Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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03/31/1992 | US5101324 Structure, method of, and apparatus for mounting semiconductor devices |
03/31/1992 | US5101323 Component-connecting device and functional module for the use thereof |
03/31/1992 | US5101177 Voltage controlled oscillator mounted on laminated printed circuit board |
03/31/1992 | US5100767 Epoxy resins |
03/31/1992 | US5100739 Metal sheet, nickel alloy, composite with fluoropolymer particle dispersion |
03/31/1992 | US5100714 Metallized ceramic substrate and method therefor |
03/31/1992 | US5100702 Decomposition of platinum-acetylene complex, electroconductivity |
03/31/1992 | US5100695 Improved adhesion of electroconductive inks, terminal portion has uneven surface, projections or depressions |
03/31/1992 | US5100693 Photolytic deposition of metal from solution onto a substrate |
03/31/1992 | US5100572 Binary azeotropic compositions of polyfluoropentanes and methanol |
03/31/1992 | US5100524 Apparatus for selectively coating part of a member |
03/31/1992 | US5100523 Use of amorphous carbon to promote adhesion between electroactive polymer films and conductive substrates |
03/31/1992 | US5100518 Electrodeposition of copper on polyimide, flexible circuits |
03/31/1992 | US5100499 Copper dry etch process using organic and amine radicals |
03/31/1992 | US5100492 Punching, reinsertion |
03/31/1992 | CA1298087C Automatic grinding machine |
03/26/1992 | DE4119916A1 Automatically controlling film bonding to circuit boards - supplying coating film in controlled cycle for accurate location on both sides of board |
03/26/1992 | DE4030055A1 Verfahren zum herstellen einer schaltung A method of making a circuit |
03/26/1992 | DE4029666A1 Partly casing electrical component - by standing lower part of component, e.g. coil, vertically in trough, encapsulating in cast resin and cooling resin to set |
03/25/1992 | EP0477004A2 Multi-layer wiring board |
03/25/1992 | EP0476954A1 Method for preparing green sheets |
03/25/1992 | EP0476912A2 Electronic device manipulating apparatus and method |
03/25/1992 | EP0476898A2 Circuit board and process for producing the same |
03/25/1992 | EP0476868A1 Three-dimensional electroformed circuitry |
03/25/1992 | EP0476867A1 Method using a permanent mandrel for manufacture of electrical circuitry |
03/25/1992 | EP0476856A1 Method of forming electrode pattern |
03/25/1992 | EP0476837A1 An automatic optical exposing apparatus |
03/25/1992 | EP0476821A2 Reduction or elimination of film defects due to hydrogen evolution during cathodic electrodeposition |
03/25/1992 | EP0476752A1 Process and apparatus for resin impregnation of a fibrous substrate |
03/25/1992 | EP0476734A1 Dispersion strengthened lead-tin alloy solder |
03/25/1992 | EP0476589A2 Multi-layer wiring substrate and production thereof |
03/25/1992 | EP0476355A1 Transportation protection and insertion device for multiconductor cables |
03/25/1992 | EP0476332A2 Process for surface treatment of liquid crystal polymer articles |
03/25/1992 | EP0476320A1 Process for manufacturing conductive structures in thick film technique |
03/25/1992 | EP0476065A1 Method for improving the insulation resistance of printed circuits. |
03/25/1992 | EP0476029A1 Method for cutting printed boards for examination of the plating result on the walls in holes arranged in the board. |
03/25/1992 | CN1015996B Process and apparatus for coating metal on products |
03/24/1992 | USRE33859 Hermetically sealed electronic component |
03/24/1992 | US5099396 Electronic circuit configured for indicator case |
03/24/1992 | US5099395 Circuit board for mounting electronic components |
03/24/1992 | US5099393 Electronic package for high density applications |
03/24/1992 | US5099392 Tape-automated bonding frame adapter system |
03/24/1992 | US5099388 Alumina multilayer wiring substrate provided with high dielectric material layer |
03/24/1992 | US5099219 Fusible flexible printed circuit and method of making same |
03/24/1992 | US5099100 Plasma etching device and process |
03/24/1992 | US5099090 Circuit writer |
03/24/1992 | US5099007 Light-sensitive quinone diazide compound containing an alkylimidazole group and method of forming a photoresist using said compound |
03/24/1992 | US5098863 Method of stabilizing lead dimensions on high pin count surface mount I.C. packages |
