has oscillation applied mechanically to fluid and body to give max. fluid contact at and through workpiece |
| 12/18/1991 | EP0461961A1 Solder reflow furnace |
| 12/18/1991 | EP0461843A2 Methods of modifying metallic surfaces |
| 12/18/1991 | EP0461818A2 Solder-desolder modular station |
| 12/18/1991 | EP0461782A2 Conversion of silica precursors to silica at low temperatures |
| 12/18/1991 | EP0461733A2 High speed precision drilling system |
| 12/18/1991 | EP0461702A1 Contact assembly |
| 12/18/1991 | EP0461410A1 Organometallic interconnectors |
| 12/18/1991 | EP0461378A2 Au-Sn transient liquid bonding in high performance laminates |
| 12/18/1991 | EP0461289A1 Apparatus for treating three-dimensional workpieces with a liquid |
| 12/18/1991 | EP0304472A4 Biased grinding assembly |
| 12/17/1991 | US5073840 Circuit board with coated metal support structure and method for making same |
| 12/17/1991 | US5073814 Multi-sublayer dielectric layers |
| 12/17/1991 | US5073687 Method and apparatus for working print board by laser |
| 12/17/1991 | US5073478 Method of making a pattern |
| 12/17/1991 | US5073462 Half acryloyl ester of bisphenol a, initiator, elastomeric bin der |
| 12/17/1991 | US5073456 Copper circuiting on support, tin, tin oxide or hydroxide, partially cured thermosetting dielectric layer, mixture of ureido-silane and disylyl crosslinker |
| 12/17/1991 | US5073291 Chlorine-free solvent extraction; ozone resistance, nonflammable |
| 12/17/1991 | US5073233 Electrodeposited resin film, hardening agent |
| 12/17/1991 | US5073180 Preheating green sheet to pyrolyze binders, adding steam to burn off, replacing steam, raising temperature to densify and crystallize, holding to seal vias, cooling |
| 12/17/1991 | US5073118 Circuit board |
| 12/17/1991 | US5072873 Columnar structures disposed on a semiconductor supporting base |
| 12/17/1991 | US5072520 Method of manufacturing an interconnect device having coplanar contact bumps |
| 12/17/1991 | US5072519 Method of producing electric circuit patterns |
| 12/15/1991 | CA2044413A1 Contact assembly |
| 12/12/1991 | WO1991019319A1 Method of producing microbump circuits for flip chip mounting |
| 12/12/1991 | WO1991019024A1 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations |
| 12/12/1991 | WO1991018701A1 Fluxless resoldering system and fluxless soldering process |
| 12/12/1991 | DE4028105C1 Coupling plate shaped modules and PCB(s) - establishing electrical contact by row of contacts stamped and bowed out from metal strip |
| 12/12/1991 | DE4018177A1 Continuous circuit board polymer film lamination - using multichamber vacuum cladding appts. to allow continuous one- or two-side cladding |
| 12/11/1991 | EP0460856A2 Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same |
| 12/11/1991 | EP0460822A1 Integrated circuit packaging using flexible substrate |
| 12/11/1991 | EP0460802A2 Electronic device package with battery |
| 12/11/1991 | EP0460801A2 Zero power IC module |
| 12/11/1991 | EP0460787A1 Tin-lead immersion bath |
| 12/11/1991 | EP0460786A1 Pretreatment composition and process for tin-lead immersion plating |
| 12/11/1991 | EP0460668A2 IC module and a junction structure thereof |
| 12/11/1991 | EP0460621A1 Vacuum laminator |
| 12/11/1991 | EP0460559A2 Radial terminals type electronic component to insert in a printed circuit board |
| 12/11/1991 | EP0460548A2 Printed circuits and base materials precatalyzed for etal deposition |
| 12/11/1991 | EP0460539A2 Printed circuits and base materials having low Z-axis thermal expansion |
| 12/11/1991 | EP0460397A1 Tin lead plating solution |
| 12/11/1991 | EP0460267A1 Screen Printer |
| 12/11/1991 | EP0460226A1 Electroless plating process |
| 12/11/1991 | EP0460223A1 Board for surge absorbing device of communication line |
| 12/11/1991 | EP0389619A4 Curved plastic body with circuit pattern and method of making |
| 12/11/1991 | CN1056932A Isothermal termination block having multi-layer thermal conductor |
| 12/10/1991 | US5072289 Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device |
| 12/10/1991 | US5072283 Pre-formed chip carrier cavity package |
| 12/10/1991 | US5072193 Wire shielding for RF circuit boards and amplifiers |
| 12/10/1991 | US5072075 Double-sided hybrid high density circuit board and method of making same |
| 12/10/1991 | US5072074 High yield combined rigid and flexible printed circuits and method of manufacture |
| 12/10/1991 | US5071714 Sputtering aluminum with copper; lower resistivity; superior electromigration |
| 12/10/1991 | US5071701 Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards |
| 12/10/1991 | US5071520 Method of treating metal foil to improve peel strength |
| 12/10/1991 | US5071518 Method of making an electrical multilayer interconnect |
| 12/10/1991 | US5071517 Method for directly electroplating a dielectric substrate and plated substrate so produced |
| 12/10/1991 | US5071508 Circuit boards; uniformity |
| 12/10/1991 | US5071363 Miniature multiple conductor electrical connector |
| 12/10/1991 | US5071359 Array connector |
| 12/10/1991 | US5071357 Fluid pressure actuated electrical connector |
| 12/10/1991 | US5071305 Device for supporting and turning over board-like objects, to be transported through a continuous circulation oven |
| 12/10/1991 | US5071223 Circuit structure formed by insert molding of electric and/or optical transmission medium |
| 12/10/1991 | US5071058 Wetting surface with metal;printed circuits |
| 12/10/1991 | US5070782 Screen printer |
| 12/10/1991 | US5070604 Method for soldering two kinds of parts on one-side printed board |
| 12/10/1991 | US5070603 Method of separating multi-layer printed circuit wiring boards |
| 12/10/1991 | US5070602 Method of making a circuit assembly |
| 12/09/1991 | WO1991018957A1 Reworkable adhesive for electronic applications |
| 12/09/1991 | CA2083514A1 Reworkable adhesive for electronic applications |
| 12/05/1991 | DE4117938A1 Perforation method for PCB - partially depth drilling followed by laser finishing to required depth |
| 12/05/1991 | DE4117761A1 Semiconductor chip with film carrier - has lead wires between chip terminals and external electrodes applied to surface of film |
| 12/05/1991 | DE4117145A1 Chip mounting method on substrate - by heating adhesive layer to receiver chips from carrier |
| 12/05/1991 | DE4104744A1 Coating appts. fixing film onto circuit boards - applies photosensitive film fed from both sides onto surface of PCB |
| 12/05/1991 | DE4017752A1 Circuit board - is of format to receive electronic HF transistor stage |
| 12/05/1991 | DE4017145A1 Heat bonding agent - comprises EVA copolymer, linear thermoplastic polyurethane, tackifier resin, antiblocking agent, and anti-ageing stabiliser |
| 12/05/1991 | CA2042694A1 Conversion of silica precursors to silica at low temperatures |
| 12/05/1991 | CA2035579A1 Tin-lead immersion bath |
| 12/05/1991 | CA2035578A1 Pretreatment composition and process for tin/lead plating |
| 12/04/1991 | EP0459958A2 Fuse block, particularly for printed circuits |