Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/1992
02/04/1992US5086335 Tape automated bonding system which facilitate repair
02/04/1992US5085972 Alkoxyalkyl ester solubility inhibitors for phenolic resins
02/04/1992US5085922 Printed circuit board
02/04/1992US5085697 Method of forming a tentative surface protective coating
02/04/1992US5085602 Electrical circuit board mounting apparatus and method
02/04/1992US5085364 Pressure-sensitive adhesive for temporarily securing electronic devices
02/04/1992US5085015 Removal of surface thickness by abrasion whereby the surface acquires a smooth, matte finish which is not susceptible to peeling
02/04/1992US5084961 Method of mounting circuit on substrate and circuit substrate for use in the method
02/04/1992US5084952 Method and apparatus for increasing a substrate processing area without increasing the length of a manufacturing line
02/04/1992CA1295426C Process for obtaining electrical interconnect using a solderable mechanical fastener
02/04/1992CA1295425C Electrical contact stabilizer assembly
02/04/1992CA1295424C Solder system and method of using same with alignment monitor
02/04/1992CA1295205C Methylene chloride compound and its use for removing photoresist films
02/04/1992CA1295182C Hybrid interconnect lead frame for thermal ink jet printhead and methods of manufacture and connection
02/04/1992CA1295169C Adhesion promotion in photoresist lamination and processing
02/04/1992CA1295168C Use of a photosensitive cathode for deposition of metal structures within organic polymeric films
02/04/1992CA1295166C Photopolymerizable composition containing carboxy benzotriazole
02/02/1992WO1992002952A1 Method of applying metallized contacts to a solar cell
02/02/1992CA2065871A1 Method of applying metallized contacts to a solar cell
02/01/1992CA2042739A1 Multilayer printed circuits and process for their fabrication
01/1992
01/31/1992CA2048035A1 Attaching integrated circuits to circuit boards
01/30/1992DE4023864A1 Device for transporting prods. through baths in galvanising plant - with specially designed side walls in baths to enable optimum air flow through container and optimum vapour suction
01/30/1992DE4023643A1 Selective wet-etching of multilayers - where, after etching one layer, it is treated with solvent, dried, then next layer is etched
01/29/1992EP0468801A2 Distributed constant circuit board using ceramic substrate material
01/29/1992EP0468787A2 Tape automated bonding in semiconductor technique
01/29/1992EP0468767A2 Coaxial conductor interconnection wiring board
01/29/1992EP0468420A2 Integrated component in flatpack package
01/29/1992EP0468371A2 Method of and device for compensating for reading-position error of image sensor
01/29/1992EP0468275A2 Filmcarrier for tape automated bonding
01/29/1992EP0468208A1 Apparatus for the electrolytic treatment of workpieces through a succession of baths
01/29/1992EP0468002A1 Autodeposition emulsion for selectively protecting metallic surfaces
01/29/1992EP0467945A1 Printed circuit boards.
01/29/1992CN1058162A Induction electromagnetic pump for soft brazing with liquid metal
01/28/1992US5084355 Semiconductor integrated circuits
01/28/1992US5084345 Laminates utilizing chemically etchable adhesives
01/28/1992US5084299 Thin film metallization of conductors on substrates made of polymers, coating with a seed metal to initiate electroless deposition of metals, drying and etching
01/28/1992US5084211 An electrically insulating resin with amorphous carbon particl es
01/28/1992US5084200 Dibasic ester solvent, a hydrocarbon solvent and a surfactant
01/28/1992US5084199 1,1,2,2,3,3-hexafluorocyclopentane and use thereof in compositions and processes for cleaning
01/28/1992US5084124 Flexible printed circuit board and coverlay film and method of manufacturing same
01/28/1992US5084107 Electroconductive adhesive, increased effective area, reduced power loss at electrode, good mass producibility
01/28/1992US5084095 Nonaqueous waterproof coating comprising a mixture of polyuret hane and oleoresin varnish for printing
01/28/1992US5083898 Base plate conveyor
01/28/1992US5083697 Particle-enhanced joining of metal surfaces
01/28/1992US5083696 Pin-holding device for use in connecting a pin
01/28/1992US5083490 Punching unit for punching apparatus
01/28/1992CA1294861C Polypropyline holder made of various metallic coatings and manufacturing process thereof
01/28/1992CA1294858C Thin-film coating method and apparatus therefor
