Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/1992
09/08/1992US5145532 Solder precipitating composition
09/08/1992US5145531 Fluxing apparatus and method
09/08/1992US5145408 Connector for solderless attachment to a printed circuit board
09/08/1992US5145104 Substrate soldering in a reducing atmosphere
09/08/1992US5145100 Soldering apparatus
09/08/1992US5145055 Device for conveying printed circuit board
09/08/1992US5144742 Method of making rigid-flex printed circuit boards
09/08/1992CA2081019A1 Method and apparatus for forming contacts
09/08/1992CA1307353C Ultrasonic removal of contaminants from boreholes of printed circuit boards
09/03/1992WO1992015727A1 Device for screening off lines of electric flux in an installation for electrolytically processing essentially flat elements
09/03/1992WO1992015112A1 Methods and apparatus for material deposition
09/03/1992WO1992014572A1 Arrangement for driving a rotary tool
09/03/1992DE4106733A1 Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii) Apparatus for dim of field lines in a galvanizing plant (iii)
09/03/1992DE4105505A1 Liquid crystal display device with large number of electrode connections - uses distance piece to separate compressable conducting blocks, enabling two rows of connections to be employed
09/03/1992CA2105389A1 Device for screening off lines of electric flux in an installation for electrolytically processing essentially flat elements
09/02/1992EP0501919A1 Radiation-sensitive compositions based on polyphenols and acetals
09/02/1992EP0501850A1 Magnetic chip component
09/02/1992EP0501649A2 Method for cleaning electrical connectors
09/02/1992EP0501551A2 System for performing related operations on workpieces
09/02/1992EP0501550A2 System for performing work on workpieces
09/02/1992EP0501433A1 Solvent dispersible interpenetrating polymer networks
09/02/1992EP0501414A1 A method for connecting electrodes of a display apparatus
09/02/1992EP0501358A2 Connecting method and apparatus for electric circuit components
09/02/1992EP0501290A1 Device for laser soldering micro-contacts
09/02/1992EP0501270A1 Electronic device using a uniaxial conductive adhesive composition
09/02/1992EP0501243A1 Positive type photosensitive electrocoating resin composition
09/02/1992EP0501171A2 Contact apparatus for manufacturing a pressed contact connection
09/02/1992EP0501095A1 Process for metallising metal containing dielectric surfaces
09/02/1992EP0501013A2 Shearing stress interconnection apparatus and method
09/02/1992EP0500988A1 Hearing aid to be worn on the head
09/02/1992EP0500616A1 Oligomeric to polymeric character complexes
09/02/1992CA2062096A1 Copolymers crosslinkable by acid catalysis
09/02/1992CA2062066A1 Photosensitive compositions based on polyphenols and acetals
09/02/1992CA2061297A1 Method for metallizing dielectric surfaces containing a metal
09/01/1992US5144535 Method of mounting electrical and/or electronic components of a printed circuit board
09/01/1992US5144534 Method for manufacturing rigid-flexible circuit boards and products thereof
09/01/1992US5144526 Low temperature co-fired ceramic structure containing buried capacitors
09/01/1992US5144132 Method of and device for compensating for reading-position error of image sensor
09/01/1992US5144104 Miniature switch device with tactile effect
09/01/1992US5143785 Curable adhesive
09/01/1992US5143756 Fiber reinforced epoxy prepreg and fabrication thereof
09/01/1992US5143593 Method of copper plating
09/01/1992US5143592 Process for preparing nonconductive substrates
09/01/1992US5143544 Tin lead plating solution
09/01/1992US5143277 Method for the mounting of miniature electronic beam lead components
09/01/1992US5142775 Multilayer printed circuit board, circuitizing first dielectric, encapsulating with second dielectric to form relaminated core, drilling, copper plating, bonding multilayer cores
09/01/1992US5142765 Lead mounting apparatus
09/01/1992CA1306903C Process for the manufacture of copper thick-film conductors using aninfrared furnace
08/1992
08/29/1992WO1992015726A1 Process and arrangements for electroplating or the like of perforated workpieces
08/29/1992CA2105078A1 Process and arrangements for electroplating or the like of perforated workpieces
08/29/1992CA2061877A1 Solvent dispersible interpenetrating polymer networks
08/26/1992EP0500415A1 Contact of an electric connector protected by a polymer film and method for its fabrication
08/26/1992EP0500414A1 Method for modifying the electrical conductivity of an organic polymer by irradiating with synchrotron radiation
08/26/1992EP0500235A1 Protecting tape automated bonding devices
08/26/1992EP0500223A1 Electronic circuit packaged with a position sensor
08/26/1992EP0500135A2 Wave soldering in a protective atmosphere enclosure over a solder pot
08/26/1992EP0500117A2 Liquid crystal display device
08/26/1992EP0499986A2 Multilayer wiring structure and method for forming multilayer construction
08/26/1992EP0499958A2 Process for producing thin copper foil-clad circuit board substrate
08/26/1992EP0499612A1 Electrically conductive polymer composition.
