| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/26/1992 | US5116646 Method of metallizing oxide ceramic with excellent hermetic sealing and brazing properties |
| 05/26/1992 | US5116642 Thick film forming process |
| 05/26/1992 | US5116641 Method for laser scribing substrates |
| 05/26/1992 | US5116525 Ternary azeotropic compositions of dichloropentafluoropropane and trans-1,2-dichloroethylene with methanol or ethanol or isopropanol |
| 05/26/1992 | US5116472 Process for coating substrates with an insulating coating |
| 05/26/1992 | US5116463 Filling aperture in mask which then change the electrochemical potential |
| 05/26/1992 | US5116459 Processes for electrically conductive decals filled with organic insulator material |
| 05/26/1992 | US5116440 Process for manufacturing multilayer printed wiring board |
| 05/26/1992 | US5116433 Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same |
| 05/26/1992 | US5116229 Light unit terminals maintained in bent condition |
| 05/26/1992 | US5115964 Method for bonding thin film electronic device |
| 05/26/1992 | US5115561 Method of spot-facing printed circuit board |
| 05/26/1992 | CA1301953C Applicator for applying dry film solder mask on a board |
| 05/26/1992 | CA1301952C Selective solder formation on printed circuit boards |
| 05/26/1992 | CA1301877C Solder containing electrical connector and method for making same |
| 05/26/1992 | CA1301698C Roughening surface of a substrate |
| 05/26/1992 | CA1301524C Photosensitive compositions containing microcapsules concentrated in surface layer |
| 05/26/1992 | CA1301522C Laminate for the formation of beam leads for ic chip bonding |
| 05/22/1992 | CA2052414A1 Substrate with thin film conductive layer with highly conductive bus bar and method |
| 05/21/1992 | DE4036803A1 Pressing copper@ clad or laminates - surrounding each prepreg stack with soldered loop of copper@ wire to obtain cured laminate free from visual and thickness edge effects |
| 05/21/1992 | DE4036802A1 Verfahren zur herstellung von kupferkaschierten basismaterialtafeln A process for producing base materials copper-clad |
| 05/21/1992 | DE4036801A1 Copper@ covered circuit board continuous prodn. in double band press - at temp. no higher than glass transition temp. of cured prepreg resin to reduce undulation |
| 05/21/1992 | DE4036302A1 Support for electronic components - made of water setting gypsum or cement |
| 05/20/1992 | WO1992008616A1 Solder or conductive paste printing device |
| 05/20/1992 | EP0486392A1 Hybrid circuit formed by two circuits whose tracks are joined by electrical connection balls |
| 05/20/1992 | EP0486390A1 Solder reflow furnace |
| 05/20/1992 | EP0485838A2 Injection molded circuit boards by injection behind flexible circuits with thermoplastic materials |
| 05/20/1992 | EP0485790A2 Device for separating and edging printed circuit boards |
| 05/20/1992 | EP0485760A1 Low temperature controlled collapse chip attach process |
| 05/20/1992 | EP0485699A2 Conditioning of a substrate for electroless plating thereon |
| 05/20/1992 | EP0485588A1 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations. |
| 05/20/1992 | CA2072074A1 Solder or conductive paste printing device |
| 05/19/1992 | US5114885 Encapsulant composition |
| 05/19/1992 | US5114830 Solder mask resins having improved stability containing a multifunctional epoxide and a partial ester or styrene-maleic anhydride copolymer |
| 05/19/1992 | US5114757 Enhancement of polyimide adhesion on reactive metals |
| 05/19/1992 | US5114754 Passivation of metal in metal/polyimide structures |
| 05/19/1992 | US5114744 Using inks on substrates for conductive patterns, also adhesives in inks |
| 05/19/1992 | US5114642 Process for producing a metal-screened ceramic package |
| 05/19/1992 | US5114609 Cleaning compositions |
| 05/19/1992 | US5114558 Electronics |
| 05/19/1992 | US5114543 Immersion in a chromate bath then forming a nickel copper layer and electrolysis of a copper layer |
| 05/19/1992 | US5114526 Film bonding apparatus |
| 05/19/1992 | US5114518 Method of making multilayer circuit boards having conformal Insulating layers |
| 05/19/1992 | US5113883 Apparatus for cleaning objects with volatile solvents |
| 05/19/1992 | US5113882 Pollution control |
| 05/19/1992 | US5113788 Screen printing machine for through hole printing an electric conductor |
| 05/19/1992 | US5113701 Transport device for boards having a sensitive surface, especially for wet-coated circuit boards |
| 05/19/1992 | US5113579 Method of manufacturing hybrid integrated circuit |
