Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1992
03/31/1992US5101324 Structure, method of, and apparatus for mounting semiconductor devices
03/31/1992US5101323 Component-connecting device and functional module for the use thereof
03/31/1992US5101177 Voltage controlled oscillator mounted on laminated printed circuit board
03/31/1992US5100767 Epoxy resins
03/31/1992US5100739 Metal sheet, nickel alloy, composite with fluoropolymer particle dispersion
03/31/1992US5100714 Metallized ceramic substrate and method therefor
03/31/1992US5100702 Decomposition of platinum-acetylene complex, electroconductivity
03/31/1992US5100695 Improved adhesion of electroconductive inks, terminal portion has uneven surface, projections or depressions
03/31/1992US5100693 Photolytic deposition of metal from solution onto a substrate
03/31/1992US5100572 Binary azeotropic compositions of polyfluoropentanes and methanol
03/31/1992US5100524 Apparatus for selectively coating part of a member
03/31/1992US5100523 Use of amorphous carbon to promote adhesion between electroactive polymer films and conductive substrates
03/31/1992US5100518 Electrodeposition of copper on polyimide, flexible circuits
03/31/1992US5100499 Copper dry etch process using organic and amine radicals
03/31/1992US5100492 Punching, reinsertion
03/31/1992CA1298087C Automatic grinding machine
03/26/1992DE4119916A1 Automatically controlling film bonding to circuit boards - supplying coating film in controlled cycle for accurate location on both sides of board
03/26/1992DE4030055A1 Verfahren zum herstellen einer schaltung A method of making a circuit
03/26/1992DE4029666A1 Partly casing electrical component - by standing lower part of component, e.g. coil, vertically in trough, encapsulating in cast resin and cooling resin to set
03/25/1992EP0477004A2 Multi-layer wiring board
03/25/1992EP0476954A1 Method for preparing green sheets
03/25/1992EP0476912A2 Electronic device manipulating apparatus and method
03/25/1992EP0476898A2 Circuit board and process for producing the same
03/25/1992EP0476868A1 Three-dimensional electroformed circuitry
03/25/1992EP0476867A1 Method using a permanent mandrel for manufacture of electrical circuitry
03/25/1992EP0476856A1 Method of forming electrode pattern
03/25/1992EP0476837A1 An automatic optical exposing apparatus
03/25/1992EP0476821A2 Reduction or elimination of film defects due to hydrogen evolution during cathodic electrodeposition
03/25/1992EP0476752A1 Process and apparatus for resin impregnation of a fibrous substrate
03/25/1992EP0476734A1 Dispersion strengthened lead-tin alloy solder
03/25/1992EP0476589A2 Multi-layer wiring substrate and production thereof
03/25/1992EP0476355A1 Transportation protection and insertion device for multiconductor cables
03/25/1992EP0476332A2 Process for surface treatment of liquid crystal polymer articles
03/25/1992EP0476320A1 Process for manufacturing conductive structures in thick film technique
03/25/1992EP0476065A1 Method for improving the insulation resistance of printed circuits.
03/25/1992EP0476029A1 Method for cutting printed boards for examination of the plating result on the walls in holes arranged in the board.