08/26/1992EP0310656B1 Surface treatment of polymers
08/26/1992CN1063989A Adhesion method of copper to resin
08/26/1992CN1063833A Drilling printed circuit boards and entry and backing boards therefor
08/25/1992US5142449 Forming isolation resistors with resistive elastomers
08/25/1992US5142448 Method for manufacturing rigid-flexible multilayer circuit boards and products thereof
08/25/1992US5142444 Demountable tape-automated bonding system
08/25/1992US5142351 Via-less two-metal tape-automated bonding system
08/25/1992US5142239 High frequency linear amplifier assembly
08/25/1992US5142151 Method for measuring degree of cure of resin in a composite material and process for making the same
08/25/1992US5141829 Method of preparing a photo-mask for imaging three-dimensional objects
08/25/1992US5141602 Apparatus for automatic self-induced repair
08/25/1992US5141583 Method of and apparatus for continuously fabricating laminates
08/25/1992US5141455 Mounting of electronic components on substrates
08/25/1992US5141165 Spray gun with five axis movement
08/25/1992US5141147 Reflow soldering method and the apparatus thereof
08/25/1992US5140879 Variable array punch
08/25/1992US5140746 Protective device of deformable gel on support
08/25/1992US5140745 Method for forming traces on side edges of printed circuit boards and devices formed thereby
08/20/1992WO1992014505A2 Piston-based ventilator design and operation
08/20/1992WO1992014347A1 Process for soldering materials like printed circuit boards or sets of components in electronics or metals in engineering work
08/20/1992WO1992014346A2 Drilling printed circuit boards and entry and backing boards therefor
08/20/1992WO1992014281A1 Electrical connectors
08/20/1992WO1992014280A1 Electrical connectors
08/20/1992WO1992014260A1 Method of making semiconductor bonding bumps using metal cluster ion deposition
08/20/1992WO1992013981A2 Selective process for printed circuit board manufacturing
08/20/1992DE4104853A1 Detachable electric connection mfr. between circuit board and wiring - with contact members on edge of board integrally moulded with board
08/19/1992EP0499441A2 Method for cleaning sites contaminated with biodegradable organic wastes and compositions for enhancing the biodegradation of said wastes
08/19/1992EP0499431A1 Lanced hold-downs
08/19/1992EP0499386A2 Workpiece support and clamping means
08/19/1992EP0499314A2 Method of manufacturing a semiconducteur device using electroless plating
08/19/1992EP0498952A1 Electrical flat connection
08/19/1992EP0498898A1 Flexible printed circuit board and its manufacturing
08/19/1992EP0498828A1 Solder leveller.
08/18/1992US5140110 Printed circuit board capable of preventing electromagnetic interference
08/18/1992US5139924 Using closely packed insulated conductors embedded in radiation sensitive substrate which has conductive foil backing; simplification
08/18/1992US5139923 Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon
08/18/1992US5139856 Exhibits high bonding strength, electroconductivity, soldering wettability and durability; used in semiconductors, integrated circuits, heaters, print heads and other electronics
08/18/1992US5139852 Used for microelectronics such as semiconductor package; heat resistance, hermetic sealing, strees relieving, noncracking and high strength
08/18/1992US5139851 Used for microelectronics such as semiconductor package; heat resistance, hermetic sealing, stree relieving, noncracking and high strength
08/18/1992US5139818 Depositing film of platinum amine compound, selectively irradiating to change solubility pyrolyzing to produce catalytically active plantinum and using platinum catlayst to deposit copper on a substrate