H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1992
11/03/1992	US5161086 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
11/03/1992	US5161009 Ic module having a folding junction structure
11/03/1992	US5160810 Universal surface mount package
11/03/1992	US5160783 Epoxy resin-impregnated glass cloth sheet having adhesive layer
11/03/1992	US5160600 Copper, nickel, paladium
11/03/1992	US5160579 Process for manufacturing printed circuit employing selective provision of solderable coating
11/03/1992	US5160567 System and method for manufacturing copper clad glass epoxy laminates
11/03/1992	US5160422 On copper for electronic circuits, thiourea, sulfonates, aluminum chloride
11/03/1992	US5160409 Solder plate reflow method for forming a solder bump on a circuit trace intersection
11/03/1992	US5160374 Process and apparatus for preventing the pulse discharge of insulators in ionizing radiation
11/03/1992	US5160277 Snap-in lamp for printed circuits
11/03/1992	US5160270 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
11/03/1992	US5160269 Hydrostatic connector for flex circuits
11/03/1992	US5159751 Method of manufacturing electronic module assembly
11/02/1992	WO1992019794A1 Improved process for preparing a nonconductive substrate for electroplating
11/02/1992	CA2103137A1 Improved process for preparing a nonconductive substrate for electroplating
10/1992
10/29/1992	WO1992019088A1 Protective coatings
10/29/1992	WO1992019024A1 Solder-bearing lead
10/29/1992	WO1992018669A1 Galvanisation device for plate-like workpieces, especially printed circuit boards
10/29/1992	WO1992018334A1 A system and method for manufacturing copper clad, glass fibre reinforced epoxy resin laminates
10/29/1992	DE4213250A1 Semiconductor assembly based on double sided circuit board - which can bend to absorb differential expansion of components soldered to either side in different positions
10/29/1992	DE4211824A1 Circuit board system for solid-state image sensor - has substrate with conductive pattern on both sides, insertable into support
10/29/1992	DE4113686A1 Conductive track pattern formation on oxide-coated glass - depositing electroless metal on photoetched tracks pertaining to portion not covered by liq. crystal
10/29/1992	DE4113654A1 Agent for producing thin oxidising layer on polymers, glass fibres and ceramic - comprises potassium permanganate pH-adjusted using methanesulphonic acid
10/29/1992	DE4113263A1 Copper@-coating of ceramic parts by electroless plating - used for metallisation of dielectric or coaxial resonators
10/29/1992	DE4113262A1 Electroless application of copper@ base coat to aluminium oxide ceramic substrate - by copper@ plating, selective varnishing, stripping and galvanic deposition of nickel@ and/or gold@, for prodn. of conducting strips
10/29/1992	DE4113261A1 Electroless application of copper@ base coat to reinforced teflon substrate - by removing copper@ lining on substrates with caustic ammonia etching bath, purifying substrate, catalysing substrate, chemical copper@ plating, drying and annealing
10/28/1992	EP0511162A1 Heat conducting adhesive films, laminates with heat conducting adhesive layers and their application
10/28/1992	EP0511014A1 Integrally molded printed circuit board and method of making the same
10/28/1992	EP0510938A1 Electrostatic spray apparatus
10/28/1992	EP0510869A2 Electrical connector having terminals which cooperate with the edge of a circuit board
10/28/1992	EP0510727A2 Superconducting ceramic film-forming paste
10/28/1992	EP0510711A2 Processes and compositions for electroless metallization
10/28/1992	EP0510608A1 One part, solventless, siloxane conformal coating
10/28/1992	EP0510516A2 Sensor device on a substrate with an electrical link element and procedure to fabricate such a device
10/28/1992	EP0510323A1 Device for laser soldering
10/28/1992	EP0510065A1 Catalytic, water-soluble polymeric films for metal coatings
10/28/1992	EP0510049A1 A method for manufacturing of mineature impedance matched interconnection patterns
10/28/1992	EP0509992A1 Electrical connectors.
