| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/18/1992 | US5139813 Exposing coated surface to active plasma, then exposure to controlled-wave length light for detection of pinholes |
| 08/18/1992 | US5139642 Process for preparing a nonconductive substrate for electroplating |
| 08/18/1992 | US5139636 Stabilization of rising currents, uniform plating |
| 08/18/1992 | US5139448 Solder-bearing lead |
| 08/18/1992 | US5139376 Method and apparatus for controlled penetration drilling |
| 08/18/1992 | US5139193 Fluxless resoldering system and fluxless soldering process |
| 08/18/1992 | CA1306409C Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
| 08/16/1992 | CA2061262A1 Electrical flat blade connection |
| 08/15/1992 | WO1992014864A2 Selective demetallization method and apparatus and products obtained by this method |
| 08/14/1992 | CA2060838A1 Lanced hold-downs |
| 08/13/1992 | DE4103834A1 Circuit board mfr. by channelling into metallic coating - using laser beam brightness variation in conjunction with orthogonal movements of table under process computer control |
| 08/13/1992 | DE4103294A1 Electrically conductive vias through ceramic substrates - are made by drawing metal from tracks into holes by capillary action using filling of holes by suitable powder |
| 08/12/1992 | WO1992014261A1 Multichip module and integrated circuit substrates having planarized patterned surfaces |
| 08/12/1992 | EP0498713A2 Process of mounting miniature electronic components with solderable leads on a flexible substrate |
| 08/12/1992 | EP0498677A2 Improvement in or relating to a printed-circuit board |
| 08/12/1992 | EP0498462A2 Method and apparatus for inspecting wiring pattern on printed board |
| 08/12/1992 | EP0498314A2 Cad apparatus for designing pattern of electric circuit |
| 08/12/1992 | EP0498274A2 Electrolytic method for forming vias and through holes in copper-invar-copper core structures |
| 08/12/1992 | EP0498258A1 Micro multilayer wiring |
| 08/12/1992 | EP0498250A1 Etching method for increased circuitized line width unitformity |
| 08/12/1992 | EP0498139A1 Method and device for coating plates |
| 08/12/1992 | EP0498043A2 Printed circuit board comprising rigid and flexible parts and process for manufacturing the same |
| 08/12/1992 | EP0497948A1 Method and device for hermetic encapsulation of electronic components. |
| 08/12/1992 | EP0497925A1 Method for printed circuit board pattern making using selectively etchable metal layers. |
| 08/12/1992 | EP0497896A1 Non-photographic method for patterning organic polymer films. |
| 08/12/1992 | EP0497871A1 Method of manufacturing a multilayered circuit board |
| 08/12/1992 | EP0417239A4 Method of forming contact bumps in contact pads |
| 08/12/1992 | EP0413689B1 Wavesoldering device |
| 08/12/1992 | CN1017790B Transfer for automatic application |
| 08/12/1992 | CA2101426A1 Multichip module and integrated circuit substrates having planarized patterned surfaces |
| 08/11/1992 | US5138438 Lead connections means for stacked tab packaged IC chips |
| 08/11/1992 | US5138429 Precisely aligned lead frame using registration traces and pads |
| 08/11/1992 | US5138116 Mounting device for electronic component |
| 08/11/1992 | US5137936 Method for packaging electronic parts and adhesive for use in said method |
| 08/11/1992 | US5137791 Metal-film laminate resistant to delamination |
| 08/11/1992 | US5137780 Crosslinked layers of glow discharge polymers from methane, ethane, propane, ethylene, propylene and substituted hydrocarbons; integrated circuits, electrical apparatus |
| 08/11/1992 | US5137751 Process for making thick multilayers of polyimide |
| 08/11/1992 | US5137618 Methods for manufacture of multilayer circuit boards |
| 08/11/1992 | US5137597 Fabrication of metal pillars in an electronic component using polishing |
| 08/11/1992 | US5137461 Separable electrical connection technology |
| 08/11/1992 | US5137454 Surface-mount solder-tail terminal member |
| 08/11/1992 | US5137245 Device for fastening electronic components in PC board |
| 08/11/1992 | US5136973 Process and device for electrostatically spraying a liquid coating onto a substrate and for drying the liquid coating on the substrate |
| 08/11/1992 | US5136779 Method of mounting lead frame on substrate |
| 08/09/1992 | CA2060840A1 Printed-circuit board |
| 08/06/1992 | WO1992013435A1 Manufacturing multilayer ceramic substrate |
| 08/06/1992 | WO1992012875A1 Housing for motor vehicle electronics |
| 08/05/1992 | EP0497481A2 Water-soluble soldering paste |
| 08/05/1992 | EP0497473A1 Integral edge connection of circuit cards |
