Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1991
10/16/1991EP0452009A2 Water soluble solder flux and paste
10/16/1991EP0451741A2 Positive-working photosensitive electrostatic master
10/16/1991EP0451561A1 Photopolymerisable mixture and recording material made from it
10/16/1991EP0451541A1 Fabrication of multilayer circuit boards with increased conductor density
10/16/1991EP0451500A2 Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
10/16/1991EP0451490A2 Thermode for an electrically heated soldering head
10/16/1991EP0451363A1 Tape-automated bonding frame adapter system
10/16/1991EP0451254A1 Multilayer circuit board having microporous layers and process for making same.
10/16/1991EP0451149A1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane, dichlorotrifluoroethane, and methanol or ethanol
10/16/1991EP0179917B1 Method and apparatus for drawing thick-film circuits
10/16/1991CN1055322A Improved protected conductive foll assemblage and procedure for preparing same using static electrical forces
10/15/1991US5058178 Method and apparatus for inspection of specular, three-dimensional features
10/15/1991US5057969 Thin film electronic device
10/15/1991US5057901 Lead frame for semi-conductor device
10/15/1991US5057805 Microwave semiconductor device
10/15/1991US5057550 Epoxy-silanol functional uv curable polymers
10/15/1991US5057400 Reacting unsaturated acid anhydride with conjugated diene polymer, then with unsaturated hydroxy-monocarboxylic acid yields non-tacky film for printed circuits
10/15/1991US5057372 Multilayer film and laminate for use in producing printed circuit boards
10/15/1991US5057358 Uv-curable epoxy silicones
10/15/1991US5057348 Potted electrical/mechanical devices, and dual cure potting method
10/15/1991US5057193 Anti-tarnish treatment of metal foil
10/15/1991US5057171 Isostatic press for laminating multi-layer components and method of lamination
10/15/1991US5057023 High density connector system
10/15/1991US5056706 Liquid metal paste for thermal and electrical connections
10/15/1991US5056461 Circuit board dipping fixture
10/15/1991US5056216 Method of forming a plurality of solder connections
10/15/1991US5056215 Method of providing standoff pillars
10/15/1991CA1290722C Electric field treatment with excitation electrode having thread-like contactpieces and opposing electrodes
10/15/1991CA1290720C Production of metallic structures on inorganic non-conductors
10/15/1991CA1290676C Method for bonding integrated circuit chips
10/13/1991CA2039205A1 Process for brazing metallized components to ceramic substrates
10/11/1991CA2038350A1 Silicone organic conformal coatings cured by thiol addition of olefin functional silicones
10/11/1991CA2037826A1 Positive-working photosensitive electrostatic master
10/10/1991DE4110751A1 Flat-component machining equipment - indexes components for distance equal to amount of tool-holder movement
10/10/1991DE4030609A1 Connection of film layer to base of PCB - is preformed at point where appropriate length of film is cut from strip and any flakes produced are sucked away
10/10/1991DE4011114A1 Process for seeding substrate with metal - comprises impregnating substrate with soln. of e.g. palladium salt, then irradiating with e.g. electrons
10/09/1991EP0450950A2 A flexible high density interconnect structure and flexibly interconnected system
10/09/1991EP0450856A2 Solvent cleaning of articles
10/09/1991EP0450854A2 Solvent cleaning of articles
10/09/1991EP0450470A2 Circuit board
10/09/1991EP0450458A1 Compositions of dichloropenta fluoropropane and acetone
10/09/1991EP0450381A2 Multilayer interconnection structure
10/09/1991EP0450329A2 Localized soldering station
10/09/1991EP0450278A1 Solder/polymer composite paste and method
10/09/1991EP0449969A1 Photoresist compositions containing cobalt (iii) compound and redox transfer ligand.