01/25/1992WO1992002115A1 Combined rigid and flexible printed circuits
01/25/1992CA2087605A1 Combined rigid and flexible printed circuits
01/24/1992CA2023362A1 Circuit board pins
01/23/1992DE4023294A1 Short circuit testing of multilayer circuit board - has test probe pressed against insulated conductor track
01/22/1992EP0467698A2 Printed circuit board having holes with multiple conductors
01/22/1992EP0467199A2 Preparation of printed circuit boards by metallization
01/22/1992EP0467149A2 Method of and device for inspecting pattern of printed circuit board
01/22/1992EP0467118A2 Device for applying fluid
01/21/1992US5082755 Liquid crystal programmable photoresist exposure method for making a set of masks
01/21/1992US5082734 Catalytic, water-soluble polymeric films for metal coatings
01/21/1992US5082718 Method for depositing an insulating layer on a conductive layer of a multi-layer connection board of one very large scale integrated circuit
01/21/1992US5082606 Catalytic hydrogen oxidation to form water vapor; cofiring
01/21/1992US5082595 Carbon black
01/21/1992US5082547 Vacuum chamber; shield with dielectric and conductive layers; printed circuits
01/21/1992US5082503 Fluorocarbon, alcohol, cleaning
01/21/1992US5082463 Busbar interconnecting structure
01/21/1992US5082460 Electrical terminal with frangible mounting leg and method of forming the same
01/21/1992US5082402 Method of drilling of through-holes in printed circuit board panels
01/21/1992US5081773 Oven for drying or curing a photosensitive material applied as a coating on a substrate
01/21/1992US5081764 Terminal structure and process of fabricating the same
01/21/1992CA2023361A1 Printed circuit boards
01/21/1992CA1294712C Reinforced plastic laminates for use in printed circuit boards, and method and apparatus therefor
01/21/1992CA1294584C Method of mounting surface-mounted type electronic components on a printed circuit board
01/21/1992CA1294425C2 Electroplating process
01/16/1992DE4121011A1 Solder-free connection of circuit board wires - has pair of plates clamped against wires by tightening centre screw
01/16/1992DE4022316A1 Manufacture of electronic circuit boards - uses template with hole pattern for positioning components onto board
01/16/1992DE4021341A1 Verfahren und vorrichtung zum kontinuierlichen oder diskontinuierlichen herstellen von ebenen, plattenfoermigen mehrschichtigen werkstoffen, laminaten o. dgl. And apparatus for continuous or discontinuous manufacture of flat plattenfoermigen multilayer method based materials, laminates o. The like.
01/15/1992EP0466376A2 Driver circuit package for liquid crystal display
01/15/1992EP0466355A1 Soldering flux and method of its use in fabricating and assembling circuit boards
01/15/1992EP0466205A1 Method for coating a substrate with a silicon nitrogen-containing material.
01/15/1992EP0466202A1 Method of manufacturing circuit boards
01/15/1992EP0466121A2 Carrier device
01/15/1992EP0466054A2 Composition for cleaning electronic and precision parts, and cleaning process
01/15/1992EP0466013A2 Method of and device for inspecting pattern of printed circuit board
01/15/1992EP0465948A1 Compliant terminal pin
01/15/1992EP0465858A1 Method for manufacturing a polyimide
01/15/1992EP0465693A1 Electrical insulating printed circuit board with integrated cooling means
01/15/1992EP0465692A1 Circuit support
01/15/1992EP0465670A1 Photocurable resin composition
01/15/1992EP0465593A1 Process and composition for forming black oxide layers
01/15/1992EP0418313A4 Circuit writer
01/15/1992CN1057796A Washing/drying method and apparatus
01/14/1992US5081562 Circuit board with high heat dissipations characteristic
01/14/1992US5081520 Chip mounting substrate having an integral molded projection and conductive pattern
01/14/1992US5081336 Method for soldering components onto printed circuit boards
01/14/1992US5081068 Method of treating surface of substrate with ice particles and hydrogen peroxide
01/14/1992US5081005 Method for reducing chemical interaction between copper features and photosensitive dielectric compositions
01/14/1992US5080998 Process for the formation of positive images utilizing electrodeposition of o-quinone diazide compound containing photoresist on conductive surface
01/14/1992US5080979 Printed circuit boards
01/14/1992US5080966 Copper and copper oxide coated with titanium compound
01/14/1992US5080958 Acrylic or acrylate latex adhesive
01/14/1992US5080929 Method and apparatus for through hole substrate printing