10/28/1992	EP0349600B1 Improved copper etchant compositions
10/28/1992	CN2120423U Self-cleaning tin pot device
10/28/1992	CN1065754A Electric flat-plug connection
10/27/1992	US5159537 Mounting structure for electronic apparatus
10/27/1992	US5159536 Panel board
10/27/1992	US5159535 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
10/27/1992	US5159171 Method and apparatus for solder laser printing
10/27/1992	US5158990 Coating compounds for electrical and electronic components containing vitreons fused silica
10/27/1992	US5158989 Electroless plating-resisting ink composition
10/27/1992	US5158860 Coating substrate with photoresist, imaging, development
10/27/1992	US5158827 Poly-4-methyl-1-pentene laminated to paper; preparation of cladding panels for multi-layer printed circuit boards
10/27/1992	US5158818 Conductive die attach tape
10/27/1992	US5158657 Circuit substrate and process for its production
10/27/1992	US5158645 Method of external circuitization of a circuit panel
10/27/1992	US5158639 Roll conveyance and attachment/detachment device for applying apparatus
10/27/1992	US5158466 Electrical connector part
10/27/1992	US5157828 Method and device for fastening an electronic circuit substrate onto a support
10/25/1992	CA2066867A1 Heat-conductive adhesive films, laminated with heat-conductive adhesive layers and the use thereof
10/24/1992	CA2064989A1 One part solventless conformal coatings
10/23/1992	WO1992019092A1 Method for selectively coating non-conductors with carbon particles and use of copper containing solutions therein
10/23/1992	CA2102240A1 Method for selectively coating non-conductors with carbon particles and use of copper containing solutions therein
10/22/1992	DE4112831A1 Printed circuit components retainer esp. in missile - consists of two compressible synthetic pads in which recesses are positioned and shaped for intimate contact
10/21/1992	EP0509962A1 A process and an apparatus for producing a thin photoimageable coating on a metallic-layered substrate
10/21/1992	EP0509466A1 Device for irreversible functioning interruption of an apparatus controlled by an electronic system
10/21/1992	EP0509438A2 Encapsulant composition
10/21/1992	EP0509380A2 Improvement in or relating to a press-contact type electric connector for a flat, flexible cable
10/21/1992	EP0509305A1 Method of depositing conductors in high aspect ratio apertures
10/21/1992	EP0509262A2 Solder-coated printed circuit board and method of manufacturing the same
10/21/1992	EP0509174A2 Electroless plating bath composition and method for production thereof
10/21/1992	CN1065551A Method and apparatus for forming contacts
10/21/1992	CN1065468A Solvent dispersible interpenetrating polymer networks
10/20/1992	US5157762 Method and apparatus for providing a three state data base for use with automatic optical inspection systems
10/20/1992	US5157589 Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's
10/20/1992	US5157578 Hybrid printed circuit board
10/20/1992	US5157480 Semiconductor device having dual electrical contact sites
10/20/1992	US5156997 Using focused liquid metal ion source
10/20/1992	US5156923 Heat-transferring circuit substrate with limited thermal expansion and method for making
10/20/1992	US5156903 Internal and surface electroconductor layers connected through metal layer formed by firing organometallic paste coating
10/20/1992	US5156772 Circuit writer materials
10/20/1992	US5156732 Etched with sulfuric acid to form hydrophilic denatured layer; etached with aliphatic diamine, then quaternary hydroxide
10/20/1992	US5156731 Polyimide substrate and method of manufacturing a printed wiring board using the substrate
10/20/1992	US5156730 Electroplating baths for circuit boards
10/20/1992	US5156716 Process for the manufacture of a three layer tape for tape automated bonding
10/20/1992	US5156552 Circuit board edge connector
10/20/1992	US5156322 Applying layers of copper and silver galvanically or chemically to specified thickness improves adhesion
10/20/1992	US5155926 Circuit board dryer having angled, offset air jet nozzles
10/20/1992	US5155906 Process for repairing circuit connections
10/20/1992	US5155905 Method and apparatus for attaching a circuit component to a printed circuit board
10/20/1992	US5155904 To a printed circuit board
10/20/1992	CA2065709A1 Irreversible arrangement for interrupting the functioning of an apparatus controlled by an electronic system
10/20/1992	CA1308902C Separating device for trimming the width of a poured curtain of coating material
10/17/1992	CA2065782A1 Encapsulant composition
10/16/1992	WO1992019019A1 Dielectric filter and mounting bracket assembly
10/15/1992	WO1992017994A1 Multilayer printed circuit board and method of manufacture
10/15/1992	WO1992017921A1 Contact device for an electrical or electronic component
10/15/1992	WO1992017905A1 Method for producing coaxial connections for electronic components, and component casing containing such connections
10/15/1992	WO1992017627A1 Process for preparation of a seed layer for selective metal deposition
10/15/1992	WO1992017297A1 Fabrication of metal matrix composites by vacuum die casting
10/15/1992	DE4112462A1 Waessriges konditionierungsmittel fuer die behandlung von nichtleitern Aqueous conditioning medium for the treatment of non-ladders
10/15/1992	DE4111956A1 Multipole electrical circuit board connector - has socket contacts within socket housing cooperating with pin contacts attached to respective clamp poles
10/14/1992	EP0508977A1 Clip to connect two plate-like elements

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