10/09/1991CN2086499U Auomtatic tin-spraying machine
10/09/1991CN1055276A Adhesive fastening plate
10/08/1991US5055969 Servo/data actuator arm flexible circuit
10/08/1991US5055966 Via capacitors within multi-layer, 3 dimensional structures/substrates
10/08/1991US5055912 Semiconductor device
10/08/1991US5055652 Laser soldering of flexible leads
10/08/1991US5055637 Circuit boards with recessed traces
10/08/1991US5055537 Acetylenic polymers containing metallic colloid; silver mirrors; catalyst films of electroless plating
10/08/1991US5055425 Stacks of solid copper vias in dielectric
10/08/1991US5055378 Solder resist composition
10/08/1991US5055374 Electrodeposition coating composition containing an acrylic resin and a quinnone diazide group bearing resin
10/08/1991US5055342 Fluorinated polymeric composition, fabrication thereof and use thereof
10/08/1991US5055321 Dispersant heat resistant particles which are soluble in an oxidizer in a heat resistant resin
10/08/1991US5055164 Electrodepositable photoresists for manufacture of hybrid circuit boards
10/08/1991US5055138 Covering flammable solvent surface with vapor layer rich in perfluorinated organic compound
10/08/1991US5055072 Press-fit contact pin
10/08/1991US5054681 Component desoldering tool
10/08/1991US5054193 Printed circuit board fixture and a method of assembling a printed circuit board
10/08/1991US5054192 Lead bonding of chips to circuit boards and circuit boards to circuit boards
10/08/1991CA1290201C Method of fabricating multilayer circuit structures
10/06/1991CA2026198A1 Sticking apparatus
10/05/1991CA2039829A1 Solvent cleaning of articles
10/05/1991CA2039827A1 Solvent cleaning of articles
10/05/1991CA2038829A1 Snap-in lamp socket for printed circuits
10/03/1991WO1991015100A1 Method for producing a printed circuit board
10/03/1991WO1991015031A1 Process for the production of strip transmission lines, in particular lines for electronic hybrid circuits working in the high-frequency range
10/03/1991WO1991014805A1 Process for preparing nonconductive substrates
10/03/1991WO1991014763A1 Binary azeotropic compositions of hexafluoropropylene/ethylene cyclic dimer with methanol or ethanol
10/03/1991WO1991014730A1 Modification of polymer surfaces
10/03/1991WO1991014584A1 Method for improving the insulation resistance of printed circuits
10/03/1991WO1991014532A1 Solder delivery system
10/03/1991WO1991014529A1 Process and device for heating a welding material
10/03/1991WO1991009511A3 Electrical conductors of conductive resin
10/03/1991CA2078987A1 Modification of polymer surfaces
10/02/1991EP0449790A2 Induction welding station for contact inserting machines on hybrid circuit substrates or on traditional printed circuit cards
10/02/1991EP0449729A2 Flat power resistance
10/02/1991EP0449674A1 Miniature tactile effect switch
10/02/1991EP0449647A1 Improved protected conductive foil assemblage and procedure for preparing same using static electrical forces
10/02/1991EP0449640A1 Method for mounting electrical components.
10/02/1991EP0449570A1 Multi-pin electrical connector with terminal pins
10/02/1991EP0449564A2 Process for repairing circuit connections
10/02/1991EP0449292A2 Multilayer printed circuit board and production thereof
10/02/1991EP0449285A2 Illuminating device including a light emitting diode
10/02/1991EP0449180A2 Film exposure apparatus and method of exposure using the same
10/02/1991EP0449027A2 UV-Curable epoxy silicones
10/02/1991EP0449022A2 Method of controlling photoresist film thickness and stability of an electrodeposition bath
10/02/1991EP0448702A1 Application specific tape automated bonding.
10/02/1991EP0448686A1 High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact.
10/02/1991EP0290539B1 Process for the chemical treatment of ceramic parts and subsequent metallization
10/02/1991EP0225927B1 Method and device for boring films for film pasting apparatuses
10/02/1991DE4017380C1 Washing-out bores in objects to be galvanised - by alternating increasing and lowering of pressure of cleaning or rinsing liq., flowing through
10/02/1991DE4010244A1 Three dimensional circuit board mfr. - using laser machining to provide circuit pattern in conductive lacquer layer subsequently metallised
10/02/1991CN2086041U Apparatus for arranging and leading-in pin of ic
10/01/1991US5053922 Demountable tape-automated bonding system
10/01/1991US5053921 Multilayer interconnect device and method of manufacture thereof
1 ... 1044 1045 1046 1047 1048 1049 1050 1051 1052 1053 1054 1055 1056 1057 1058 1059 1060 1061 1062 1063 1064 ... 1185