03/24/1992 | US5098815 Process for the production of dielectric layers in planar circuits on ceramics substrates |
03/24/1992 | US5098802 Battery terminal device |
03/24/1992 | US5098796 Chromium-zinc anti-tarnish coating on copper foil |
03/24/1992 | US5098769 Two-shot molded article for use in circuit formation |
03/24/1992 | US5098766 Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins |
03/24/1992 | US5098534 Succinimide and phthalimide with alkali metal hydroxide for stripping silver |
03/24/1992 | US5098533 Multilayer electronic element formed by drilling a hole, immersion in an aqueous nitrate solution and electrolysis |
03/24/1992 | US5098527 Method of making electrically conductive patterns |
03/24/1992 | US5098526 Process for preparation of a seed layer for selective metal deposition |
03/24/1992 | US5098305 Memory metal electrical connector |
03/24/1992 | US5098008 Fine pitch leaded component placement process |
03/24/1992 | US5097593 Method of forming a hybrid printed circuit board |
03/24/1992 | US5097592 Method of making molded electrical interconnection system |
03/24/1992 | CA1297998C Interconnection system for integrated circuit chips |
03/22/1992 | CA2051775A1 Polyimide film with metal salt coating resulting in improved adhesion |
03/21/1992 | CA2047552A1 Elimination of film defects due to hydrogen evolution during cathodic electrodeposition |
03/19/1992 | WO1992004811A1 Flexible printed circuit board and its manufacturing |
03/19/1992 | WO1992004396A1 Photogenerated conducting organic polymers |
03/19/1992 | DE4029232A1 Connection plate for installation switches, plugs, etc. - provides stamped sheet metal conductor paths for connecting similar electrical terminals to one another |
03/19/1992 | DE4028978A1 Solder contact element for PCB - has reception zone for lead of SMD and through contact |
03/18/1992 | EP0475655A2 Anisotropic conductive adhesive compositions |
03/18/1992 | EP0475596A1 Methods for cleaning articles |
03/18/1992 | EP0475567A2 Method for fabricating printed circuits |
03/18/1992 | EP0475565A2 Electronic circuits and a method for their manufacture by means of ultrasonic welding |
03/18/1992 | EP0475402A2 Liquid crystal apparatus |
03/18/1992 | EP0475321A2 Epoxy resin film and method of producing it |
03/18/1992 | EP0475287A2 Process for defined etching of substrates |
03/18/1992 | EP0475153A1 Borate coinitiators for photopolymerizable compositions |
03/18/1992 | EP0475145A1 Metal-film laminate resistant to delamination |
03/18/1992 | CN2099430U Improved fonning machine for electronic parts |
03/18/1992 | CN1015952B Embedded catalyst receptors for metallization of dielectrics |
03/18/1992 | CA2051464A1 Process and apparatus for resin impregnation of a fibrous substrate |
03/18/1992 | CA2051272A1 Method for preparing green sheets |
03/17/1992 | US5097393 Multilayer interconnect device and method of manufacture thereof |
03/17/1992 | US5097390 Printed circuit and fabrication of same |
03/17/1992 | US5097247 Heat actuated fuse apparatus with solder link |
03/17/1992 | US5097101 Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
03/17/1992 | US5096998 Unsaturated imide end groups, multilayer flexible metal-clad laminates |
03/17/1992 | US5096802 Positive photoresist treatment during photolithography to reduce feature size, heating to cause flow, uv radiation to stabilize |
03/17/1992 | US5096800 Resin composition for forming durable protection coating and process for forming durable protection coating on substrate |
03/17/1992 | US5096790 Process of forming hologram and polymeric holographic recording medium with sensitizer |
03/17/1992 | US5096788 Weldless battery pack |
03/17/1992 | US5096749 Method of producing a metallization layer structure |
03/17/1992 | US5096737 Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal thin films |
03/17/1992 | US5096546 Process for treating surface of copper foil |
03/17/1992 | US5096522 Process for producing copper-clad laminate |
03/17/1992 | US5096504 Cleaning agent for rosin-base solder flux |
03/17/1992 | US5096440 Surface mount connector with circuit board retaining plate |
03/17/1992 | US5096428 Header device |
03/17/1992 | US5096427 Socket and header electrical connector assembly |
03/17/1992 | US5096426 Connector arrangement system and interconnect element |
03/17/1992 | US5096425 Pin-shaped or flat-plate-shaped parallel terminals of an electronic or piezoelectric component for being inserted in a printed circuit board |