| 05/19/1992 | CA1301272C Electrical connector |
| 05/19/1992 | CA1301107C Process for the production of plastic parts having conductive polymeric coatings by in-mold electrodeposition method |
| 05/19/1992 | CA1300890C Grinding guide and method |
| 05/19/1992 | CA1300889C Biased grinding assembly |
| 05/14/1992 | WO1992008338A1 Stacked configuration for integrated circuit devices |
| 05/14/1992 | WO1992008337A1 A novel method and structure for repairing electrical lines |
| 05/14/1992 | WO1992008246A1 Metal-organic chemical vapor deposition for repairing broken lines in microelectronic packages |
| 05/14/1992 | WO1992007682A1 Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same |
| 05/14/1992 | WO1992007679A1 A method of coating ridged plates, particularly printed circuit boards |
| 05/14/1992 | DE4035526A1 Electronic circuit module for motor vehicle - is based on flexible circuit foil with heat sinking aluminium@ plates |
| 05/13/1992 | EP0485308A1 Manufacturing process of an electronic card with a heat sink. |
| 05/13/1992 | EP0485176A2 Metal thin film having excellent transferability and method of preparing the same |
| 05/13/1992 | EP0485131A1 High density electrical connector |
| 05/13/1992 | EP0484906A2 Head mounting device |
| 05/13/1992 | EP0484808A2 Process and apparatus for selective metallisation |
| 05/13/1992 | EP0484756A2 SMD-type resistor arrangement |
| 05/13/1992 | EP0484731A2 Method of processing an AlN circuit board |
| 05/13/1992 | EP0257058B1 Process for regenerating solder stripping solutions |
| 05/12/1992 | US5113317 Support for auxiliary circuit card |
| 05/12/1992 | US5113315 Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
| 05/12/1992 | US5113168 Single position flat mount fuse holder |
| 05/12/1992 | US5112726 Embedded catalyst receptors for metallization of dielectrics |
| 05/12/1992 | US5112668 Insulated metal substrates and process for the production thereof |
| 05/12/1992 | US5112648 Method of manufacturing a printed circuit board |
| 05/12/1992 | US5112529 Conductive material and process for producing the same |
| 05/12/1992 | US5112517 Solvents for removal of fluxes from integrated circuits as cleaning compounds |
| 05/12/1992 | US5112516 Terpene Alcohol, Surfactant, Water |
| 05/12/1992 | US5112513 Solution and process for etching and activating surfaces of a nonconductive substrate |
| 05/12/1992 | US5112462 Method of making metal-film laminate resistant to delamination |
| 05/12/1992 | US5112448 Forming a multilayer element by applying a dielectric film, patterning and depositing a thin electoplating seed layer and electroplating a film |
| 05/12/1992 | US5112440 Printed circuits |
| 05/12/1992 | US5112434 Method for patterning electroless metal on a substrate followed by reactive ion etching |
| 05/12/1992 | US5112428 Wet lamination process and apparatus |
| 05/12/1992 | US5112425 Manufacture of printed circuit boards from prepregs of reinforcement impregnated with curable resin, copper alkanoate alkali halide |
| 05/12/1992 | US5112262 Apparatus and method for electrical connections of a display device |
| 05/12/1992 | US5112232 Twisted wire jumper electrical interconnector |
| 05/12/1992 | US5111991 Method of soldering components to printed circuit boards |
| 05/12/1992 | US5111743 Screen process printing plate for printing with high precision |
| 05/12/1992 | US5111723 Punch apparatus with positive slug removal |
| 05/12/1992 | US5111573 Device and method of exchanging tools |
| 05/12/1992 | CA1300715C Tag and method of making same |
| 05/12/1992 | CA1300708C Solderless, pushdown connectors for rf and dc |
| 05/10/1992 | CA2054926A1 Enclosure and printed circuit card with heat sink and manufacturing process of such a card |
| 05/07/1992 | DE4136061A1 Test system for PCB(s) - identifies end points of network paths grouped at set distances to reduce number of test points |
| 05/06/1992 | EP0484290A2 A support element for carrying hybrid circuits in a remelting furnace |
| 05/06/1992 | EP0484286A2 An electronic device including an integrated circuit mounted on an insulating base |
| 05/06/1992 | EP0484022A2 Method and apparatus for applying surface treatment to metal foil |
| 05/06/1992 | EP0483979A1 Method for producing printed circuit boards |
| 05/06/1992 | EP0483937A1 Electrolytic cell, process and its use |
| 05/06/1992 | EP0483782A2 Metallising process |
| 05/06/1992 | EP0483699A1 Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| 05/06/1992 | EP0483484A2 Selective metallization process |