03/25/1992CN1015996B Process and apparatus for coating metal on products
03/24/1992USRE33859 Hermetically sealed electronic component
03/24/1992US5099396 Electronic circuit configured for indicator case
03/24/1992US5099395 Circuit board for mounting electronic components
03/24/1992US5099393 Electronic package for high density applications
03/24/1992US5099392 Tape-automated bonding frame adapter system
03/24/1992US5099388 Alumina multilayer wiring substrate provided with high dielectric material layer
03/24/1992US5099219 Fusible flexible printed circuit and method of making same
03/24/1992US5099100 Plasma etching device and process
03/24/1992US5099090 Circuit writer
03/24/1992US5099007 Light-sensitive quinone diazide compound containing an alkylimidazole group and method of forming a photoresist using said compound
03/24/1992US5098863 Method of stabilizing lead dimensions on high pin count surface mount I.C. packages
03/24/1992US5098815 Process for the production of dielectric layers in planar circuits on ceramics substrates
03/24/1992US5098802 Battery terminal device
03/24/1992US5098796 Chromium-zinc anti-tarnish coating on copper foil
03/24/1992US5098769 Two-shot molded article for use in circuit formation
03/24/1992US5098766 Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins
03/24/1992US5098534 Succinimide and phthalimide with alkali metal hydroxide for stripping silver
03/24/1992US5098533 Multilayer electronic element formed by drilling a hole, immersion in an aqueous nitrate solution and electrolysis
03/24/1992US5098527 Method of making electrically conductive patterns
03/24/1992US5098526 Process for preparation of a seed layer for selective metal deposition
03/24/1992US5098305 Memory metal electrical connector
03/24/1992US5098008 Fine pitch leaded component placement process
03/24/1992US5097593 Method of forming a hybrid printed circuit board
03/24/1992US5097592 Method of making molded electrical interconnection system
03/24/1992CA1297998C Interconnection system for integrated circuit chips
03/22/1992CA2051775A1 Polyimide film with metal salt coating resulting in improved adhesion
03/21/1992CA2047552A1 Elimination of film defects due to hydrogen evolution during cathodic electrodeposition
03/19/1992WO1992004811A1 Flexible printed circuit board and its manufacturing
03/19/1992WO1992004396A1 Photogenerated conducting organic polymers
03/19/1992DE4029232A1 Connection plate for installation switches, plugs, etc. - provides stamped sheet metal conductor paths for connecting similar electrical terminals to one another
03/19/1992DE4028978A1 Solder contact element for PCB - has reception zone for lead of SMD and through contact
03/18/1992EP0475655A2 Anisotropic conductive adhesive compositions
03/18/1992EP0475596A1 Methods for cleaning articles
03/18/1992EP0475567A2 Method for fabricating printed circuits
03/18/1992EP0475565A2 Electronic circuits and a method for their manufacture by means of ultrasonic welding
03/18/1992EP0475402A2 Liquid crystal apparatus
03/18/1992EP0475321A2 Epoxy resin film and method of producing it
03/18/1992EP0475287A2 Process for defined etching of substrates
03/18/1992EP0475153A1 Borate coinitiators for photopolymerizable compositions
03/18/1992EP0475145A1 Metal-film laminate resistant to delamination
03/18/1992CN2099430U Improved fonning machine for electronic parts
03/18/1992CN1015952B Embedded catalyst receptors for metallization of dielectrics
03/18/1992CA2051464A1 Process and apparatus for resin impregnation of a fibrous substrate
03/18/1992CA2051272A1 Method for preparing green sheets
03/17/1992US5097393 Multilayer interconnect device and method of manufacture thereof
03/17/1992US5097390 Printed circuit and fabrication of same
03/17/1992US5097247 Heat actuated fuse apparatus with solder link
03/17/1992US5097101 Method of forming a conductive contact bump on a flexible substrate and a flexible substrate
03/17/1992US5096998 Unsaturated imide end groups, multilayer flexible metal-clad laminates
03/17/1992US5096802 Positive photoresist treatment during photolithography to reduce feature size, heating to cause flow, uv radiation to stabilize
03/17/1992US5096800 Resin composition for forming durable protection coating and process for forming durable protection coating on substrate
03/17/1992US5096790 Process of forming hologram and polymeric holographic recording medium with sensitizer
03/17/1992US5096788 Weldless battery pack
03/17/1992US5096749 Method of producing a metallization layer structure
03/17/1992US5096737 Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal thin films
03/17/1992US5096546 Process for treating surface of copper foil
03/17/1992US5096522 Process for producing copper-clad laminate
03/17/1992US5096504 Cleaning agent for rosin-base solder flux
03/17/1992US5096440 Surface mount connector with circuit board retaining plate
03/17/1992US5096428 Header device
03/17/1992US5096427 Socket and header electrical connector assembly
03/17/1992US5096426 Connector arrangement system and interconnect element
03/17/1992US5096425 Pin-shaped or flat-plate-shaped parallel terminals of an electronic or piezoelectric component for being inserted in a printed circuit board