| 08/05/1992 | EP0497286A2 Gold plating bath additives for copper circuitization on polyimide printed circuit boards |
| 08/05/1992 | EP0497180A2 Laser ablation damascene process |
| 08/05/1992 | EP0497042A2 Process and programmable computer controlled system for electroless copper plating |
| 08/05/1992 | EP0496899A1 Method for cleaning |
| 08/05/1992 | EP0438504A4 High density and high signal integrity connector |
| 08/05/1992 | CN1063395A Non-chemical plating hole metallizing process-hole blackening method |
| 08/04/1992 | US5136470 Printed circuit board vibration stiffener |
| 08/04/1992 | US5136366 Overmolded semiconductor package with anchoring means |
| 08/04/1992 | US5136365 Anisotropic conductive adhesive and encapsulant material |
| 08/04/1992 | US5136360 Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals |
| 08/04/1992 | US5136124 Method of forming conductors within an insulating substrate |
| 08/04/1992 | US5136123 Multilayer circuit board |
| 08/04/1992 | US5136122 Braided fiber omega connector |
| 08/04/1992 | US5136120 Technique for reducing electromagnetic interference |
| 08/04/1992 | US5135815 Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| 08/04/1992 | US5135779 Producing reversible redox sites on polyimide; contact with metal salts to form elemental metal; electron transfer; photoresists |
| 08/04/1992 | US5135676 Cleaning compositions formed of hydrogen-containing fluorochlorohydrocarbons and partially fluorinated alkanols |
| 08/04/1992 | US5135595 Process for fabricating a low dielectric composite substrate |
| 08/04/1992 | US5135574 Mixture of methane sulfonic acid and at least one of the ester of 1-hydroxyethane-1,1-diphosphoric acid and a salt thereof |
| 08/04/1992 | US5135556 Method for making fused high density multi-layer integrated circuit module |
| 08/04/1992 | US5135403 Solderless spring socket for printed circuit board |
| 08/04/1992 | CA1306019C Controlled depth laser drilling system |
| 08/01/1992 | CA2052931A1 Process and programmable computer controlled system for electroless copper plating |
| 07/30/1992 | DE4102441A1 Ceramic-filled fluoro-polymer compsn. for electrical substrates - with silanised filler present to give improved flow properties, e.g. into through-holes |
| 07/30/1992 | DE4102349A1 Control appts. for current circuit monitoring - involves housing with inlet side covered by baseplate with pin contacts forming part of at least one stamp grid |
| 07/30/1992 | DE4102265A1 Gehaeuse kfz-elektronik Enclosures fcc electronics |
| 07/29/1992 | EP0496698A2 Flexible laminates |
| 07/29/1992 | EP0496581A1 A soldering apparatus |
| 07/29/1992 | EP0496554A1 Electrodeposition method |
| 07/29/1992 | EP0496491A1 Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same |
| 07/29/1992 | EP0496372A2 Process for coating a non-noble metal with a noble metal |
| 07/29/1992 | EP0496365A1 Compositions for the production of seed layers |
| 07/29/1992 | EP0496364A1 Composition for the production of seed layers |
| 07/29/1992 | EP0496334A1 A flexible base laminated with metal on both the surfaces and a process for producing same |
| 07/29/1992 | EP0340275B1 Vapour phase process and apparatus |
| 07/29/1992 | CN1017607B Polymeric films and its preparation |
| 07/28/1992 | US5134665 Apparatus and method of inspecting solder printing |
| 07/28/1992 | US5134664 Customized alignment for PCB assembly |
| 07/28/1992 | US5134461 Nickel alloy layer prevents diffusion of nickel into gold layer |
| 07/28/1992 | US5134094 Single inline packaged solid state relay with high current density capability |
| 07/28/1992 | US5134056 Multilayer element of positive photoresist covering a solder resist, exposure and removal |
| 07/28/1992 | US5134054 Positive-type photosensitive electrodeposition coating composition and process for producing circuit plate |
| 07/28/1992 | US5134029 Thermoconductivity, layers of lead oxide and bismuth oxide, aluminum nitride, alumina, silicon dioxide |
| 07/28/1992 | US5133840 Surface midification of a polyimide |
| 07/28/1992 | US5133673 Connecting element |
| 07/28/1992 | US5133669 Circuit board pins |
| 07/28/1992 | US5133495 Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween |
| 07/28/1992 | US5133120 Method of filling conductive material into through holes of printed wiring board |
| 07/28/1992 | US5133119 Shearing stress interconnection apparatus and method |
| 07/28/1992 | US5133118 Surface mounted components on flex circuits |
| 07/26/1992 | CA2059892A1 Compositions for the production of seed layers |